Controllable asymmetric doping potential barrier nano silicon based luminous device and method for producing the same
A light-emitting device, nano-silicon technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as carrier injection imbalance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0053] The controllable asymmetric doped barrier nano-silicon light-emitting device in this embodiment uses Al / P-doped a-SiO 2 / nc-Si / B-doped a-SiCx / p-type Si device structure, the preparation process is as follows:
[0054] The first step is to prepare a multi-layer film with a quantum well structure by using plasma-enhanced chemical vapor deposition (PECVD) technology
[0055] 1-1. Preparation of boron-doped hydrogenated amorphous silicon carbide (B-doped a-SiCx:H) film as a barrier layer: using a flat capacitive RF plasma-enhanced chemical vapor deposition (PECVD) system, the substrate is placed in the reaction On the metal anode plate grounded in the chamber, silane (SiH 4 ), methane (CH 4 ) and borane (B 2 h 6 ) (borane diluted with hydrogen, with a concentration of 1%) as a reactive gas source, to deposit a boron-doped a-SiCx:H film with a thickness of no more than 10 nm (for example, 0.2-10 nm). During deposition, the gas flow ratio is preferably SiH 4 :CH 4 :B ...
Embodiment 2
[0069] The controllable asymmetric doped barrier nano-silicon-based light-emitting device and its preparation method in this embodiment use ITO (indium tin oxide) / B-doped a-SiCx / nc-Si / P-dopeda-SiO 2 / n-type Si device structure, the implementation process is as follows:
[0070] The first step, using plasma enhanced chemical vapor deposition (PECVD) technology to prepare multilayer films with quantum well structure
[0071] 1-1. Preparation of phosphorous hydrogenated amorphous silicon (P-doped a-Si:H) thin film: using a flat capacitive radio frequency plasma enhanced chemical vapor deposition (PECVD) system, the n-type substrate is placed in a grounded reaction chamber On the metal anode plate, silane (SiH 4 ) and phosphine (PH 3 ) (phosphine diluted with hydrogen, the concentration is 1%) as a reaction gas source, continue to deposit a 0.1-5nm thick phosphorus-doped hydrogenated amorphous silicon film on the hydrogenated amorphous silicon (a-Si:H) film . During deposition...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com