Heat conductive insulation material and preparation method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- KINGFA SCI & TECH CO LTD
- Publication Date
- 2010-12-01
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The invention relates to the technical field of engineering plastics, and relates to a thermally conductive insulating material and a preparation method thereof. Background technique
[0002] With the rapid development of microelectronic integration technology and assembly technology, the volume of electronic components and logic circuits is getting smaller and smaller, while the operating frequency is increasing sharply. At this time, the heat generated by electronic equipment is rapidly accumulating and increasing. , in order to ensure the normal operation of electronic components with high reliability for a long time, the ability to dissipate heat in time becomes an important limiting factor affecting their service life, so it is urgent to develop insulating materials with high thermal conductivity.
[0003] Traditional heat-conducting materials generally use aluminum or ceramic materials, but these materials are difficult to process, expensive, and...