Heat conductive insulation material and preparation method thereof

Abstract

The invention discloses a heat conductive insulation material and a preparation method thereof. The heat conductive insulation material comprises the following components in percentage by weight: 15 to 50 percent of plastic substrate, 15 to 45 percent of heat conductive insulation filler A, 5 to 15 percent of heat conductive filler B, 10 to 30 percent of mineral fiber C, 0 to 2 percent of coupling agent and 0 to 2 percent of lubricant. The heat conductive insulation material has the advantages of perfect forming processing performance, high heat conductivity, higher uniformity and a small amount of gas content during processing; heat conductive fillers with different length-diameter ratios are combined, fillers with a large length-diameter ratio are arranged in melt flowing direction, and fillers with a small length-diameter ratio fill gaps left when the fillers with the large length-diameter ratio are arranged, so that the number of interfaces among filler components is greatly reduced, a conduction network is formed more easily, and heat conductivity is remarkably increased; moreover, the mineral fiber is added during the second machining process, so that the loss of material performance can be compensated due to the addition of high-powder fillers, and performance is better.

Description

technical field [0001] The invention relates to the technical field of engineering plastics, and relates to a thermally conductive insulating material and a preparation method thereof. Background technique [0002] With the rapid development of microelectronic integration technology and assembly technology, the volume of electronic components and logic circuits is getting smaller and smaller, while the operating frequency is increasing sharply. At this time, the heat generated by electronic equipment is rapidly accumulating and increasing. , in order to ensure the normal operation of electronic components with high reliability for a long time, the ability to dissipate heat in time becomes an important limiting factor affecting their service life, so it is urgent to develop insulating materials with high thermal conductivity. [0003] Traditional heat-conducting materials generally use aluminum or ceramic materials, but these materials are difficult to process, expensive, and...

AI Technical Summary

Problems solved by technology

Patent CN 1333801A introduces a method for improving the thermal conductivity of polymer composite materials, which uses high aspect ratio carbon fiber and low aspect ratio powder filler to compound according to a certain ratio, and can obtain the highest thermal conductivity of 25W/m.K. Molecular composite materials, but whether the material is conductive or not is not considered in the design process, and its polymer matrix is ​​also limited to LCP (liquid crystal polymer);