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A kind of method for preparing iron-nickel-phosphorus electroless coating

An electroless coating, iron-nickel-phosphorus technology, applied in the field of chemical deposition, can solve the problems of poor bonding between the coating and the substrate, low iron content in the coating, difficulty in obtaining a coating with a uniform thickness and composition, and achieve an increase in iron reduction speed, iron The effect of increasing the content and inhibiting the reduction rate of nickel

Inactive Publication Date: 2012-02-08
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a new method for preparing the iron-nickel-phosphorus electroless coating, which solves the problems of low iron content in the coating, poor bonding between the coating and the substrate, difficulty in obtaining a coating with uniform thickness and composition, and the like. Especially suitable for preparing iron-nickel-phosphorus electroless plating with high iron content on the surface of silicon chips and copper

Method used

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  • A kind of method for preparing iron-nickel-phosphorus electroless coating
  • A kind of method for preparing iron-nickel-phosphorus electroless coating
  • A kind of method for preparing iron-nickel-phosphorus electroless coating

Examples

Experimental program
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Effect test

Embodiment 1

[0033] The 10×10×1.5mm silicon chip is put into the prepared chemical plating solution of the invention after degreasing, hydrofluoric acid and nitric acid mixed solution to remove the oxide film, and palladium chloride activation treatment. The plating solution is composed of KNaC 4 h 4 o 6 4H 2O 60-80g / L, disodium edetate 2-6g / L, diethylenetriaminepentaacetic acid 2-6g / L, NaH 2 PO 2 10-15g / L, boric acid 5g / L, sodium dodecylsulfonate 0.04g / L, NH 3 ·H 2 O 90-110mL / L; in solution, Fe 2+ Added in the form of ferrous ammonium sulfate, Ni 2+ Add in the form of nickel sulfate, the total molar concentration of ferrous ammonium sulfate and nickel sulfate is 0.08-0.10mol / L, Fe 2+ / Ni 2+ The molar ratio is 4 / 1.

[0034] Cover the plating solution with xylene, put it in a water bath at 60°C, and react for 1 hour, the thickness of the coating is about 7-10 μm, and the surface appearance of the coating is as follows: figure 1 As shown, the coating chemical composition is as f...

Embodiment 2

[0036] The 10×10×1.5mm silicon chip is put into the prepared plating solution of the invention after degreasing, hydrofluoric acid nitric acid mixed solution to remove the oxide film, and palladium chloride activation treatment. The plating solution is composed of: KNaC 4 h 4 o 6 4H 2 O 60-80g / L, disodium edetate 2-4g / L, diethylenetriaminepentaacetic acid 2-4g / L, NaH 2 PO 2 10-15g / L, boric acid 5-8g / L, sodium dodecylsulfonate 0.04g / L, NH 3 ·H 2 O 90-110mL / L; in solution, Fe 2+ Added in the form of ferrous ammonium sulfate, Ni 2+ Add in the form of nickel sulfate, the total molar concentration of ferrous ammonium sulfate and nickel sulfate is 0.06-0.08mol / L, Fe 2+ / Ni 2+ The molar ratio is 4 / 1.

[0037] Cover the plating solution with xylene, put it in a water bath at 90° C., and react for 30 minutes. The thickness of the coating is about 6 μm, and the composition of the obtained coating is: 71.90Ni23.32Fe4.78P (atomic percent).

Embodiment 3

[0039] The 10×10×1.5mm silicon chip is put into the prepared plating solution of the invention after degreasing, hydrofluoric acid nitric acid mixed solution to remove the oxide film, and palladium chloride activation treatment. The plating solution is composed of: KNaC 4 h 4 o 6 4H 2 O 60-80g / L, glycamino acid 2-4g / L, iminoacetic acid 2-4g / L, NaH 2 PO 2 10-15g / L, boric acid 5-8g / L, sodium dodecylsulfonate 0.04g / L, NH 3 ·H 2 O 90-110mL / L; in solution, Fe 2+ Added in the form of ferrous ammonium sulfate, Ni 2+ Add in the form of nickel sulfate, the total molar concentration of ferrous ammonium sulfate and nickel sulfate is 0.10-0.12mol / L, Fe 2+ / Ni 2+ The molar ratio is 9 / 1.

[0040] Cover the plating solution with xylene, put it in a water bath at 70° C., and react for 30 minutes. The thickness of the coating is about 5 μm, and the composition of the obtained coating is: 68.44Ni13.95Fe17.61P (atomic percent).

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Abstract

The invention belongs to the technical field of chemical deposition, and specifically relates to a new method for preparing an iron-nickel-phosphorus chemical coating, which can be widely used in (micro)electronic industry, aerospace and general engineering. The method controls the concentration of free Fe2+ ions and Ni2+ ions in the solution through a complex complex system composed of potassium sodium tartrate, trisodium citrate, two organic mixed additives with -N(CH2COOH)2 groups, and ammonia water, and inhibits nickel The reduction speed and at the same time increase the iron reduction speed, thereby increasing the iron content in the coating. The complex complex system can complex with impurity ions and increase the concentration of metal impurity ions that the solution can accommodate. It is especially suitable for preparing high iron on silicon chips and copper surfaces. content of iron-nickel-phosphorus electroless plating. The composition of the coating obtained on the surface of the silicon wafer is: the atomic percentage of iron is 0-50% controllable, the percentage of phosphorus atomic is 2-18%, and the balance is nickel; the atomic percentage of iron obtained on the surface of the copper sheet It is controllable from 0-90%, the atomic percentage of phosphorus is 2-16%, and the balance is nickel.

Description

technical field [0001] The invention belongs to the technical field of chemical deposition, and specifically relates to a new method for preparing an iron-nickel-phosphorus chemical coating, which can be widely used in (micro)electronic industry, aerospace and general engineering. Background technique [0002] Iron-nickel alloy has excellent soft magnetism, weldability and low thermal expansion coefficient, and its thermal expansion coefficient can be adjusted by changing the coating composition to achieve thermal matching with various materials (especially silicon chips); in addition, the iron-nickel-phosphorus coating The interfacial reaction rate with tin-based solder is lower than that of nickel-phosphorus plating. Based on these characteristics, the Fe-Ni coating has broad application prospects in (micro) electronics industry, aerospace and general engineering. Because the electroless plating technology has the characteristics of low cost, environmental protection, sim...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/34C23C18/36
Inventor 周海飞郭敬东尚建库
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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