Method for directly depositing metal line patterns based on screen printing method

Abstract

The invention discloses a method for directly depositing metal line patterns based on a screen printing method. The method is characterized by implanting ions after selectively carrying out surface molecule modification treatment on a polyimide film substrate in fixed point through the mode of screen printing inert ink patterns; importing metal ions serving as reduced precursors; and obtaining the needed metal patterns through metal reduction and deposition. The method has the following beneficial effects: 1. the method is a novel method by which the needed metal lines can be directly formed on the polyimide film; the method is simple and convenient; the existing production equipment can directly apply the method to produce the metal lines, without additionally purchasing equipment, so the method is easy to popularize and use; 2. the fixed input is low and the production period is short, so the method is easy for large-scale production; and 3. no toxic or harmful gases are generated, so the method is environment-friendly, and the energy consumption is low, so the method conforms to the requirement for low-carbon production.

Description

technical field [0001] The invention belongs to the technical field of modern microelectronics, in particular to a method for directly depositing metal circuit patterns based on a screen printing method. Background technique [0002] Patterning metal circuits on insulating substrates is a very important step in the production of electronic, optical, and mechanical devices such as displays, biosensors, etc. The current mature method of preparing patterned metal circuits is usually to obtain the corresponding pattern on the metal film coated by vacuum evaporation, sputtering, electroplating or electroless plating deposition by photolithography, electron beam exposure, focused ion beam exposure and other technologies. pattern and then etched. [0003] However, with the development of microelectronics and semiconductor technology, microelectronic devices, especially the future generation of large-scale integrated electronic devices, are further developed in the direction of min...

AI Technical Summary

Problems solved by technology

However, there are still various defects in these methods, and the laser irradiation will cause the decomposition of the polyimide substrate; and the commonly used preparation procedures are subject to high production costs: such as coating a resist coating and then On the one hand, the etching process has to go through many tedious photolithographic printing steps, and on the other hand, it also consumes a lot of energy