Method for directly depositing metal line patterns based on screen printing method

A metal circuit pattern, screen printing technology, applied in metal material coating process, circuit, liquid chemical plating and other directions, can solve the problems of high production cost, high energy consumption, decomposition of polyimide substrate, etc. The effect of short production cycle, low energy consumption and low fixed investment

Inactive Publication Date: 2011-06-29
GUANGXI TEACHERS EDUCATION UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still various defects in these methods, and the laser irradiation will cause the decomposition of the polyimide substrate; and the commonly used preparation procedures are subject to high produ

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0021] Example 1

[0022] 1. Use alkali-resistant ink to screen print the negative phase pattern of the required metal circuit on the surface of the polyimide film, and dry at 60°C for 30 minutes.

[0023] 2. Modify the surface of the printed polyimide film: apply 5mol / L KOH solution to the surface of the film, let it stand for 10 minutes, and rinse it off with deionized water.

[0024] 3. Perform ion exchange on the surface of the modified film: place the above film at 50℃, 0.5mol / L CuSO 4 Soak in the solution for 20 minutes.

[0025] 4. Metal reduction: immerse the above film in a 0.1mol / L dimethylaminoborane solution at 50°C and take it out after 10 minutes to obtain a metal copper circuit pattern.

[0026] 5. Thicken the metal circuit: The metal circuit prepared above is immersed in a mixed solution composed of 1.5% copper sulfate, 8% sodium potassium tartrate, 1.5% sodium hydroxide, 52% formaldehyde and 37% distilled water at room temperature. , Get thick metal copper circuit;

[0...

Example Embodiment

[0028] Example 2

[0029] 1. Same as step 1 of Example 1.

[0030] 2. Modify the surface of the printed polyimide film: drop 1mol / L NaOH solution on the surface of the film, let it stand for 10 minutes, and rinse it off with deionized water.

[0031] 3. Ion exchange on the surface of the modified film: put the above film at 50℃, 0.8mol / L Ag 2 SO 4 Soak in the solution for 20 minutes.

[0032] 4. Metal reduction: immerse the above-mentioned film in a boric acid solution at 20°C and 0.1 mol / L and take it out after 10 minutes to obtain a metallic silver circuit pattern.

[0033] 5. Thicken the metal circuit: The metal circuit prepared above is immersed in a mixed solution composed of 1.5% copper sulfate, 8% sodium potassium tartrate, 1.5% sodium hydroxide, 52% formaldehyde and 37% distilled water at room temperature. , Get thick metal copper circuit;

[0034] 6. Manually remove the ink.

Example Embodiment

[0035] Example 3

[0036] 1. Same as step 1 of Example 1.

[0037] 2. Modify the surface of the printed polyimide film: drop 8mol / L NaOH solution on the surface of the film, let it stand for 10 minutes, and rinse with deionized water.

[0038] 3. Perform ion exchange on the surface of the modified film: place the above film at 50℃, 0.5mol / L NiSO 4 Soak in the solution for 20 minutes.

[0039] 4. Metal reduction: immerse the above-mentioned film in a solution of sodium borohydride at 80°C and 0.5 mol / L and take it out after 5 minutes to obtain a metal nickel circuit pattern.

[0040] 5. Thicken the metal circuit: The metal circuit prepared above is immersed in a mixed solution composed of 1.5% copper sulfate, 8% sodium potassium tartrate, 1.5% sodium hydroxide, 52% formaldehyde and 37% distilled water at room temperature. , Get thick metal copper circuit;

[0041] 6. Manually remove the ink.

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PUM

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Abstract

The invention discloses a method for directly depositing metal line patterns based on a screen printing method. The method is characterized by implanting ions after selectively carrying out surface molecule modification treatment on a polyimide film substrate in fixed point through the mode of screen printing inert ink patterns; importing metal ions serving as reduced precursors; and obtaining the needed metal patterns through metal reduction and deposition. The method has the following beneficial effects: 1. the method is a novel method by which the needed metal lines can be directly formed on the polyimide film; the method is simple and convenient; the existing production equipment can directly apply the method to produce the metal lines, without additionally purchasing equipment, so the method is easy to popularize and use; 2. the fixed input is low and the production period is short, so the method is easy for large-scale production; and 3. no toxic or harmful gases are generated, so the method is environment-friendly, and the energy consumption is low, so the method conforms to the requirement for low-carbon production.

Description

technical field [0001] The invention belongs to the technical field of modern microelectronics, in particular to a method for directly depositing metal circuit patterns based on a screen printing method. Background technique [0002] Patterning metal circuits on insulating substrates is a very important step in the production of electronic, optical, and mechanical devices such as displays, biosensors, etc. The current mature method of preparing patterned metal circuits is usually to obtain the corresponding pattern on the metal film coated by vacuum evaporation, sputtering, electroplating or electroless plating deposition by photolithography, electron beam exposure, focused ion beam exposure and other technologies. pattern and then etched. [0003] However, with the development of microelectronics and semiconductor technology, microelectronic devices, especially the future generation of large-scale integrated electronic devices, are further developed in the direction of min...

Claims

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Application Information

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IPC IPC(8): C23C18/22C23C18/31C23C18/40H01L21/768
Inventor 苏炜李培源姚丽贝
Owner GUANGXI TEACHERS EDUCATION UNIV
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