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Method for silvering kovar alloy interconnection piece

A technology of interconnection sheet and alloy, which is applied in the field of interconnection of solar cells for aerospace, can solve the problems of no improvement in the tensile strength of interconnection sheet and battery sheet, insufficient plating ability and deep plating ability of the coating, high cost of ion implantation process, etc., to achieve The effect of low cost, high yield and stable process

Active Publication Date: 2012-04-18
CHINA ELECTRONIC TECH GRP CORP NO 18 RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, because molybdenum has the characteristics of high melting point, high hardness, strong toughness, and unsuitability for electroplating, in order to ensure the flexible interconnection of molybdenum foil and battery sheets as interconnects, it is necessary to perform a special annealing process on the molybdenum foil before use. It reaches a soft state, which improves the production cost of the battery array; cyanide-free electroplating
[0004] Compared with cyanide plating, the plating ability and deep plating ability of the resulting coating are obviously insufficient; the vacuum metal ion implantation technology is a process of implanting the required element ions into the surface of the workpiece through high voltage, which significantly improves the sliding of the surface of the workpiece. The performance is wear resistance, but there is no improvement in the tensile strength of the interconnection sheet and the battery sheet after welding, which will eventually affect the service life of the battery array, and the ion implantation process has high cost, low efficiency, and is not suitable for mass production

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  • Method for silvering kovar alloy interconnection piece
  • Method for silvering kovar alloy interconnection piece

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Embodiment

[0022] Combined with the fact that the 0.02mm Kovar alloy interconnect sheet is thin, light, small and complex in shape, the workpiece should be handled with care during operation, and it should be shaken up and down in the solution to improve the workpiece processing and electroplating effect; Kovar alloy interconnect sheet is silver-plated The operation steps include: ⑴ surface screening and wiping cleaning, ⑵ joint degreasing, ⑶ pickling activation, ⑷ pre-plating treatment, ⑸ pre-silvering, ⑹ electro-silvering and ⑺ electrochemical passivation, until unloading, dehydration and drying, inspection, Finally packed into warehouse. Specific steps are as follows:

[0023] ⑴Surface screening and wiping and cleaning: According to the size of the required interconnection sheet, select qualified workpieces from the cut 0.02mm thick Kovar alloy interconnection sheet, and carry out workpiece finishing and surface cleaning to ensure flatness and no edge corners. For burrs, wipe and cle...

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Abstract

The invention relates to a method for silvering a kovar alloy interconnection piece. The method comprises the following steps of 1, carrying out surface screening and wiping cleaning, 2, carrying out combined oil removal, 3, carrying out pickling and activation, 4, carrying out pre-plating treatment, 5, carrying out pre-silvering, 6, carrying out silver electroplating, and 7, carrying out electrochemical passivation. The method is characterized in that the step 3 is utilized for preparing pickle and an activation solution and carrying out pickling and activation; the step 4 is utilized for impacting nickel and plating copper on a bottom layer; and the step 7 is utilized for preparing a passivation aqueous solution and carrying out electrochemical passivation. The method has the advantages that 1, a kovar alloy is utilized as a base material of an interconnection piece for a cell array so that a production technology is simplified and a cost is reduced; and 2, on the basis of a cyaniding silver-electroplating technology, through further optimization of activation solution preparation, a pre-plating treatment method and passivation treatment, the requirements on atomic oxygen resistance, electrical conductivity and solderability of an interconnection piece are satisfied; after high / low temperature circulation, tensile strength is great than or equal to 0.83N / mm<2>; a yield is high; and the characteristics of mass production feasibility and cell array service life improvement are obtained.

Description

technical field [0001] The invention belongs to the technical field of interconnection of solar cells for aerospace, and in particular relates to a silver plating method of Kovar alloy interconnection sheet. Background technique [0002] The solar cell array is formed by connecting multiple solar cells in series or in parallel through metal interconnects. It is one of the key technologies of the power subsystem of the aerospace vehicle and plays an important role in the energy supply and effective life of the spacecraft. Because metallic silver has excellent electrical conductivity and solderability, it is an ideal material for solar cell array interconnects. Since the main component of the residual gas in low earth orbit is atomic oxygen formed by the decomposition of molecular oxygen in the atmosphere by solar ultraviolet light, and metallic silver is easily oxidized in an environment of atomic oxygen; therefore, the solar cell array on a spacecraft operating in low earth ...

Claims

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Application Information

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IPC IPC(8): C25D3/46C25D5/34C25D5/48
Inventor 谭智申
Owner CHINA ELECTRONIC TECH GRP CORP NO 18 RES INST
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