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Low-rosin halogen and lead-free solder paste and preparation method thereof

A lead-free solder paste and rosin technology, used in welding equipment, welding media, manufacturing tools, etc., can solve the problems of destroying the atmospheric ozone layer, excessive surface residue, affecting performance, etc., to improve reliability and environmental standards, and reduce heavy metal pollution. , the effect of stable performance

Inactive Publication Date: 2012-07-11
宁波圣之岛焊锡材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, the use of traditional solder paste has been gradually banned because it contains lead, which is harmful to the environment and human health. Lead-free solder paste has replaced traditional tin-lead solder paste. The traditional lead-free solder paste currently on the market mainly includes Sn-Ag -Cu alloy, Sn-Ag alloy, Sn-Ag-Bi alloy, Sn-Bi alloy, Sn-Sb alloy, but each solder has certain limitations, in terms of soldering temperature / mechanical strength / wettability / aging resistance Sex and other aspects cannot achieve the desired effect at the same time
Most of the traditional solder paste film-forming agents use rosin composites, and the solvent uses a single high-boiling point solvent, which makes the surface of the solder paste more residues after soldering, affecting the appearance and post-soldering performance
The active agent is a halogen product, which destroys the atmospheric ozone layer and affects the stability of the product after welding

Method used

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  • Low-rosin halogen and lead-free solder paste and preparation method thereof
  • Low-rosin halogen and lead-free solder paste and preparation method thereof
  • Low-rosin halogen and lead-free solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0036] Solder powder: S n 、A g ,Z n 、C u Four materials according to: 95.8% S n , 2% of A g , 1.5% Z n , 0.7%. C u Melting and mixing, and centrifugal atomization, screened out the powder of 25-38um particles.

[0037] The weight percent of flux is:

[0038] The film-forming agent contains 30%: wherein, it contains 15% cellulose resin, 10% modified rosin, and 5% polyethylene glycol;

[0039] The organic acid activator contains 10%: among them, it contains 4% succinic acid, 4% adipic acid, and 2% itaconic acid;

[0040] The surfactant contains 4%: Among them, it contains 4% nonylphenol polyoxyethylene ether;

[0041] Thixotropic agent contains 6%: among them, contains 6% hydrogenated castor oil;

[0042] The acid value regulator contains 5%: among them, it contains 3% diethanolamine and 2% oleic acid amide;

[0043] The lubricating moisturizer contains 3%: among them, 3% contains paraffin;

[0044] Antioxidants contain 2%: among them, 2% benzotriazole;

[0045] The...

Embodiment approach 2

[0050] Solder powder: S n 、A g ,Z n 、C u Four materials according to: 95.8% S n , 2% of A g , 1.5% Z n , 0.7%. C u Melting and mixing, and centrifugal atomization, screened out the powder of 25-38um particles.

[0051] The weight percent of flux is:

[0052] The film-forming agent contains 35%: among them, it contains 15% of cellulose resin, 10% of modified rosin, 5% of polyethylene glycol, and 5% of acrylic resin;

[0053]The organic acid activator contains 8%: among them, it contains 4% glutaric acid and 4% sebacic acid;

[0054] The surfactant contains 3%: among them, it contains 3% diethylene glycol polyoxyethylene ether;

[0055] Thixotropic agent contains 6%: 6% hydrogenated castor oil;

[0056] The acid value regulator contains 5%: among them, it contains 4% triethanolamine and 1% oleic acid amide;

[0057] The lubricating moisturizer contains 2%: Among them, it contains 2% glycerol;

[0058] Antioxidant contains 1%: Among them, it contains 1% BHT;

[0059]...

Embodiment approach 3

[0065] Solder powder: S n 、A g ,Z n 、C u Four materials according to: 96.3% S n , 2.5% A g , 0.5% Z n , 0.7%. C u Melting and mixing, and centrifugal atomization, screened out the powder of 25-38um particles.

[0066] The weight percent of flux is:

[0067] The film-forming agent contains 25%: wherein, it contains 10% cellulose resin, 10% modified rosin, and 5% polyethylene glycol;

[0068] The organic acid activator contains 8%: among them, it contains 4% succinic acid and 4% DL-malic acid;

[0069] The surfactant contains 3%: among them, it contains 3% oleyl alcohol polyoxyethylene ether;

[0070] Thixotropic agent contains 6%: among them, contains 6% hydrogenated castor oil;

[0071] The acid value regulator contains 5%: among them, it contains 4% triethanolamine and 1% oleic acid amide;

[0072] The lubricating moisturizer contains 2%: Among them, it contains 2% propylene glycol;

[0073] Antioxidant contains 1%: Among them, it contains 1% imidazole;

[0074] ...

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Abstract

The invention relates to solder paste for welding electronic devices, in particular to low-rosin halogen and lead-free solder paste and a preparation method of the low-rosin halogen and lead-free solder paste. The low-rosin halogen and lead-free solder paste is composed of solder powder and an soldering flux, wherein the weight percentage of the solder powder is 88-90 percent; the weight percentage of the soldering flux is 10-12 percent; and the solder powder consists of the following components by weight percent: 95.3-97% of Sn, 2-2.5% of Ag, 0.5-1.5% of Zn and 0.5-0.7% of Cu. The solder paste does not contain lead or halogen, is beneficial for environmental protection, and can not damage the atmospheric layer, the heavy pollution to the environment is greatly reduced, the residual solder waste after welding is little, the solder paste is colourless and transparent, has stable performance under normal temperature, can not absorb moisture, does not contain halogen, has no corrosion after welding, is particularly suitable for the no-clean operation, and better conforms with the environmental protection requirements.

Description

technical field [0001] The invention relates to a solder paste for welding electronic devices, in particular to a low-rosin, halogen-free, lead-free solder paste and a preparation method thereof. Background technique [0002] The traditional solder paste is composed of tin-lead alloy solder powder and flux, wherein the tin-lead ratio of alloy solder powder is 63:37, the spherical particle size is 25-45um, and the flux is made of modified rosin resin, high and medium boiling point solvent, contact Variable agent, active agent, antioxidant preservative and other additives. In recent years, the use of traditional solder paste has been gradually banned because it contains lead, which is harmful to the environment and human health. Lead-free solder paste has replaced traditional tin-lead solder paste. The traditional lead-free solder paste currently on the market mainly includes Sn-Ag -Cu alloy, Sn-Ag alloy, Sn-Ag-Bi alloy, Sn-Bi alloy, Sn-Sb alloy, but each solder has certain l...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/363
Inventor 潘惠凯
Owner 宁波圣之岛焊锡材料有限公司
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