Ni-Cu-P-Ce alloy plating layer and preparation process

A ni-cu-p-ce, alloy coating technology, applied in the direction of metal material coating process, coating, liquid chemical plating, etc., can solve the problem of hindering Cu and Ni deposition and interfacial diffusion, Cu and Ni atomic reduction deposition The difficulty is increased, the improvement effect of the rare earth deposition rate is not obvious, etc., and the effect of strong corrosion resistance, increased lattice distortion and enhanced interaction is achieved.

Inactive Publication Date: 2013-03-27
SHANDONG JIANZHU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the mid-1990s, the majority of solid thin film researchers in my country have made many explorations on adding rare earths to the traditional electroless Ni-P alloy plating solution. However, due to the reduction potential of rare earths (between -2.2V and -2.5V Between) is much more negative than the reducing agent sodium hypophosphite in the plating solution. According to the electrochemical theory, the reduction potential of the deposited metal must be higher than that of the reducing agent before it can be reduced and deposited. There

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  • Ni-Cu-P-Ce alloy plating layer and preparation process
  • Ni-Cu-P-Ce alloy plating layer and preparation process
  • Ni-Cu-P-Ce alloy plating layer and preparation process

Examples

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Embodiment 1

[0048] A kind of chemical plating Ni-Cu-P-Ce solution, the formula of this solution is: nickel sulfate 35g / L, copper sulfate 0.2g / L, sodium hypophosphite 30g / L, sodium acetate 8g / L, trisodium citrate 25g / L, lactic acid 22ml / L, succinic acid 8g / L, cerium nitrate 0.3g / L, potassium iodide 8mg / L, thiourea 1.5mg / L, glycine 0.01g / L, ammonium bifluoride 0.2g / L.

[0049] The specific configuration steps are:

[0050] (1) Accurately weigh the calculated amount of solid medicine and add a small amount of distilled water to dissolve;

[0051] (2) Nickel sulfate, copper sulfate, cerium nitrate solution that have dissolved completely are poured into the solution containing complex compound (trisodium citrate, lactic acid, succinic acid, sodium acetate) under constant stirring;

[0052] (3) The sodium hypophosphite solution will be completely dissolved, and poured into the solution of step (2) under constant stirring;

[0053] (4) adjust the pH value to 7.0 with strong ammonia water;

...

Embodiment 2

[0063] A kind of chemical plating Ni-Cu-P-Ce solution, the formula of this solution is: nickel sulfate 40g / L, copper sulfate 0.3g / L, sodium hypophosphite 27g / L, sodium acetate 10g / L, trisodium citrate 26g / L, lactic acid 23ml / L, succinic acid 9g / L, cerium nitrate 0.4g / L, potassium iodide 8mg / L, thiourea 1.5mg / L, glycine 0.01g / L, ammonium bifluoride 0.2g / L.

[0064] The specific configuration steps are:

[0065] (1) Accurately weigh the calculated amount of solid medicine and add a small amount of distilled water to dissolve;

[0066] (2) Nickel sulfate, copper sulfate, cerium nitrate solution that have dissolved completely are poured into the solution containing complex compound (trisodium citrate, lactic acid, succinic acid, sodium acetate) under constant stirring;

[0067] (3) The sodium hypophosphite solution will be completely dissolved, and poured into the solution of step (2) under constant stirring;

[0068] (4) adjust the pH value to 7.0 with strong ammonia water;

...

Embodiment 3

[0078] A kind of chemical plating Ni-Cu-P-Ce solution, the formula of this solution is: nickel sulfate 36g / L, copper sulfate 0.4g / L, sodium hypophosphite 25g / L, sodium acetate 9g / L, trisodium citrate 27g / L, lactic acid 28ml / L, succinic acid 10g / L, cerium nitrate 0.2g / L, potassium iodide 8mg / L, thiourea 1.5mg / L, glycine 0.01g / L, ammonium bifluoride 0.2g / L.

[0079] The specific configuration steps are:

[0080] (1) Accurately weigh the calculated amount of solid medicine and add a small amount of distilled water to dissolve;

[0081] (2) Nickel sulfate, copper sulfate, cerium nitrate solution that have dissolved completely are poured into the solution containing complex compound (trisodium citrate, lactic acid, succinic acid, sodium acetate) under constant stirring;

[0082] (3) The sodium hypophosphite solution will be completely dissolved, and poured into the solution of step (2) under constant stirring;

[0083] (4) adjust the pH value to 6.5 with concentrated ammonia wat...

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Abstract

The invention relates to chemical plating on a surface of a metal material and particularly to a Ni-Cu-P-Ce alloy plating layer used for chemical plating on a surface of a low-carbon steel base material and a preparation process of the Ni-Cu-P-Ce alloy plating layer. The Ni-Cu-P-Ce alloy plating layer adopts a plating liquid composed of 35-40 g/L of nickel sulfate, 0.2-0.4 g/L of copper sulfate, 25-30 g/L of sodium hypophosphite, 8-10 g/L of sodium acetate, 25-30 g/L of trisodium citrate, 22-28 ml/L of lactic acid, 8-10 g/L of butanedioic acid, 0.2-0.4 g/L of cerium nitrate, 8 mg/L of potassium iodide, 1.5 mg/L of thiourea, 0.01 g/L of glycine and 0.2 g/L of ammonium bifluoride. For the adoption of ultrasonic chemical plating, a plating layer material formed by codeposition of Ce, Cu and Ni is obtained; and the material has increased compactness, is a microlithic texture, and is high in hardness and strong in corrosion resistance.

Description

technical field [0001] The invention relates to electroless plating on the surface of metal materials, in particular to an electroless Ni-Cu-P-Ce alloy coating for the surface of a low-carbon steel substrate and a preparation process thereof. Background technique [0002] Rare earth is known as the "treasure house" of new materials. It is one of the most concerned group elements by domestic and foreign scholars, especially material experts. Its value and status are increasingly concerned. Rare earth elements are 15 lanthanide elements with atomic numbers ranging from 57 to 71 in the third subgroup of the periodic table, plus scandium and yttrium, which have similar electronic structures and chemical properties, a total of 17 elements, which are typical metal elements. Metal activity is second only to alkali metals and alkaline earth metals, and is more active than other metals. Rare earth elements have a large atomic radius and special electronic structure, so they have goo...

Claims

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Application Information

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IPC IPC(8): C23C18/50
Inventor 孙华郭晓斐马洪芳冯立明王玥蔡元兴
Owner SHANDONG JIANZHU UNIV
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