Manufacturing method for copper-based super-hydrophobic surface structure

A super-hydrophobic surface and copper-based technology, which is applied to the device for coating liquid on the surface, special surface, pre-treated surface, etc., can solve the problems of easy peeling off of the surface coating, poor performance and short time consumption, and achieve the goal of preparing The effect of short cycle, reduced preparation cost and convenient operation

Inactive Publication Date: 2013-11-27
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the method is simple to operate, it takes a long time, and a production cycle needs at least 3 days; the step-by-step method is to first construct a micro-nano hierarchical structure on the surface of metal copper, and then modify it with low surface energy substances to obtain superhydrophobic copper surface method
This method takes a short time, but the surface coating is easy to fall off, and the performance is poor

Method used

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  • Manufacturing method for copper-based super-hydrophobic surface structure
  • Manufacturing method for copper-based super-hydrophobic surface structure
  • Manufacturing method for copper-based super-hydrophobic surface structure

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preparation example Construction

[0026] A method for preparing a copper-based superhydrophobic surface structure designed by the present invention, the main steps of the method include:

[0027] The first step is to pretreat the metal copper substrate;

[0028] In the second step, the surface of the copper substrate treated in the first step is spin-coated with a layer of photoresist, and the photoresist layer attached to the surface of the copper substrate is processed by photolithography to form an ordered porous array template;

[0029] In the third step, the copper substrate with an ordered porous array template prepared in the second step is used as the positive electrode, and immersed in CuSO 4 Form the primary battery in the solution and react for 4 to 8 minutes;

[0030] In the fourth step, the copper substrate after the galvanic reaction in the third step is immersed in AgNO 3 React in the solution for 30-70s;

[0031] In the fifth step, the surface of the copper substrate after the reaction in th...

Embodiment 1

[0043]Step 1: At room temperature, immerse the copper substrate in 20mmol / L dilute hydrochloric acid for 20s and take it out. After repeated several times, clean the surface with deionized water, and then ultrasonically clean it with acetone, absolute ethanol, and deionized water for 10 minutes. ;

[0044] In the second step, a layer of photoresist is spin-coated on the surface of the copper substrate pretreated in the first step, and after ultraviolet exposure, an ordered porous array template is formed on the surface of the copper substrate. The hole diameter on the ordered porous array template is 8 μm, and the pitch is 16μm, such as figure 1 shown;

[0045] Step 3: Prepare 0.2mol / L CuSO 4 Solution, seal the part of the copper substrate obtained in the second step that is exposed and has no ordered porous array template, and then use the copper substrate as the positive electrode and the zinc sheet of equal size as the negative electrode to keep the positive and negative ...

Embodiment 2

[0050] Step 1: At room temperature, immerse the copper substrate in 20mmol / L dilute hydrochloric acid for 20s and take it out. After repeated several times, clean the surface with deionized water, and then ultrasonically clean it with acetone, absolute ethanol, and deionized water for 10 minutes. ;

[0051] In the second step, a layer of photoresist is spin-coated on the surface of the copper substrate pretreated in the first step, and after ultraviolet exposure, an ordered porous array template is formed on the surface of the copper substrate. The hole diameter on the ordered porous array template is 8 μm, and the pitch is 12μm, such as figure 1 shown;

[0052] The third step is to prepare 0.5mol / L CuSO 4 Solution, seal the part of the copper substrate obtained in the second step that is exposed and has no ordered porous array template, and then use the copper substrate as the positive electrode and the zinc sheet as the negative electrode, so that the positive and negative...

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Abstract

A manufacturing method for a copper-based super-hydrophobic surface structure mainly includes that step 1, a metal copper base is pre-processed; step 2, a layer of photoresist is coated on the surface of the processed copper base in a rotation mode, and the photoresist layer attached to the surface of the copper base forms a well-aligned porous array template through photoetching processing; step 3, the copper base with the well-aligned porous array template obtained in the step 2 is used as an anode and soaked in a CuSO4 solution to form a primary battery to conduct a reaction for 4-8 min; step 4, the copper base of the primary battery obtained in the step 3 after reaction is finished is soaked into an AgNO3 solution to conduct in-situ reduction for 30-70s; step 5, the copper base subjected to the reaction in the step 4 is subjected to silanization processing, and the copper-based super-hydrophobic surface structure is manufactured. By means of the method, two simple redox processes are utilized to obtain a layer of micro-nano dual-scale structure similar to the lotus leaf surface on the surface of copper metal, hydrophobe is achieved, the performance of the manufactured super-hydrophobic surface is stable, a contact angle between the super-hydrophobic surface and a water solution with a pH value ranging from 1 to 14 can be larger than 155 degrees, and the minimum rolling angle can be smaller than 1.5 degrees.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of metal substrates, and in particular relates to a method for preparing a copper-based superhydrophobic surface structure. Background technique [0002] In nature and our daily life, surface wettability is a very important characteristic of solid surface. Through the study of "lotus leaf effect", two key factors affecting surface wettability are obtained: one is surface free energy (surface chemical composition), and the second is surface roughness. The superhydrophobic metal surface is similar to a lotus leaf. When water is dropped on its surface, the water drops will fall off immediately. It is an important functional material. In recent years, metal superhydrophobic surfaces (contact angle greater than 150°, rolling angle less than 5°) have received extensive attention and research from all walks of life because of their self-cleaning, drag and friction reduction, and corrosion resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D5/08B05D3/10
Inventor 章桥新陈玉雪黄行九
Owner WUHAN UNIV OF TECH
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