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Modified inorganic nanoparticle toughening epoxy resin pouring sealant and preparation method thereof

A technology of inorganic nanoparticles and tough epoxy resin, which is applied in the direction of epoxy resin glue, adhesives, non-polymer adhesive additives, etc. Technical difficulty and other issues, to achieve low linear expansion coefficient, improve compatibility and adhesion, improve flame retardancy and thermal conductivity

Inactive Publication Date: 2014-12-24
JIANGNAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the application of nanotechnology in epoxy potting materials is still a difficult topic, mainly because nanoparticles are easy to agglomerate and agglomerate, which can neither reflect the particularity of nanomaterials nor affect the filling effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Proportion: 100 parts of bisphenol A epoxy resin, 30 parts of polyaniline modified nano-silica, 27 parts of aliphatic amine curing agent, 1.5 parts of 2-methylimidazole, and 10 parts of propylene oxide butyl ether.

[0021] Preparation process: Disperse 10g of nano-silica in a solution containing 10g of aniline monomer, add 10g of ammonium persulfate and hydrochloric acid to the dispersion under ice bath conditions, stir and polymerize under ice bath conditions, react for 10 hours, filter and wash to obtain poly Aniline-modified nano-silica; add the modified inorganic nanoparticles into the epoxy resin and active diluent system configured in proportion, and stir evenly; then add curing agent and its accelerator in proportion, mix and stir evenly, Vacuum defoaming.

Embodiment 2

[0023] Ratio: 60 parts of bisphenol F epoxy resin, 40 parts of glycidyl ether epoxy resin, 20 parts of polyaniline modified nano-silica, 20 parts of fatty amine curing agent, 1.5 parts of 2-methylimidazole, 10 parts of propylene oxide butyl ether.

[0024] Preparation process: Disperse 10g of nano-silica in a solution containing 7.5g of aniline monomer, add 7.5g of ammonium persulfate and hydrochloric acid to the dispersion under ice bath conditions, stir and polymerize under ice bath conditions, react for 8 hours, filter and wash Obtain polyaniline-modified nano-silica; add the modified inorganic nanoparticles into the epoxy resin and active diluent system configured in proportion, and stir evenly; then add curing agent and its accelerator in proportion, and mix and stir Uniform, vacuum defoaming.

Embodiment 3

[0026] Proportion: 60 parts of bisphenol F epoxy resin, 40 parts of glycidyl ether epoxy resin, 20 parts of polyaniline modified nano-aluminum nitride, 30 parts of polyether amine curing agent, 2-methyl-4- 1.2 parts of ethyl imidazole, 10 parts of n-butyl glycidyl ether.

[0027] Preparation process: Disperse 10g of nano-aluminum nitride in a solution containing 15g of aniline monomer, add 10g of ammonium persulfate and hydrochloric acid to the dispersion under ice bath conditions, stir and polymerize under ice bath conditions, react for 10 hours, filter and wash to obtain poly Aniline-modified nano-silica; add the modified inorganic nanoparticles into the epoxy resin and active diluent system configured in proportion, and stir evenly; then add curing agent and its accelerator in proportion, mix and stir evenly, Vacuum defoaming.

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Abstract

The invention relates to a modified inorganic nanoparticle toughening epoxy resin pouring sealant and a preparation method thereof. The epoxy resin pouring sealant consists of epoxy resin, a curing agent, an accelerant of the curing agent, an active diluent and polyaniline modified inorganic nanoparticles. The polyaniline has amino groups on the molecule chain, the boundary binding property of the inorganic nanoparticles and the epoxy resin can be improved, the dispersion of the inorganic nanoparticles in the epoxy resin is promoted, and meanwhile as the polyaniline has certain flame retardancy and a good heat conduction coefficient, the polyaniline modified inorganic nanoparticles can be toughened and at the same time the flame retardancy and the heat conduction property are improved, and multiple properties of a material are synchronously improved. The preparation method is simple in process and convenient to operate, an obtained pouring sealing material is low in toxicity and good in flowability, and the condensate of the pouring sealing material is very high in impact resistance, good in flame retardancy, low in linear expansion coefficient, high in heat conductivity and very suitable for sealing electronic devices in a pouring manner.

Description

Technical field: [0001] The invention belongs to the field of electronic packaging materials, and in particular relates to an inorganic nano particle modified epoxy resin potting glue and a preparation method thereof. Background technique: [0002] Simply put, electronic packaging is an operation process that uses packaging materials to reasonably arrange, assemble, connect, seal and protect the components that make up electronic devices to prevent moisture, dust and harmful gases. The intrusion of electronic components, slow down vibration, prevent external force damage and stabilize the parameters of electronic components. In microelectronic packaging, packaging materials can play the role of semiconductor chip support, chip protection, chip heat dissipation, chip insulation and chip and external circuit, optical path interconnection, so for microelectronic packaging, it has an important basic position and advanced status and constraints. Among the materials used for pot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/06C09J11/00C08G73/02C09C1/28C09C1/40C09C3/10
Inventor 罗静卓虎马强刘晓亚刘敏
Owner JIANGNAN UNIV
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