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Polyamide five-layer co-extrusion composite film and preparation method thereof

A technology of co-extruded composite film and polyamide, which is applied in the field of polyamide five-layer co-extruded composite film and its preparation, can solve the problems of not meeting the barrier property requirements of solar cell modules, poor moisture and heat aging resistance, and difficulty in overcoming water absorption, etc. , to achieve good mechanical properties, resistance to system voltage, and low moisture absorption

Active Publication Date: 2015-04-22
苏州鼎九新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, polyamide has high hygroscopicity due to the amide group in the molecular chain segment, so it is difficult for unmodified polyamide resin to overcome defects such as high water absorption rate and poor moisture and heat aging resistance, and cannot meet the requirements of solar cell modules. The barrier requirements of the backsheet, which in turn limits the application of polyamide resin as a backsheet material

Method used

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  • Polyamide five-layer co-extrusion composite film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0023] see figure 1 , extracting a polyamide five-layer co-extrusion composite film, including A layer, B layer and C layer, from top to bottom are A layer, B layer, C layer, B layer and A layer. The five layers are all based on modified polyamide, which meets the basic properties of high insulation, system voltage resistance, high dimensional stability, and thermal stability. Among them, layer A is a high weather resistance layer, adding nano-scale materials with anti-aging, anti-ultraviolet and improving mechanical properties to the modified polyamide to meet the requirements of high weather resistance; layer B is a high barrier layer, adding nano-scale materials to the modified polyamide The water-blocking and gas-blocking material is controlled by the production process and forms a closed-loop structure through molecular interlocking to achieve a high barrier effect; the C layer is a modified PA substrate layer.

[0024] A method for preparing a polyamide five-layer co-ex...

Embodiment 2

[0028] Provide a kind of preparation method of polyamide five-layer co-extruded composite film, the structure of the obtained polyamide five-layer co-extruded composite film is the same as that of Example 1, comprising the steps of:

[0029] (1) Add 200 g of octamethylcyclotetrasiloxane, 200 g of methylphenylcyclotetrasiloxane, 18.64 g of epoxy end-capping agent and tetramethylammonium hydroxide into a 1L clean three-neck flask under nitrogen protection Alkali glue 8g, polymerized at 100°C for 4 hours, decomposed the catalyst at 140°C for 1 hour, and then decompressed to remove the low molecular weight to obtain epoxy-terminated methylphenylpolysiloxane with a viscosity of 590mpa·s. Then take 40 g of the obtained epoxy-terminated methylphenyl polysiloxane and 360 g of polyamide 66 (PA66), heat to 160° C., and react under reduced pressure for 4 hours to obtain 400 g of silicone-modified polyamide.

[0030] (2) Add 200 g of the obtained silicone-modified polyamide, 20 g of nano-...

Embodiment 3

[0032] Provide a kind of preparation method of polyamide five-layer co-extruded composite film, the structure of the obtained polyamide five-layer co-extruded composite film is the same as that of Example 1, comprising the steps of:

[0033] (1) Add 200 g of octamethylcyclotetrasiloxane, 200 g of octaphenylcyclotetrasiloxane, 18.64 g of epoxy end-capping agent, tetramethylammonium hydroxide base, and Glue 8g, polymerized at 100°C for 4 hours, decomposed the catalyst at 140°C for 1 hour, and then decompressed to remove low molecular weight, and obtained epoxy-terminated dimethyl-diphenylpolysiloxane with a viscosity of 780 mpa·s. Then take 40 g of the obtained epoxy-terminated dimethyl-diphenyl polysiloxane, and mix it with 360 g of polyamide 9 (PA9), heat it to 160° C., and react under reduced pressure for 4 hours to obtain 400 g of silicone-modified polyamide.

[0034] (2) 200 g of the obtained silicone-modified polyamide, 20 g of nano-zinc oxide with a particle size of 500 n...

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Abstract

The invention discloses a polyamide five-layer co-extrusion composite film and a preparation method thereof. Cyclosiloxane is taken as a monomer, tetramethyl ammonium hydroxide alkaline gel is taken as a catalyst, and ring opening polymerization is conducted between the cyclosiloxane and the tetramethyl ammonium hydroxide alkaline gel and an epoxy blocking agent to obtain an epoxy blocking organic silicon polymer; the epoxy blocking organic silicon polymer is reacted with the polyamide in a molten state to obtain organic silicon modified polyamide; the organic silicon modified polyamide, nano particles and antioxygen are added into an extruder for coextrusion to obtain the polyamide five-layer co-extrusion composite film with high performance. The modified polyamide five-layer co-extrusion composite film has the advantages of the polyamide and the organic silicon materials. The polyamide five-layer co-extrusion composite film and the preparation method thereof have the advantages of good insulativity, system voltage resistance, high dimensional stability, heat stability, good mechanical property, abrasive resistance, self-lubricating property, small hygroscopicity, thermal shock resistance, extreme climate resistance and the like. The polyamide five-layer co-extrusion composite film and the preparation method thereof can be used in the field of solar backborad film, insulators and the like.

Description

technical field [0001] The invention relates to a polyamide five-layer co-extruded composite film and a preparation method thereof. Background technique [0002] Polyamide resin has good adhesion, excellent mechanical, wear-resistant, self-lubricating properties and good heat resistance. Silicone has good adhesion and is expected to become an important solar backplane material, which has attracted the attention of researchers in recent years. International patent WO2008 / 138021A2 discloses the use of various types of polyamides instead of polyester as the material in the backsheet of a photovoltaic module. Chinese patent CN102324440A prepares a single-layer solar battery back sheet with polyamide resin as the main body; and Chinese patent CN10931018 A discloses a single back sheet of a photovoltaic module made of polyamide-based molding compound. In order to reduce the water absorption of the polyamide composition and improve the dimensional stability of the product, Chines...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B27/18B32B27/34B32B27/28B32B37/00
CPCB32B27/06B32B27/18B32B27/28B32B27/34B32B37/10B32B37/14
Inventor 张鼎晟子张志贵
Owner 苏州鼎九新材料科技有限公司
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