Bi-component cured UV viscosity-decreasing adhesive

Abstract

The invention relates to a bi-component cured UV viscosity-decreasing adhesive. The bi-component cured UV viscosity-decreasing adhesive comprises two components of the component A and the component B. The component A is composed of, by weight, 35-60 parts of cured resin, 22-45 parts of photosensitive monomers, 2-10 parts of photopolymerization initiators, 2-15 parts of diluents and 2-10 parts of auxiliaries, wherein the cured resin is resin containing hydroxyl or resin containing carboxyl; the component B is one of a curing agent containing NCO and a curing agent containing sulfydryl or a mixture of the curing agent containing NCO and the curing agent containing the sulfydryl, the curing agent containing NCO is isocyanate, the content of NCO of the isocyanate ranges from 12.5% to 23.5%, and the molecular weight ranges from 200 to 600; the curing agent containing the sulfydryl is polymercaptans, wherein the content of the sulfydryl ranges from 5% to 15%; the weight of the component B is 5%-20% of that of the component A. The bi-component cured UV viscosity-decreasing adhesive has the advantages that the initial viscous force is strong after curing forming is conducted at room temperature, after UV-irradiation is conducted for decreasing viscosity, the stripping effect is good, and adhesive residues do not exist.

Description

technical field [0001] The invention relates to an adhesive, in particular to a UV viscosifying adhesive based on an acrylate copolymer, which is mainly used in semiconductor devices such as monocrystalline silicon materials, integrated circuits, printed circuit boards, projectors, telescopes, optical Manufacturing and processing of optical instruments such as microscopes. Background technique [0002] In the manufacturing of large-scale integrated circuits and the manufacturing and processing of semiconductor devices, the essential basic material is semiconductor chips, which are processed from single crystal silicon wafers. Monocrystalline silicon wafers are referred to as wafers. When cutting and grinding wafer materials, it is necessary to use a special pressure-sensitive tape for bonding and fixing to play a role of protection and support. After processing, the processed wafer slices need to be easily and completely peeled off from the adhesive without affecting the w...

AI Technical Summary

Problems solved by technology

The patent application with the publication number CN1560166A also mentions a similar approach, and its 180° peel strength before illumination is only 3-4N / 25mmUV peelable adhesive, which is not enough to provide the required bonding strength for wafer material processing before illumination

[0004] In addition, it is mentioned in the patent application CN104496853A that adopts thermal reaction polymerization to generate large molecular weight UV peelable resin, but the synthesis process is cumbersome, and the method of heating reaction requires special resin synthesis equipment, and the reaction time is long. After fixing the reaction process, it is not possible to adjust the initial adhesion and the adhesion after UV viscosity reduction according to the adhesion required by different substrates, which is not conducive to industrial scale production

[0005] In order to better solve the problem of residual glue, the patent application scheme with the publication number CN101016441A adopts a special bump fiber structure when making the adhesive-reducing film, which is helpful for reducing the peeling force during peeling, but this method reduces the bonding by reducing the surface area. The force is not conducive to the cutting of the glass. It needs a large adhesive force to fix it, so that it is not conducive to the precise positioning of the cutting during the processing.

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