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Curable resin composition, dry film and printed circuit board

A technology of curable resin and composition, applied in printed circuit parts, optics, optomechanical equipment, etc., can solve problems such as inability to obtain sufficient signal characteristics, and achieve the effect of suppressing delay

Active Publication Date: 2015-11-25
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, there is a problem that the cured product of the conventional resin composition used in such a substrate material has a dielectric constant of about 4.0 and a dielectric loss tangent of about 0.03, and a circuit using the resin composition as a substrate material In the case of a board, when communicating in a high-frequency area, delays in signal transmission and loss of signals cannot be avoided
[0005] However, even if such a spherical porous filler with a small dielectric constant and dielectric loss tangent is mixed, sufficient signal characteristics cannot be obtained, and there is still room for improvement.

Method used

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  • Curable resin composition, dry film and printed circuit board

Examples

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Embodiment

[0110] Examples and comparative examples are shown below to specifically describe the present invention, but the present invention is not limited to the following examples. It should be noted that, below, "parts" and "%" are all quality standards unless otherwise specified.

[0111]

Synthetic example 1

[0113] Put 119.4 parts of novolac cresol resin (manufactured by Showa Highpolymer Co., Ltd., trade name "ShonolCRG951", OH equivalent: 119.4), hydrogen in an autoclave equipped with a thermometer, nitrogen introduction device, alkylene oxide introduction device, and stirring device 1.19 parts of potassium oxide and 119.4 parts of toluene were stirred and replaced with nitrogen in the system, and then heated and increased. Then, slowly add 63.8 parts of propylene oxide dropwise at 125~132℃, 0~4.8kg / cm 2 Let it react for 16 hours. Then, it was cooled to room temperature, and 1.56 parts of 89% phosphoric acid was added to the reaction solution and mixed to neutralize potassium hydroxide to obtain a novolac type cresol resin epoxy with a non-volatile content of 62.1% and a hydroxyl value of 182.2 g / eq. Propane reaction solution. This is an average addition of 1.08 moles of alkylene oxide per equivalent of phenolic hydroxyl group.

[0114] Next, 293.0 parts of the obtained novolac t...

Synthetic example 2

[0116] Put methyl methacrylate, ethyl methacrylate, and methacrylic acid into a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser in a molar ratio of 1:1:2, and add two as a solvent. Propylene glycol monomethyl ether, azobisisobutyronitrile (AIBN) was added as a catalyst, and stirred at 80°C for 4 hours under a nitrogen atmosphere to obtain a resin solution. The resin solution was cooled, methylhydroquinone was used as a polymerization inhibitor, and tetrabutylphosphorus bromide was used as a catalyst. The addition of 20 mol% to the carboxyl group of the resin was carried out at 95-105°C for 16 hours. The addition reaction of glycidyl acrylate is taken out after cooling. The solid substance of the thus obtained carboxyl group-containing photosensitive resin having both ethylenic unsaturated bonds and carboxyl groups has an acid value of 120 mgKOH / g, a non-volatile content of 71%, and a Mw of about 20,000. This resin solution is referred to...

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Abstract

The invention provides a curable resin composition, a dry film and a printed circuit board, and specifically provides a curable resin composition, which cannot degrade various characteristics of resolution, adhesiveness, film hardness, soldering resistance thermal performance and the like, and a cured material of which displays a low dielectric constant and a low dielectric loss angel tangent and displays stable insulation resistance, a dry film using the same and a printed circuit board. The curable resin composition contains at least any one of a carboxyl-containing resin and a perovskite-type compound; and the perovskite-type compound contains calcium carbonate, strontium titanate, barium zirconate, calcium zirconate, strontium zirconate and a composite oxide which takes the calcium carbonate, the strontium titanate, the barium zirconate, the calcium zirconate and the strontium zirconate as main components.

Description

Technical field [0001] The present invention relates to a curable resin composition, a dry film, and a printed circuit board, and in particular, to a curable resin composition suitable for use as a substrate material for high-frequency communication, a dry film using the same, and a printed circuit board. Background technique [0002] Generally, in printed circuit boards, from the standpoint of heat resistance and electrical insulation, as interlayer insulating materials and solder resist materials, modified epoxy acrylate compounds, epoxy resins, etc. are widely used as main materials. The component is a resin composition containing additional components such as fillers. [0003] However, there are the following problems: the dielectric constant of the cured product of the existing resin composition used in this substrate material is about 4.0, and the dielectric loss tangent is about 0.03, and the resin composition is used as a substrate material in a circuit In the case of a bo...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027H05K1/02
Inventor 舟越千弘峰岸昌司
Owner TAIYO INK MFG
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