Nano-sized boron nitride-enhanced high-thermal-conductivity aluminum nitride-silicon carbide composite circuit board substrate material and preparation method thereof

Abstract

The invention discloses a nano-sized boron nitride-enhanced high-thermal-conductivity aluminum nitride-silicon carbide composite circuit board substrate material. According to the material, aluminum nitride powder and silicon carbide powder are mixed for use, and high thermal conductivity and environmental protection property are achieved; a mixed solvent prepared from quaternary ammonium salt ionic liquid and absolute ethyl alcohol has the better wettability for powder compared with a traditional organic solvent; obtained composite alcohol group tape casting slurry has few bubbles, powder compatibility is good, a stable interpenetrating network structure can be formed, the slurry is large in viscosity and good in flowability, an obtained blank body is better in deguming and sintering stability, the thermal conduction and enhancement effect of the added nano-sized boron nitride is significant, and a sintering auxiliary agent and other raw materials are used in an auxiliary mode, so that the obtained substrate is good in density, low in content of harmful impurities affecting the thermal conductivity, better in thermal conduction and dissipation performance, low in porosity, high in yield, and capable of being widely used for various circuit boards.

Description

technical field [0001] The invention relates to the technical field of ceramic substrate materials for circuit boards, in particular to a nano-boron nitride-reinforced high thermal conductivity aluminum nitride-silicon carbide composite circuit board substrate material and a preparation method thereof. Background technique [0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, aluminum oxide and beryllium oxide are mainly used as substrate materials for a long time. However, these two materials have low thermal conductivity and are toxic. And other defec...

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Problems solved by technology

[0003] Although the application prospects of aluminum nitride and silicon carbide ceramic substrates are broad, in the actual production process, there are relatively expensive raw materials, low high-temperature sintering density, cumbersome production process, low raw material utilization rate, and unsatisfactory actual thermal conductivity, etc. The problem restricts the large-scale use of this kind of material, and it is urgent to make further improvements in raw material preparation and production technology.