A growth method of a light-emitting composite layer and an LED epitaxial structure containing the structure
A technology of epitaxial structure and growth method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems that the brightness and antistatic ability cannot meet the actual needs, the crystallization quality of the light-emitting area is reduced, and the antistatic ability is not high, so as to reduce the Effects of lattice defects, enhancement of confinement, and improvement of antistatic ability
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Embodiment 1
[0061] Aixtron MOCVD is used to grow high-brightness GaN-based LED epitaxial wafers, specifically: high-purity H 2 or high purity N 2 or high purity H 2 and high purity N 2 The mixed gas as the carrier gas, high-purity NH 3 As the N source, the metal-organic source trimethylgallium (TMGa) is used as the gallium source, triethylgallium (TEGa) is used as the gallium source, trimethylindium (TMIn) is used as the indium source, and the N-type dopant is silane (SiH 4 ), trimethylaluminum (TMAl) as the source of aluminum, and the P-type dopant as magnesium dicene (CP 2 Mg), the substrate is sapphire, and the reaction pressure is between 100mbar and 800mbar.
[0062] An LED epitaxial structure, see figure 2, including the following structure: from bottom to top, it includes sapphire substrate 1, low-temperature buffer layer 2, undoped GaN layer 3, Si-doped N-type GaN layer 4, light-emitting composite layer 5', light-emitting layer 6, superlattice layer 7, a first Mg-doped P-ty...
Embodiment 2
[0088] The only difference from Embodiment 1 is: the number of single pieces included in the optical composite layer 5', and the number of single pieces in this embodiment is 9.
[0089] Sample 1 was prepared according to the existing LED growth method (see background art for details), and sample 2 and sample 3 were prepared according to the method of the present invention (Example 1-2). Samples 1-3 were plated with an ITO layer of about 150nm under the same pre-process conditions, plated with a Cr / Pt / Au electrode of about 70nm under the same conditions, and plated a protective layer of SiO under the same conditions 2 About 30nm, and then grind and cut the sample into (16mil*33mil) chip particles under the same conditions, and then test the photoelectric performance of samples 1-3 on the same testing machine, see brightness comparison for details image 3 , see the comparison of antistatic ability Figure 4 , because the effects of sample 3 and sample 2 are equivalent, so onl...
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