Adhesive and preparation method thereof

A technology of adhesives and additives, used in adhesives, inorganic adhesives, polymer adhesive additives, etc., can solve the problems of difficult to control the thickness of copper cladding, high sintering temperature, easy to shrink, etc. Strong force, high bending strength and repeatability

Inactive Publication Date: 2017-03-22
GUANGDONG REAL FAITH LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, sintering together has problems such as high sintering temperature, easy shrinkage, wrinkles

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0038] Example 1

[0039] An adhesive consisting of the following materials:

[0040] 90 parts by weight of alumina ceramic powder, 50 parts by weight of bisphenol A epoxy resin E-54, 2 parts by weight of polyethylene glycol 600, 2 parts by weight of polyoxypropylene oxide glyceryl ether, 1 part by weight of 2 -Methylimidazole, 5 parts by weight 1 μm CaCO 3 Powder, the acetone of 50 parts by weight.

[0041] To prepare the adhesive:

[0042] S1: Resin dissolution: Weigh 50 parts by weight of bisphenol A epoxy resin E-54, 5 parts by weight of 1 μm CaCO 3 The powder, 50 parts by weight of acetone, 2 parts by weight of polyethylene glycol 600 and 2 parts by weight of polyoxyethylene polyoxypropylene glyceryl ether are placed in a container, and the resin is stirred and dissolved to obtain a resin solution;

[0043] S2: Mixing: Weigh 90 parts by weight of alumina ceramic powder with an average particle size of 1 μm, and slowly add it to the resin solution described in step S1 ...

Example Embodiment

[0048] Example 2

[0049] An adhesive consisting of the following materials:

[0050] 70 parts by weight of alumina ceramic powder and 20 parts by weight of magnesium oxide ceramic powder, 50 parts by weight of glycidyl methacrylate, 2 parts by weight of polyethylene glycol 600, 2 parts by weight of glycerol polyether, 0.5 parts by weight Parts of cumene hydroperoxide, 5 parts by weight of CaO powder, 50 parts by weight of xylene.

[0051] To prepare the adhesive:

[0052]S1: Resin dissolution: Weigh 50 parts by weight of glycidyl methacrylate, 5 parts by weight of CaO powder, 50 parts by weight of xylene, 2 parts by weight of polyethylene glycol 600 and 2 parts by weight of glycerol polyether in a container In, stir and dissolve resin, obtain resin solution;

[0053] S2: Mixing: Weigh 70 parts by weight of alumina ceramic powder with an average particle size of 1 μm and 20 parts by weight of magnesium oxide ceramic powder with an average particle size of 1 μm, and slowly a...

Example Embodiment

[0058] Example 3

[0059] An adhesive consisting of the following materials:

[0060] 20 parts by weight of alumina ceramic powder and 10 parts by weight of magnesium oxide ceramic powder, 10 parts by weight of organosilicon-modified methyl methacrylate, 2 parts by weight of polyethylene glycol 600, 0.5 part by weight of polydimethyl base siloxane, 0.5 parts by weight of cumene hydroperoxide, 5 parts by weight of 1 μm SiO 2 Powder, the dehydrated alcohol of 10 weight parts.

[0061] To prepare the adhesive:

[0062] S1: Resin dissolution: Weigh 10 parts by weight of silicone-modified methyl methacrylate, 5 parts by weight of 1 μm SiO 2 The powder, 10 parts by weight of absolute ethanol, 2 parts by weight of polyethylene glycol 600 and 0.5 parts by weight of polydimethylsiloxane are placed in a container, and stirred to dissolve the resin to obtain a resin solution;

[0063] S2: Mixing: Weigh 20 parts by weight of alumina ceramic powder with an average particle size of 1 μm...

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PUM

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Abstract

The invention provides an adhesive. The adhesive comprises the following components in parts by weight: 30-90 parts of ceramic powder, 10-50 parts of organic resin, 0.1-5 parts of an auxiliary, 5-10 parts of packing and 10-50 parts of an organic solvent, wherein the ceramic powder is oxides ceramic powder, nitrides ceramic powder, carbides ceramic powder or borides ceramic powder; the grain size of the ceramic powder is 1-5 mu m; the organic resin is acrylate, polyurethane, organic silicon resin or epoxy resin; the auxiliary is a curing agent, a dispersing agent and a defoamer; and the packing is one or several of CaCO3, CaO and SiO2. The ceramic powder is used as a substrate, the organic resin is used as an adhesion carrier for adhesion to obtain a composite material with excellent pressure resistance and heat conduction property, a metal layer and a composite ceramic layer are high in adhesive strength after being combined, and the bending strength is high. A preparation method is simple in process and high in repeatability.

Description

technical field [0001] The invention belongs to the field of adhesive technology, and in particular relates to an adhesive and a preparation method thereof. Background technique [0002] Currently, in the field of LEDs, composite ceramic substrates have excellent insulation and thermal conductivity. Composite ceramics can be covered on the aluminum substrate or used as a heat dissipation substrate alone to increase heat dissipation performance, thereby improving the service life of LED lamps. In order to laminate metal (such as copper foil, etc.) and composite ceramics, the metal and composite ceramics are generally sintered at high temperature. However, sintering together has problems such as high sintering temperature, easy shrinkage, wrinkling, and foaming after copper cladding, and difficulty in controlling the thickness of copper cladding. [0003] How to not only avoid the use of high-temperature sintering method to clad metal on composite ceramics, but also separate...

Claims

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Application Information

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IPC IPC(8): C09J1/00C09J11/04C09J11/06C09J11/08
CPCC09J1/00C09J11/04C09J11/06C09J11/08
Inventor 董睿智丁天昊丁萍
Owner GUANGDONG REAL FAITH LIGHTING TECH
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