Adhesive and preparation method thereof

Abstract

The invention provides an adhesive. The adhesive comprises the following components in parts by weight: 30-90 parts of ceramic powder, 10-50 parts of organic resin, 0.1-5 parts of an auxiliary, 5-10 parts of packing and 10-50 parts of an organic solvent, wherein the ceramic powder is oxides ceramic powder, nitrides ceramic powder, carbides ceramic powder or borides ceramic powder; the grain size of the ceramic powder is 1-5 mu m; the organic resin is acrylate, polyurethane, organic silicon resin or epoxy resin; the auxiliary is a curing agent, a dispersing agent and a defoamer; and the packing is one or several of CaCO3, CaO and SiO2. The ceramic powder is used as a substrate, the organic resin is used as an adhesion carrier for adhesion to obtain a composite material with excellent pressure resistance and heat conduction property, a metal layer and a composite ceramic layer are high in adhesive strength after being combined, and the bending strength is high. A preparation method is simple in process and high in repeatability.

Description

technical field [0001] The invention belongs to the field of adhesive technology, and in particular relates to an adhesive and a preparation method thereof. Background technique [0002] Currently, in the field of LEDs, composite ceramic substrates have excellent insulation and thermal conductivity. Composite ceramics can be covered on the aluminum substrate or used as a heat dissipation substrate alone to increase heat dissipation performance, thereby improving the service life of LED lamps. In order to laminate metal (such as copper foil, etc.) and composite ceramics, the metal and composite ceramics are generally sintered at high temperature. However, sintering together has problems such as high sintering temperature, easy shrinkage, wrinkling, and foaming after copper cladding, and difficulty in controlling the thickness of copper cladding. [0003] How to not only avoid the use of high-temperature sintering method to clad metal on composite ceramics, but also separate...

AI Technical Summary

Problems solved by technology

However, sintering together has problems such as high sintering temperature, easy shrinkage, wrinkles, and blisters after copper cladding, and difficulty in controlling the thickness of copper cladding.