Heat curing adhesive for oil filter and preparation method of heat curing adhesive
An oil filter, heat curing technology, applied in the direction of adhesives, adhesive types, non-polymer adhesive additives, etc. Thermal and antistatic properties, good thermal and mechanical properties, durability and good aging resistance
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Embodiment 1
[0027] Preparation of Embodiment 1 Modified Imidazole Derivatives
[0028] Get 12.4g of 2,3-dimethylol substituted imidazole and 24.8g of succinic anhydride and mix, add ethanol to dissolve in the ratio of 1:8 by the mass ratio of the mixture and ethanol, and add phosphotungstic acid as a catalyst at the same time, the phosphotungstic acid The mass fraction of the acid in the system was 0.5%, reacted at 80°C for 2.5h, then distilled under reduced pressure to remove ethanol and unreacted succinic anhydride, and then used column chromatography to further remove unreacted 2,3 - Substituting imidazole with dimethylol to obtain a modified imidazole derivative, and the yield of the modified imidazole derivative is 90.24%.
Embodiment 2
[0029] Embodiment 2 heat curing adhesive preparation
[0030] The thermosetting adhesive of Example 2 of the present invention is composed of the following preparation raw materials in percentage by weight: 20% of polyvinyl chloride paste resin, 10% of epoxy resin, 20% of plasticizer, 1.5% of modified imidazole derivatives, ethylene Distearic acid amide 4%, calcium carbonate 35%, odorless kerosene 1%, pentaerythritol palmitate 3%, calcium oxide 4% and calcium zinc stabilizer 1.5%;
[0031] Wherein, the plasticizer is composed of dioctyl terephthalate, dodecylpyrrolidone and epoxy butyl furfurate with a mass ratio of 1:0.6:0.2; the modified imidazole derivative is the product obtained in Example 1 .
[0032] Preparation:
[0033] (1) Mix polyvinyl chloride paste resin and plasticizer, and carry out high-speed dispersion and stirring for 30 minutes;
[0034] (2) Stabilize the high-speed dispersed material in step (1) with epoxy resin, modified imidazole derivatives, ethylene ...
Embodiment 3
[0036] Embodiment 3 thermosetting adhesive preparation
[0037] The thermosetting adhesive of Example 3 of the present invention consists of the following preparation raw materials in percentage by weight: 15% of polyvinyl chloride paste resin, 15% of epoxy resin, 25% of plasticizer, 1% of modified imidazole derivative, ethylene Distearic acid amide 2%, calcium carbonate 30%, odorless kerosene 2%, pentaerythritol palmitate 4%, calcium oxide 3% and calcium zinc stabilizer 3%.
[0038]Wherein, the plasticizer is composed of dioctyl terephthalate, dodecylpyrrolidone and epoxy butyl furfurate with a mass ratio of 1:1:0.6; the modified imidazole derivative is the product obtained in Example 1 .
[0039] The preparation method is the same as in Example 1.
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