UV visbreaking adhesive

A viscose and anti-aging agent technology, applied in the direction of adhesives, adhesive types, ester copolymer adhesives, etc., can solve problems such as low initial adhesion, insufficient initial peeling force, and high initial viscosity of UV viscosifying adhesives. Achieve the effects of good fluidity, low peeling force and less solvent

Inactive Publication Date: 2018-10-02
黄志萍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the problem that the initial viscosity of the UV viscosifying adhesive in the existing domestic technology is too large, the initial peeling force is not high enough after film formation, and the vi...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0022] Methyl methacrylate 35%, acrylic acid 6%, diisooctyl maleate 5%, methoxyethyl acrylate 5%, crosslinking agent pentaerythritol triacrylate 1%, diethylene glycol divinyl ether 1% , Initiator dibenzoyl peroxide 1%. Heating and controlling the temperature at 80°C, stirring the reaction for 0.5h. Then add 1% diphenyl titanocene fluoride and continue the reaction for 1h. After cooling, add anti-aging agent 0.5% bisphenol A, anti-aging agent RD 0.5%, active diluent diethylene glycol divinyl ether 35%, heat curing agent IPDI 4%, solvent ethyl acetate 5%. The UV protective film using it as an adhesive has an initial peel force of 15.95 N / 25 mm and a peel force of 0.04 N / 25 mm after UV irradiation.

example 2

[0024] Ethyl methacrylate 40%, butyl acrylate 10%, ethoxyethyl acrylate 5%, crosslinking agent pentaerythritol triacrylate 1%, tripropylene glycol diacrylate 1%, initiator azobisisobutyronitrile 0.5%, heating and controlling the temperature at 70°C, stirring for 1h. Add 1% of 2-hydroxy-2-methyl-1-phenylacetone and continue the reaction for 1.5h. Add after cooling, anti-aging agent 2641.5%, reactive diluent tripropylene glycol diacrylate 37%, heat curing agent HDI 3%. The UV protective film using it as an adhesive has an initial peel force of 14.82 N / 25 mm and a peel force of 0.13 N / 25 mm after UV irradiation.

example 3

[0026] Methyl methacrylate 30%, butyl acrylate 15%, diisooctyl maleate 2%, crosslinking agent pentaerythritol triacrylate 1%, initiator dicumyl peroxide 2%, heating and controlling the temperature at 60°C, stirred and reacted for 1.5h. Add 0.5% of 1-hydroxycyclohexanebenzophenone and continue the reaction for 1h. Add antioxidant 445 0.5% after cooling, antioxidant AW 1%, active diluent tripropylene glycol diacrylate 35%, thermal curing agent N-100 3%, HDI 1%, solvent acetone 4%, petroleum ether 5% . The UV protective film using it as an adhesive has an initial peel force of 15.48 N / 25 mm and a peel force of 0.08 N / 25 mm after UV irradiation.

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PUM

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Abstract

The invention discloses a UV visbreaking adhesive. The UV visbreaking adhesive is prepared from 30% to 60% of a reactive monomer, 30% to 50% of reactive diluent, 0.01% to 5% of an initiator, 1% to 5%of a crosslinking agent, 0. 05% to 5% of a heat curing agent, 0.1% to 5% of an anti-aging agent, 0 to 30% of solvent. The UV visbreaking adhesive has the advantages of low initial viscosity, good fluidity, acid resistance, oil resistance and solvent resistance. The UV visbreaking adhesive is applied to a UV protective film and the UV protective film has the advantages of high peeling force, no reduced viscosity after sunlight exposure, reduced viscosity after UV illumination, and low peeling force.

Description

technical field [0001] The invention belongs to the field of polymer adhesive development. Background technique [0002] Semiconductors are key components of household digital products and electronic devices. In the manufacture of large-scale integrated circuits and the manufacture and processing of semiconductor devices, the essential basic material is the semiconductor chip. Semiconductor chips are processed from single crystal silicon wafers, which are referred to as wafers for short. When cutting and grinding wafer materials, a special protective film is required for bonding and fixing. After the processing is completed, the processed wafer slices are completely peeled off from the fixed adhesive film, without affecting the wafer material itself. Crystal (decorative glass) is used in daily life such as lamps and clothing. Optical glass used in optical instruments also needs to be cut and ground. During the processing, a protective film is also required to fix it, and ...

Claims

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Application Information

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IPC IPC(8): C09J133/12C09J7/30C08F220/14C08F220/06C08F222/14C08F220/28C08F220/18
CPCC09J133/12C08F220/14C08F220/06C08F222/14C08F220/281C08F222/104C08F220/1804
Inventor 黄志萍熊琰
Owner 黄志萍
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