UV visbreaking adhesive

Abstract

The invention discloses a UV visbreaking adhesive. The UV visbreaking adhesive is prepared from 30% to 60% of a reactive monomer, 30% to 50% of reactive diluent, 0.01% to 5% of an initiator, 1% to 5%of a crosslinking agent, 0. 05% to 5% of a heat curing agent, 0.1% to 5% of an anti-aging agent, 0 to 30% of solvent. The UV visbreaking adhesive has the advantages of low initial viscosity, good fluidity, acid resistance, oil resistance and solvent resistance. The UV visbreaking adhesive is applied to a UV protective film and the UV protective film has the advantages of high peeling force, no reduced viscosity after sunlight exposure, reduced viscosity after UV illumination, and low peeling force.

Description

technical field

[0001] The invention belongs to the field of polymer adhesive development. Background technique

[0002] Semiconductors are key components of household digital products and electronic devices. In the manufacture of large-scale integrated circuits and the manufacture and processing of semiconductor devices, the essential basic material is the semiconductor chip. Semiconductor chips are processed from single crystal silicon wafers, which are referred to as wafers for short. When cutting and grinding wafer materials, a special protective film is required for bonding and fixing. After the processing is completed, the processed wafer slices are completely peeled off from the fixed adhesive film, without affecting the wafer material itself. Crystal (decorative glass) is used in daily life such as lamps and clothing. Optical glass used in optical instruments also needs to be cut and ground. During the processing, a protective film is also required to fix it, and ...