A kind of manufacturing method of lead-free tg140 ​​copper clad laminate

A technology of TG140 and production method, which is applied in the production field of lead-free TG140 copper-clad laminates, can solve the problems of white spots on thick copper foil plates, low glass transition point temperature, and rising production costs, and achieve the improvement of glass transition point temperature and Heat resistance, low cost, effect of improving heat resistance and chemical resistance

Active Publication Date: 2021-02-26
LONGYU ELECTRONICS MEIZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing ordinary TG140 copper clad laminates are made of ordinary TG140 copper clad laminates due to the use of epoxy resin as the main resin to react with amine curing agents such as dicyandiamide. The disadvantages mainly include low glass transition point temperature (TG for short) and poor heat resistance , poor chemical resistance, etc.
At present, the European Union advocates the use of environmentally friendly materials. Lead is prohibited from being used in PCB processing, and other alloy materials with higher melting points are used in the tin-spraying process. As a result, ordinary TG140 copper-clad laminates cannot meet the high-temperature operation requirements of PCBs. Generally, the industry will use higher TG150 and TG170 copper clad laminates as substitutes, but the production cost of PCB will increase a lot, and the chemical resistance of ordinary TG140 copper clad laminates is poor. The resin on the surface of the copper area will be bitten off, and abnormal white spots will appear, so thick copper foil plates are prone to white spots
At the same time, after the process of PCB processing, the glass cloth leaks out due to solvent erosion, and the removal of some surface resin will also cause white spots on the substrate.
Therefore, the poor chemical resistance of ordinary TG140 copper clad laminates needs to be further improved

Method used

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  • A kind of manufacturing method of lead-free tg140 ​​copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] A kind of manufacture method of lead-free TG140 copper-clad laminate of the present invention, the method comprises the following steps:

[0046] (1) the coupling agent of 2 weight parts, the low bromine bisphenol A type epoxy resin of 300 weight parts, the isocyanate modified epoxy resin of 100 weight parts, the high bromine epoxy resin of 5 weight parts, 10 weight parts The four-functional epoxy resin and 100 parts by weight of phenol-type novolac resin are added to the dissolution tank, and the cooling circulating water is started to ensure the temperature of the dissolution tank at 30±5°C, and then keep stirring at a speed of 650-750r / min for 1 hour to Completely even and set aside.

[0047] (2) Add 100 parts by weight of acetone, 100 parts by weight of propylene glycol methyl ether, and 10 parts by weight of cyclohexanone to the dissolving tank, continue to maintain the temperature of the dissolving tank after the addition is completed, and continue stirring for 1 ...

Embodiment 2

[0059] A kind of manufacture method of lead-free TG140 copper-clad laminate of the present invention, the method comprises the following steps:

[0060] (1) the coupling agent of 2.486 parts by weight, the low bromine bisphenol A type epoxy resin of 446.02 parts by weight, the isocyanate modified epoxy resin of 198 parts by weight, the high brominated epoxy resin of 9.823 parts by weight, 21.27 parts by weight The four-functional epoxy resin and 207.9 parts by weight of phenol-type novolac resin were added to the dissolution tank, and the cooling circulating water was started to keep the temperature of the dissolution tank at 30±5°C, and then kept stirring at a speed of 700r / min for 1 hour until completely uniform ,spare. Specifically, the novolak resin is or bisphenol A novolak resin.

[0061] (2) The acetone of 117.68 parts by weight, the propylene glycol methyl ether of 162 parts by weight, the cyclohexanone of 32.34 parts by weight are added to the dissolving tank, contin...

Embodiment 3

[0073] A kind of manufacture method of lead-free TG140 copper-clad laminate of the present invention, the method comprises the following steps:

[0074] (1) the coupling agent of 5 parts by weight, the low bromine bisphenol A type epoxy resin of 500 parts by weight, the bisphenol A type epoxy resin of the epoxy value of 300 parts by weight of 0.44, the high bromine of 15 parts by weight Epoxy resin, 30 parts by weight of four-functional epoxy resin and 300 parts by weight of bisphenol A novolac resin are added to the dissolution tank, start the cooling water circulation to ensure the temperature of the dissolution tank at 30 ± 5 ° C, and then maintain the speed Stir at 750r / min for 1 hour until completely uniform, set aside.

[0075](2) the methyl ethyl ketone of 200 weight parts, the propylene glycol methyl ether of 200 weight parts, the cyclohexanone of 50 weight parts are added dissolving tank, continue to keep the temperature of dissolving tank after adding, continue to st...

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Abstract

The invention discloses a method for making lead-free TG140 copper-clad laminates, which belongs to the technical field of copper-clad laminates. Oxygen resin, high-bromine epoxy resin, four-functional epoxy resin, novolak resin, ketone organic solvent, propylene glycol methyl ether, cyclohexanone, aluminum hydroxide and silicon dioxide were added to the dissolution tank in sequence and stirred evenly; After leaving it for 15 minutes, dissolve the imidazole accelerator with propylene glycol methyl ether and add it to the dissolving tank, stir until it is evenly mixed, then let it stand and mature for 6-10 hours to obtain the glue; soak the glass fiber cloth in the glue and then pass through Squeeze the rubber roller to squeeze out the excess glue, then enter the drying box for drying to remove the solvent, and obtain the prepreg; the prepreg products are stacked and prefabricated according to the process requirements, and copper foil is laid on top and bottom, and combined according to the process requirements, it is transported into the heat Perform hot pressing in a press to obtain lead-free TG140 copper-clad laminates; the present invention aims to provide a method for manufacturing lead-free TG140 copper-clad laminates.

Description

technical field [0001] The present invention relates to a copper-clad laminate, and more specifically, to a method for manufacturing a lead-free TG140 copper-clad laminate. Background technique [0002] The existing ordinary TG140 copper clad laminates are made of ordinary TG140 copper clad laminates due to the use of epoxy resin as the main resin to react with amine curing agents such as dicyandiamide. The disadvantages mainly include low glass transition point temperature (TG for short) and poor heat resistance , Poor chemical resistance and so on. At present, the European Union advocates the use of environmentally friendly materials. Lead is prohibited from being used in PCB processing, and other alloy materials with higher melting points are used in the tin-spraying process. As a result, ordinary TG140 copper-clad laminates cannot meet the high-temperature operation requirements of PCBs. Generally, the industry will use higher TG150 and TG170 copper clad laminates as su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B17/02B32B15/14B32B17/06B32B15/20B32B33/00B32B37/06B32B37/10C08L63/00C08K3/22C08K3/36C08K3/34C08G59/62C08J5/24
CPCB32B5/02B32B15/14B32B15/20B32B17/061B32B33/00B32B37/06B32B37/10B32B2260/021B32B2260/046B32B2262/101B32B2457/08C08G59/62C08J5/24C08J2363/00C08J2463/00C08K2003/2227C08L63/00C08L2201/08C08L2205/025C08L2205/035C08K3/22C08K3/36C08K3/346
Inventor 周强村刘海峰晏放雄陈祖贤
Owner LONGYU ELECTRONICS MEIZHOU
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