Vacuum film plating method with combined magnetic field, lined straight pipe and multihole baffle combined

Abstract

The invention discloses a vacuum film plating method with a combined magnetic field, a lined straight pipe and a multihole baffle combined, and belongs to the technical field of material surface treatment. The vacuum film plating method with the combined magnetic field, the lined straight pipe and the multihole baffle combined aims to solve the problems such as the pollution of macroparticles to athin film, the use limitation of a target material, the loss of magnetically-filtered arc plasma and the instability of high-power pulsed magnetron sputtering discharge in arc ion plating. Devices relating to the vacuum film plating method comprise a bias voltage power source, an arc ion plating target source, a power source of the arc ion plating target source, a multistage magnetic field device, a power source of the multistage magnetic field device, a movable coil device, a power source of the movable coil device, a waveform matching device, a high-power pulsed magnetron sputtering targetsource, a power source of the high-power pulsed magnetron sputtering target source, a combined device of the lined bias voltage straight pipe and the multihole baffle, a power source of the combined device of the lined bias voltage straight pipe and the multihole baffle and the like. Thin film deposition comprises the steps that the devices are connected; a system is started; when the vacuum degree in a vacuum chamber is less than 10<-4> Pa, a working gas is introduced into the vacuum chamber, a film plating power source is started, the bias voltage power source adjusts the energy of the plasma, the multistage magnetic field device and the movable coil device eliminate defects of the macroparticles and guide the transmission of the composite plasma, the loss in the vacuum chamber is reduced, and technical parameters are set.

Description

technical field [0001] The invention relates to a vacuum coating method in which a combined magnetic field is combined with a lined straight pipe and a porous baffle, and belongs to the technical field of material surface treatment. Background technique [0002] In the process of preparing thin films by arc ion plating, due to the arc spot current density as high as 2.5~5×10 10 A / m 2 , causing molten liquid metal to appear at the arc spot position on the target surface, which is splashed out in the form of droplets under the action of local plasma pressure, and adheres to the surface of the film or is embedded in the film to form "macroparticles" (Macroparticles) Defects (BoxmanR L, Goldsmith S. Macroparticle contamination in cathodic arc coatings: generation, transport and control [J]. Surf Coat Tech, 1992, 52(1): 39-50.). In the arc plasma, since the movement speed of electrons is much greater than that of ions, the number of electrons reaching the surface of large parti...

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Problems solved by technology

[0006] The purpose of the present invention is to solve the problem of low ionization rate and thin film deposition efficiency of traditional magnetron sputtering technology, the limitation of high melting point target material use, and the current high-power pulse magnetron sputtering. The plating method uses high melting point targets, low melting point pure metals (such as aluminum, tin) or multi-element alloy materials (such as AlSi alloys) and non-metallic materials (such as graphite and semiconductor materials Si) as targets that are prone to large particle defects, bending Low efficiency of arc plasma transmission caused by type magnetic filter technology, limitation of target element usage and uniform ablation, thin film deposition density and defects, deposition position limitation caused by vacuum chamber space and target source layout design, workpiece shape limitation and different target In order to solve problems such as contamination of film components caused by secondary sputtering of residues in multi-level magnetic field devices, pure metals with low melting points (such as aluminum, tin) or multi-element alloy materials (such as AlSi alloys) and non-metallic materials (such as graphite and Semiconductor material Si, etc.) as the target material of high-power pulsed magnetron sputtering, and then use the arc ion plating method to realize the high melting point refractory target material to produce continuous and stable plasma with high ionization rate, combined with multi-level magnetic field filtering method and The shape constraints of the lined bias straight tube and the porous baffle combined device and the composite effect of the bias electric field attraction eliminate the large particle defects contained in the arc plasma, and at the same time ensure that the arc plasma passes through the inner tube with high transmission efficiency. The combination device of lined bias straight pipe and porous baffle and multi-stage magnetic fiel

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