Flexible substrate with super flexibility and high electrical and thermal conductivity and preparation method thereof

Abstract

The invention discloses a flexible substrate with super flexibility and high electrical and thermal conductivity and a preparation method thereof. The method includes the following steps: S1, performing carbide black lead treatment on a polyimide film, doping nanometal to the polyimide film, and performing ion implantation and ion exchange; S2, performing plasma irradiation modification on the surface of the material obtained through the step S1, and forming a heteromorphic surface layer; and S3, forming a metal conductor layer on the heteromorphic surface layer through physical vapor deposition (PVD) or chemical vapor deposition (CVD), and obtaining the flexible substrate with super flexibility, high ductility and high electrical and thermal conductivity. Thus, C-C-FPC, C-C-COF or FCCL flexible circuit substrates with super flexibility, high ductility, high conductivity, high thermal conductivity and high frequency performance can be obtained through the method.

Description

technical field [0001] The invention relates to the field of electronic circuit board materials, in particular to a super-flexible flexible base material with high electrical and thermal conductivity and a preparation method thereof. Background technique [0002] With the advent of the 5G era and the application of mobile phone flexible screens, flexible electronic technology is a popular integrated technology in the future. Flexible electronic substrates FCCL for flexible printed circuit applications are facing new challenges. The development of 5G applications has subversively changed traditional communication devices and prompted the emergence of new flexible electronic materials to meet the requirements of high temperature, high pressure, high frequency, high speed, high density, and low power consumption. Traditional flexible electronic materials are facing changes. [0003] Flexible electronic materials include flexible printed circuit FPC, COF, and substrate materia...

AI Technical Summary

Problems solved by technology

[0004] Flexible electronic material FCCL is a flexible printed circuit board (FPC / COF) circuit processing substrate, with or without adhesive, FCCL is called two-layer flexible copper clad laminate (2L-FCCL), mainly used for high-end FPC and COF packaging substrates (English is Chip OnFlex / Chip On Film), the three-layer method is coated on the polyimide film, and the adhesive is combined with the copper foil to form a substrate, which is called a copper clad plate. There is also a sputtering method, which is coated on the polyimide Electroplated copper layer on the film, but it has disadvantages such as complex process, high cost, easy short circuit, serious environmental protection problems, etc.