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Sheet molding compound, and composition, preparation and application thereof

A sheet molding compound and composition technology, applied in the field of electromagnetic shielding materials, can solve the problems of difficult mechanization, high cost, unfavorable practical application, etc., achieve high electromagnetic shielding efficiency, large electromagnetic wave loss, and prevent absorption saturation.

Active Publication Date: 2020-08-25
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, multi-layer materials in the prior art are faced with many problems such as complex process, difficulty in comprehensive mechanization of the processing process, high cost, etc., and it is difficult to realize high-quality industrialization and automatic production, and to obtain high-quality, stable large-scale products
[0004] Compared with composite materials with multi-layer structure, sheet molding compound not only has superior corrosion resistance and designability, but also has excellent mechanical properties and processing properties. Its mechanical properties are comparable to some metal materials. Product preparation The process is more mature, fast, stable, and easy to control. Products obtained by pressing sheet molding compounds usually have a wider service temperature and higher rigidity. However, based on the structural characteristics of sheet molding compounds in the prior art, in order to achieve higher Good shielding ability, which requires a high volume content of functional fillers, which is not good for practical applications

Method used

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  • Sheet molding compound, and composition, preparation and application thereof
  • Sheet molding compound, and composition, preparation and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Composite SMC type electromagnetic shielding material is prepared through the following process:

[0076] (1) Prepare resin paste, including:

[0077] Prepare resin paste A:

[0078] In terms of parts by mass, 100 parts of 9508 isophthalic unsaturated polyester resin, 80 parts of aluminum hydroxide, 10 parts of tetraacicular zinc oxide whiskers with an average particle size of 200 μm, and iron-silicon aluminum alloy with an average particle size of 10 μm 40 parts of powder, 3 parts of mold release agent zinc stearate, 3 parts of thickener magnesium oxide, 1 part of curing agent (2-ethylhexyl) tert-butyl peroxide, 8 parts of low shrinkage agent polystyrene, anti Oxygen agent 2,5, 2 parts of di-tert-butylhydroquinone and 2 parts of KH550 silane coupling agent are mixed to form resin paste A;

[0079] Prepare resin paste B:

[0080] In parts by mass, 100 parts of 9508 isophthalic unsaturated polyester resin, 400 parts of carbonyl iron with an average particle diameter o...

Embodiment 2

[0091] Composite SMC type electromagnetic shielding material is prepared by the same process as in Example 1, wherein:

[0092] Resin paste A contains 100 parts of 9508 isophthalic unsaturated polyester resin, 90 parts of second filler, 3 parts of release agent zinc stearate, 3 parts of thickener magnesium oxide, curing agent (2-ethylhexyl) 1 part of tert-butyl peroxide, 10 parts of low shrinkage agent polystyrene, 0.5 part of anti-aging agent p-phenylenediamine and 2 parts of KH560 silane coupling agent;

[0093] Resin paste B contains 100 parts of 9508 isophthalic unsaturated polyester resin, 300 parts of first filler, 3 parts of release agent zinc stearate, 3 parts of thickener magnesium oxide, curing agent (2-ethylhexyl) 1 part of tert-butyl peroxide, 10 parts of low shrinkage agent polystyrene, 0.5 part of anti-aging agent p-phenylenediamine and 2 parts of KH560 silane coupling agent;

[0094] The fiber is 30 parts, cut into 20mm long, choose carbon fiber;

[0095] The ...

Embodiment 3

[0101] Composite SMC type electromagnetic shielding material is prepared by a process similar to Example 1, the difference is only that the SMC sheet after curing in step (3) is in the pressing process, and the surface layer is added with copper mesh for co-curing.

[0102] in:

[0103] Resin paste A contains 100 parts of 9508 isophthalic unsaturated polyester resin, 90 parts of second filler, 3 parts of release agent stearic acid, 4 parts of thickener magnesium oxide, curing agent (2-ethylhexyl) 1 part of tert-butyl oxide, 8 parts of low shrinkage agent polystyrene, 1 part of antioxidant diaryl secondary amine and 2 parts of KH550 silane coupling agent;

[0104] Resin paste B contains 100 parts of 9508 isophthalic unsaturated polyester resin, 320 parts of first filler, 3 parts of release agent stearic acid, 4 parts of thickener magnesium oxide, curing agent (2-ethylhexyl) 1 part of tert-butyl oxide, 8 parts of low shrinkage agent polystyrene, 1 part of antioxidant diaryl secon...

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Abstract

The invention discloses a sheet molding compound as well as a composition, preparation and application thereof. The sheet molding compound comprises a resin layer and fibers distributed in the resin layer, wherein the resin layer comprises a first resin layer and a second resin layer which are different in electric conductivity and magnetic conductivity; the mass percentage of a first filler in the first resin layer does not exceed 150%; the mass percentage of a second filler in the second resin layer does not exceed 500%; the first filler comprises a conductive filler the volume of which is not more than 30% of the volume of the first resin layer, and a magnetic conductive filler the mass of which is not more than 100% of the mass of the first resin matrix; the second filler comprises a magnetic conductive filler the mass of which is not less than 100% of the mass of the second resin matrix. The sheet molding compound obtained by the invention has excellent electromagnetic shielding capability.

Description

technical field [0001] The invention relates to the technical field of electromagnetic shielding materials. Background technique [0002] With the rapid development of electronic communication technology in modern society and the continuous popularization of electronic equipment and electronic products, electromagnetic communication has penetrated into all aspects of social life. The energy density of electromagnetic waves in the environment has increased year by year. While bringing convenience to modern life, it also produces Some defects or problems that need to be overcome, such as excessive electromagnetic radiation will affect the normal life and health of human beings within a certain range, electromagnetic interference will occur and interfere with the normal operation of electronic equipment, and equipment exposed to strong electromagnetic environments for a long time Reliability and stability will be significantly reduced and so on. Electromagnetic hazards have at...

Claims

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Application Information

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IPC IPC(8): B32B9/00B32B9/04B32B17/02B32B17/10B32B27/12B32B27/20B32B27/36B32B33/00B29D7/01
CPCB32B17/064B29D7/01B32B5/02B32B5/08B32B9/045B32B27/12B32B27/20B32B27/36B32B33/00B32B2262/101B32B2262/106B32B2307/206B32B2307/212B32B2307/714
Inventor 梅启林罗成倪圣巫炼王宏华
Owner WUHAN UNIV OF TECH
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