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Sheet molding compound, its composition and its preparation and application

A sheet molding compound and composition technology, which can be used in applications, other household appliances, flat products, etc., can solve the problems of high volume content of functional fillers, unfavorable practical application, and difficulty in mechanization, and improve the electromagnetic shielding effect. Corrosion resistance, high electromagnetic shielding effect

Active Publication Date: 2021-09-28
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the multi-layer materials in the existing technology are faced with many problems such as complex processes, difficulty in fully mechanizing the processing process, and high cost. It is difficult to achieve high-quality industrialization and automatic production, and to obtain high-quality, stable large-scale products.
[0004] Compared with composite materials with multi-layer structure, sheet molding compound not only has superior corrosion resistance and designability, but also has excellent mechanical properties and processing properties. Its mechanical properties are comparable to some metal materials. Product preparation The process is more mature, fast, stable, and easy to control. Products obtained by pressing sheet molding compounds usually have a wider service temperature and higher rigidity. However, based on the structural characteristics of sheet molding compounds in the prior art, in order to achieve higher Good shielding ability, which requires a high volume content of functional fillers, which is not good for practical applications

Method used

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  • Sheet molding compound, its composition and its preparation and application
  • Sheet molding compound, its composition and its preparation and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Composite SMC type electromagnetic shielding material is prepared through the following process:

[0076] (1) Prepare resin paste, including:

[0077] Prepare resin paste A:

[0078] In terms of parts by mass, 100 parts of 9508 isophthalic unsaturated polyester resin, 80 parts of aluminum hydroxide, 10 parts of tetraacicular zinc oxide whiskers with an average particle size of 200 μm, and iron-silicon aluminum alloy with an average particle size of 10 μm 40 parts of powder, 3 parts of mold release agent zinc stearate, 3 parts of thickener magnesium oxide, 1 part of curing agent (2-ethylhexyl) tert-butyl peroxide, 8 parts of low shrinkage agent polystyrene, anti Oxygen agent 2,5, 2 parts of di-tert-butylhydroquinone, 2 parts of KH550 silane coupling agent are mixed to form resin paste A;

[0079] Prepare resin paste B:

[0080] In parts by mass, 100 parts of 9508 isophthalic unsaturated polyester resin, 400 parts of carbonyl iron with an average particle diameter of 2...

Embodiment 2

[0091] Composite SMC type electromagnetic shielding material is prepared by the same process as in Example 1, wherein:

[0092] Resin paste A contains 100 parts of 9508 isophthalic unsaturated polyester resin, 90 parts of second filler, 3 parts of release agent zinc stearate, 3 parts of thickener magnesium oxide, curing agent (2-ethylhexyl) 1 part of tert-butyl peroxide, 10 parts of low shrinkage agent polystyrene, 0.5 part of anti-aging agent p-phenylenediamine and 2 parts of KH560 silane coupling agent;

[0093] Resin paste B contains 100 parts of 9508 isophthalic unsaturated polyester resin, 300 parts of first filler, 3 parts of release agent zinc stearate, 3 parts of thickener magnesium oxide, curing agent (2-ethylhexyl) 1 part of tert-butyl peroxide, 10 parts of low shrinkage agent polystyrene, 0.5 part of anti-aging agent p-phenylenediamine and 2 parts of KH560 silane coupling agent;

[0094] The fiber is 30 parts, cut into 20mm long, choose carbon fiber;

[0095] The ...

Embodiment 3

[0101] Composite SMC type electromagnetic shielding material was prepared through a process similar to that of Example 1, the only difference being that during the pressing process of the matured SMC sheet in step (3), red copper mesh was added to the surface layer for co-curing.

[0102] in:

[0103]Resin paste A contains 100 parts of 9508 isophthalic unsaturated polyester resin, 90 parts of second filler, 3 parts of release agent stearic acid, 4 parts of thickener magnesium oxide, curing agent (2-ethylhexyl) 1 part of tert-butyl oxide, 8 parts of low shrinkage agent polystyrene, 1 part of antioxidant diaryl secondary amine and 2 parts of KH550 silane coupling agent;

[0104] Resin paste B contains 100 parts of 9508 isophthalic unsaturated polyester resin, 320 parts of first filler, 3 parts of release agent stearic acid, 4 parts of thickener magnesium oxide, curing agent (2-ethylhexyl) 1 part of tert-butyl oxide, 8 parts of low shrinkage agent polystyrene, 1 part of antioxid...

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Abstract

The present invention discloses a type of mold molding, its composition, and its preparation and application. Among them, the chip -shaped molds include the resin layer and the fiber distributed in the resin layer.Different first resin layers and second resin layers, the quality of the first filler in the first resin layer does not exceed 150 %, and the quality of the second filler in the second resin layer is not over 500 %.The conductive fillers with 30 % of the volume of the first resin layer of the first resin layer do not exceed 100 % magnetic fillers with the mass of the first tree lipid matrix.100 % magnetic filler.The sheets obtained by the present invention have excellent electromagnetic shielding capabilities.

Description

technical field [0001] The invention relates to the technical field of electromagnetic shielding materials. Background technique [0002] With the rapid development of electronic communication technology in modern society and the continuous popularization of electronic equipment and electronic products, electromagnetic communication has penetrated into all aspects of social life. The energy density of electromagnetic waves in the environment is increasing year by year, which brings convenience to modern life. Some defects or problems that need to be overcome, such as excessive electromagnetic radiation will affect the normal life and health of human beings within a certain range, electromagnetic interference will occur and interfere with the normal operation of electronic equipment, and equipment exposed to strong electromagnetic environments for a long time Reliability and stability will be significantly reduced and so on. Electromagnetic hazards have attracted widespread ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B9/00B32B9/04B32B17/02B32B17/10B32B27/12B32B27/20B32B27/36B32B33/00B29D7/01
CPCB32B17/064B29D7/01B32B5/02B32B5/08B32B9/045B32B27/12B32B27/20B32B27/36B32B33/00B32B2262/101B32B2262/106B32B2307/206B32B2307/212B32B2307/714
Inventor 梅启林罗成倪圣巫炼王宏华
Owner WUHAN UNIV OF TECH
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