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Epoxy adhesive with low resin precipitation and preparation method thereof

A technology of epoxy adhesives and resins, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve problems that affect the overall viscosity or mechanical properties of adhesives, increase production and use costs, etc.

Active Publication Date: 2021-05-04
盛势达(广州)化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method may affect the overall viscosity or mechanical properties of the adhesive, or increase the cost of production and use

Method used

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  • Epoxy adhesive with low resin precipitation and preparation method thereof
  • Epoxy adhesive with low resin precipitation and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0031] The embodiment of the epoxy adhesive with low resin precipitation of the present invention includes the following components by mass content: 45% of epoxy resin, 10% of toughening agent, 20% of inorganic filler, 1% of functional auxiliary agent, 5% of curing agent %, active diluent 10%, thixotropic agent 2%, and porous material 7%. The epoxy resin is bisphenol A epoxy resin NPEL-128; the toughening agent is styrene-butadiene rubber core-shell toughening particles MX-125; the curing agent includes 1% organic urea UR500 and 4% Dicyandiamide / organic urea DICY; the reactive diluent is 1,4-butanediol diglycidyl ether; the thixotropic agent is fumed silica; the inorganic filler is micron calcium carbonate; the function The performance aid is epoxy modified silane coupling agent KH560; the porous material is porous calcium carbonate; the specific surface area of ​​the porous calcium carbonate is 220m 2 / g, the average particle size is 10μm; the oil absorption value is 90% of ...

Embodiment 2

[0034]The embodiment of the epoxy adhesive with low resin precipitation of the present invention includes the following components by mass content: 50% of epoxy resin, 12% of toughening agent, 14% of inorganic filler, 1% of functional auxiliary agent, 6% of curing agent %, active diluent 10%, thixotropic agent 3% and porous material 4%. The epoxy resin is bisphenol F type epoxy resin 170; the toughening agent is polybutadiene rubber core-shell toughening particles MX-153; the curing agent is modified imidazole PN23; the reactive diluent for C 12 ~C 14 Alkyl glycidyl ether; the thixotropic agent is organic bentonite; the inorganic filler is micron aluminum hydroxide; the functional additive is phosphoric acid ester; the porous material is porous aluminum hydroxide; The specific surface area of ​​porous aluminum hydroxide is 160m 2 / g, the average particle size is 15μm; the oil absorption value is 88% of its own mass content.

[0035] The preparation method of the epoxy adhe...

Embodiment 3

[0037] The embodiment of the epoxy adhesive with low resin precipitation of the present invention includes the following components by mass content: 39% of epoxy resin, 5% of toughening agent, 15% of inorganic filler, 0.5% of functional auxiliary agent, 32% of curing agent %, active diluent 5%, thixotropic agent 2%, and porous material 1.5%. The epoxy resin is cycloaliphatic epoxy resin 2021P; the toughening agent is carboxyl-terminated liquid nitrile rubber CTBN; the curing agent is methyl hexahydrophthalic anhydride; the reactive diluent is trimethylolpropane Triglycidyl ether; the thixotropic agent is organic bentonite; the inorganic filler is micron-sized silica; the functional additive is aminosiloxane coupling agent KH550; the porous material is porous di Silicon oxide; the specific surface area of ​​the porous calcium carbonate is 220m 2 / g, the average particle size is 10μm; the oil absorption value is 90% of its own mass content.

[0038] The preparation method of t...

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Abstract

The invention discloses an epoxy adhesive with low resin precipitation and a preparation method thereof, and belongs to the field of high polymer materials. The epoxy adhesive with low resin precipitation is prepared from the following components in percentage by mass: 15 to 60 percent of epoxy resin, 5 to 40 percent of toughening agent, 5 to 50 percent of an inorganic filler, 0 to 5 percent of a functional additive, 1 to 50 percent of a curing agent, 5 to 30 percent of a reactive diluent, 0.05 to 5 percent of a thixotropic agent and 0.5 to 30 percent of a porous material. According to the product, the porous material is added into the formula, so that the problem of resin precipitation in the thermocuring process of the epoxy adhesive can be effectively solved, the viscosity and the use effect of the epoxy adhesive cannot be influenced by the addition of the porous material, and the finally obtained epoxy adhesive product has excellent mechanical properties and adhesive properties. The invention also provides a preparation method of the epoxy adhesive with low resin precipitation, and the preparation method has simple operation steps and can realize industrial large-scale production.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to an epoxy adhesive with low resin precipitation and a preparation method thereof. Background technique [0002] Epoxy resin adhesives are widely used in the fixing and assembly of precision electronics and semiconductors due to their high mechanical properties, good adhesion, small curing shrinkage, and strong chemical resistance and heat resistance. Among them, heat-curing epoxy adhesives are more is very popular. However, during the heating and curing process of this adhesive, because its viscosity will decrease sharply with the increase of temperature before the curing starts, and at the same time, the slits and gaps in the dispensing part of the adhesive will induce capillary phenomenon, macroscopically It shows that the adhesive has obvious resin out (RBO) phenomenon at the edge of the dispensing position. The occurrence of the RBO phenomenon will greatly increase...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC09J163/00C09J11/04C09J11/06C09J11/08C08K2003/2227C08K2003/265C08L9/06C08K13/04C08K7/26C08K3/26C08K5/5435C08K7/24C08L9/00C08K3/22C08K5/521C08L13/00C08K3/346C08K3/36C08K5/544C08K3/34
Inventor 吴启华朱志通夏富民
Owner 盛势达(广州)化工有限公司
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