Wood and straw fiberboard utilizing inorganic adhesive and preparation method

Abstract

The invention discloses a wood and straw fiberboard utilizing an inorganic adhesive and a preparation method, and the wood and straw fiberboard comprises the following raw materials in parts by weight: 40-50 parts of light calcined magnesia powder, 2-5 parts of talcum powder, 1-3 parts of high-alumina cement, 0.2-0.5 part of phosphogypsum, 7-12 parts of fly ash or slag powder, 3-5 parts of activated bauxite filler, 1-3 parts of kaolin, 25-35 parts of straw fiber, wood chip or bamboo chip fiber, 22-30 parts of magnesium sulfate heptahydrate, 0.1-0.3 part of aluminum sulfate hexadecahydrate, 0.1-0.5 part of citric acid, 0.2-0.5 part of trisodium phosphate, 0.2-0.4 part of ferrous sulfate, 0.2-0.3 part of an AF high-efficiency water reducing agent, 0.01-0.02 part of sodium pyrophosphate, 0.01-0.02 part of oxalic acid, 0.05-0.1 part of sodium tetraborate decahydrate, 0.01-0.02 part of sodium fluosilicate, 0.05-0.1 part of sodium silicate, 0.01-0.02 part of potassium nitrite and 25-30 parts of water. The invention provides a preparation method of the artificial fiber board which has no toxic and harmful substances, has environmental protection, strong comprehensive physical properties, realizes preparation at normal temperature and is simple in process.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a wood and straw fiberboard using an inorganic adhesive and a preparation method. Background technique [0002] In recent years, with the rapid development of my country's wood-based panels, interior decoration and furniture industries, the amount of wood adhesives is huge. Due to the constraints of cost and process complexity, "three aldehydes" (urea-formaldehyde resin, phenolic resin, melamine-formaldehyde Resin) mainly, the advantages are good performance, low cost, simple and mature process, and the disadvantage is the release of formaldehyde. With the improvement of people's environmental requirements, many new adhesives have been developed, such as isocyanate fiberboard adhesives, which have good performance and do not contain formaldehyde, but have VOC volatilization, poor water resistance, general non-flammability, and relatively low cost. high. The most prom...

AI Technical Summary

Problems solved by technology

It can be seen from the above that the formula contains a large amount of magnesium chloride, and it is difficult to avoid a large amount of free chloride ions

[0005] In the literature that can be consulted, it is reflected that the preparation process of inorganic adhesives is relatively complicated, and the most prominent is that the process temperature is between 55 and 220 °C, and the energy consumption is relatively large.