Ceramic bond grinding tool
A ceramic bond and abrasive tool technology, applied in abrasives, grinding devices, manufacturing tools, etc., can solve the problems of uneven structure, difficulty in meeting use requirements, uneven pressure transmission, etc.
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Embodiment 1
[0018] The vitrified bonded grinding tool in this embodiment is a vitrified bonded grinding wheel, which is made of the following raw materials in mass percentage: 20% silicon carbide, 30% corundum, and 50% vitrified bond. The vitrified bond used is composed of the following components by mass percentage: 17% of kaolinite powder, 2% of low-melting glass powder, 3% of nano silicon dioxide, 12% of pyrophyllite, and the balance is feldspar powder. When preparing the vitrified bond, take the formula amount of each component, mill it in a ball mill for 2.5 hours, and then sieve it. Among them, the low melting point boron glass powder is composed of the following components in mass percentage: 36% silicon dioxide, 11% aluminum oxide, 31% boron trioxide, 7% potassium oxide, 15% sodium oxide; low melting point glass powder The refractoriness is 570°C. The average particle diameter of nano silicon dioxide is 600nm.
[0019] The vitrified bond grinding wheel of the present embodiment ...
Embodiment 2
[0021] The vitrified bonded grinding tool in this embodiment is a vitrified bonded grinding wheel, which is made of the following raw materials in mass percentage: 20% silicon carbide, 32% corundum, and 48% vitrified bond. The vitrified bond used is composed of the following components by mass percentage: 17% of kaolinite powder, 2% of low-melting glass powder, 3% of nano silicon dioxide, 12% of pyrophyllite, and the balance is feldspar powder; During preparation, each component in the formula amount is ball milled in a ball mill for 2.5 hours and then sieved to obtain the product. Among them, the low melting point boron glass powder is composed of the following components in mass percentage: 36% silicon dioxide, 11% aluminum oxide, 31% boron trioxide, 7% potassium oxide, 15% sodium oxide; low melting point glass powder The refractoriness is 570°C. The average particle diameter of nano silicon dioxide is 600nm.
[0022] The vitrified bond grinding wheel of the present embodi...
Embodiment 3
[0024] The vitrified bond grinding tool of the present embodiment is a vitrified bonded grinding wheel, made of the raw materials of the following mass percentages: silicon carbide 18%, corundum 32%, vitrified bond 50%; the vitrified bond adopted consists of the following mass percentages Component composition: 17% kaolinite powder, 2% low-melting glass powder, 3% nano-silica, 12% pyrophyllite, and the balance is feldspar powder; when the vitrified bond is prepared, take the components of the formula After ball milling in a ball mill for 2.5 hours, it is obtained by sieving. Among them, the low melting point boron glass powder is composed of the following components in mass percentage: 36% silicon dioxide, 11% aluminum oxide, 31% boron trioxide, 7% potassium oxide, 15% sodium oxide; low melting point glass powder The refractoriness is 570°C. The average particle diameter of nano silicon dioxide is 800nm.
[0025] The vitrified bond grinding wheel of the present embodiment is...
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