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Capillary structure of heat dissipation element, heat dissipation element and preparation method of capillary structure

A capillary structure and heat dissipation element technology, which is applied in heat exchange equipment, lighting and heating equipment, indirect heat exchangers, etc., can solve the problems of high production cost, complicated production process and high market price of capillary structure, and achieve a porous structure and Controllable size, simple material and equipment conditions, good surface quality and color effect

Pending Publication Date: 2022-05-27
AAC TECH NANJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the capillary structure of the heat dissipation element directly affects the performance of the heat dissipation element. The capillary structure requires strong capillary force and small water flow resistance. There are many types of liquid-absorbing cores with a capillary structure in the heat dissipation element of the prior art, such as foamed copper, copper mesh , composite copper mesh, etched capillary structure, but the production cost of these capillary structures is relatively high, the production process is more complicated, and the market price is also high, such as foamed copper or composite copper mesh, etc., and because foamed copper, copper mesh / composite Capillary structural elements such as copper mesh have a relatively large thickness, which cannot make the heat dissipation element thinner

Method used

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  • Capillary structure of heat dissipation element, heat dissipation element and preparation method of capillary structure
  • Capillary structure of heat dissipation element, heat dissipation element and preparation method of capillary structure
  • Capillary structure of heat dissipation element, heat dissipation element and preparation method of capillary structure

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preparation example Construction

[0041] like Figure 4 As shown, it is a schematic flow sheet of the preparation method of the heat dissipation element provided by the invention, which comprises: S1: mixing the copper powder and the pore-forming agent to obtain a mixed powder;

[0042] S2: the binder is dispersed in the solvent to obtain a mixed solvent;

[0043] S3: adding the mixed powder to the mixed solvent, fully stirring in the mixer;

[0044] S4: add stabilizer, dispersant, surfactant, antioxidant and continue to stir to obtain copper metal slurry;

[0045] S5: the copper metal paste is coated on the upper cover plate by a blade coating method or a screen printing method;

[0046] S6: drying the upper cover plate coated with copper metal slurry;

[0047] S7: Passing nitrogen and hydrogen into the sintering process at high temperature.

Embodiment 1

[0049] Example 1: Take the electrolytic copper powder with an average particle size of 10 μm and the ammonium chloride particles with a particle size of 70-100 μm obtained by ball milling or crushing and sieving, and mix them together in a mass ratio of 3:1 to obtain a mixed powder. The mixed powder accounts for 70% of the mass of the copper metal slurry, and acrylic resin (PMMA) is dispersed in the solvent xylene as a binder to obtain a PMMA-xylene solution with a mass fraction of 25%, and the mixed powder is added to 25 % PMMA-xylene solution, after the mixer is fully stirred, add phosphite with a mass fraction of 0.5% of the copper metal slurry as a stabilizer, and methyl pentane with a mass fraction of 0.5% of the copper metal slurry. Alcohol is used as a dispersant, sodium dodecyl sulfate with a mass fraction of 0.5% of the copper metal slurry is used as a surfactant, and citric acid with a mass fraction of 1% of the copper metal slurry is used as an antioxidant, and the s...

Embodiment 2

[0053] Example 2: Take the electrolytic copper powder with an average particle size of 1 μm and the ammonium chloride particles with a particle size of 70-100 μm obtained by ball milling or crushing and sieving, and mix them together in a mass ratio of 3:1 to obtain a mixed powder. The mixed powder accounts for 70% of the mass of the copper metal slurry. The mixed powder is added to 25% of PMMA-xylene solution. After the mixer is fully stirred, 0.5% of stabilizer and 0.5% of dispersant are added in turn. , 0.5% surfactant, 1% antioxidant, and continue to stir for 0.5 to 6h. Scratch the mixed copper metal paste onto the upper cover of a specific heat dissipation element, then put it in an oven at 90 to 110 ° C for 20 to 120 minutes, dry the solvent, and put it into the sintering furnace. Pour N2 / H2 into it, and sinter at 700-850° C. for 20-120 minutes to finally obtain an upper cover plate with capillary structural elements. The upper cover plate and the lower cover plate are ...

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Abstract

The invention relates to the technical field of heat dissipation, and particularly provides a capillary structure element of a heat dissipation element, which is characterized in that a capillary structure is prepared from copper metal slurry, and the copper metal slurry comprises copper powder, a binder, a solvent, a pore forming agent, a dispersant, a stabilizer, a surfactant and an antioxidant. The invention further provides a heat dissipation element comprising the capillary structure element and a preparation method of the heat dissipation element. The capillary structure element provided by the invention has the characteristics of simple preparation process, convenience in operation, controllable thickness, controllable size, controllable aperture, excellent capillary effect and the like, and is particularly suitable for preparing ultra-thin heat dissipation elements.

Description

【Technical field】 [0001] The invention belongs to the technical field of heat dissipation, and in particular relates to a capillary structure of a heat dissipation element, a heat dissipation element and a preparation method thereof. 【Background technique】 [0002] The high-frequency and high-speed development of electronic components and integrated circuit technology has caused electronic components to generate a lot of heat during operation. For example, the heat flux density during the operation of computer CPU has reached 60-100W / cm 2 , even as high as 103W / cm in semiconductor lasers 2 . The reliability of electronic equipment operation is extremely sensitive to temperature, and the reliability will decrease by 5% for every 1°C increase in the device temperature at the level of 70-80°C. High heat flow poses a great threat to the reliability of the normal operation of components, so heat dissipation has become a key issue in the development of miniaturization of electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04F28F9/00C23C2/00C23C2/26
CPCF28D15/046F28F9/001C23C2/00C23C2/26F28F2245/00F28F21/089F28F21/085H01L23/427H01L21/4871H01L21/4882H01L23/3736H05K1/0272B22F3/1021B22F3/1121B22F7/004B22F7/04B22F2007/047B23P2700/09F28D15/0233
Inventor 黄国创王和志张波
Owner AAC TECH NANJING
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