A
semiconductor apparatus, which comprises: a substrate having a
transistor; a first
electrode formed on the substrate and connected to the
transistor; a second
electrode formed on the substrate and electrically separated from the first
electrode; and an insulating film formed on the substrate so as to cover the first electrode, wherein, when a plane of the insulating film which is not on a side of the substrate is taken as a first plane, a surface facing the first plane of the first electrode is taken as a first surface, and a surface facing the first plane of the second electrode is taken as a second surface, a distance between a surface of the substrate and the second surface is larger than a distance between the surface of the substrate and the first surface. By virtue of having the above unique structure, the
semiconductor apparatus of the present invention is advantageous in that, when a finger or any other material which is electrostatically charged is brought closer to the substrate, the
static electricity is not discharged into the electrode but into the static-
electricity drawing wiring and then drawn out of the
semiconductor device, so that the semiconductor devices, the circuits and the like which are connected to the electrode can be prevented from suffering a damage due to the
static electricity and from losing the functions thereof.