Porous film and multilayer assembly using the same

A technology of porous film and laminate, applied in the direction of circuit substrate materials, electrical components, printed circuit parts, etc., can solve problems such as lack of mass production, low bonding strength of insulators and copper foil, and inability to use molecular weight, etc. It achieves the effects of high strength and tight adhesion of printing, excellent printing and drawing reproducibility, and excellent thin line drawing

Inactive Publication Date: 2009-03-11
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This dry layer inversion method is a method of volatilizing the solvent contained in the above-mentioned coating film and causing microphase separation. Therefore, there is a problem in that the resin (polymer compound) constituting the porous layer is limited to be soluble at a low temperature. Resins with a good solvent at the boiling point, high molecular weight compounds that are inherently insoluble and have a large molecular weight cannot be used
However, when the conductor wiring is finer pitched, when the copper foil is roughened, problems such as breakage or peeling of the wiring due to unevenness of the copper foil during etching occur.
On the other hand, when using copper foil that is not roughened, etching can be performed smoothly, but the adhesion strength between the insulator and the copper foil is lowered, and the entire wiring is easily peeled off.
[0008] In addition, the following problems will also aris...

Method used

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  • Porous film and multilayer assembly using the same
  • Porous film and multilayer assembly using the same
  • Porous film and multilayer assembly using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0453] In 100 parts by weight of a polyamide-imide resin solution (trade name "Byromax HR11NN" manufactured by Toyobo Co., Ltd.; solid content concentration 15% by weight, solvent NMP, solution viscosity 20dPa·s / 25°C), add as a water-soluble 30 parts by weight of polyvinylpyrrolidone (molecular weight: 50,000) of permanent polymer is made into a stock solution for film making. The stock solution was set at 25°C, and a film applicator was used on a PET film (S type, thickness 100 μm) manufactured by Teijin DuPont Co., Ltd. as a base material, and the gap between the film applicator and the base material was 127 μm. cast. After casting, it was quickly kept in a container at a humidity of about 100% and a temperature of 50° C. for 4 minutes. Then, after immersing in water and solidifying it, it naturally dried at room temperature without peeling off from a base material, and the laminated body in which the porous layer was laminated|stacked on the base material was obtained. Th...

Embodiment 2

[0456] Using 33.3 parts by weight of a water-soluble polymer, casting under the condition that the gap between the film applicator and the PET film substrate is 102 μm, except that, the same operation as in Example 1 is carried out to obtain a laminated film on the substrate. A laminate having a porous layer. The thickness of the porous layer was about 35 μm, and the total thickness of the laminated body was about 135 μm.

[0457] An adhesive tape peeling test was performed on the obtained laminate, and as a result, no interfacial peeling occurred between the base material and the porous layer. The laminated body was observed with an electron microscope. As a result, the porous layer was tightly bonded to the substrate. The average pore diameter of the pores existing on the surface of the porous layer was about 0.5 μm. connected micropores. In addition, the porosity inside the porous layer was 70%.

Embodiment 3

[0459] Using 40 parts by weight of a water-soluble polymer, casting under the condition that the gap between the film applicator and the PET film substrate is 51 μm, except that, the same operation as in Example 1 is carried out to obtain a laminated film on the substrate. A laminate having a porous layer. The thickness of the porous layer was about 15 μm, and the total thickness of the laminate was about 115 μm.

[0460] An adhesive tape peeling test was performed on the obtained laminate, and as a result, no interfacial peeling occurred between the base material and the porous layer. Observation of the laminate with an electron microscope revealed that the porous layer was closely bonded to the substrate, the average pore diameter of the pores existing on the surface of the porous layer was about 0.3 μm, the interior of the porous layer was basically homogeneous, and the average pore diameter was about 0.3 μm in the entire film. connected micropores. In addition, the poros...

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Abstract

To provide a porous-film layered product which has excellent porousness, has flexibility, and is excellent in handleability and formability; and a process for producing the layered product. [MEANS FOR SOLVING PROBLEMS] The porous-film layered product comprises a base and, superposed on at least one side thereof, a porous layer having many fine interconnecting pores having an average pore diameter of 0.01-10 [mu]m, and is characterized by suffering no interfacial separation between the base and the porous layer when examined in a tape peeling test by the following method. Tape peeling test A 24 mm-wide masking tape [Film Masking Tape No. 603(#25)] manufactured by Teraoka Seisakusho Co., Ltd. is applied to the surface of the porous layer of the porous-film layered product and press-bonded thereto with a roller having a diameter of 30 mm and a load of 200 gf. Thereafter, this sample is subjected to a T-peel test with a tensile tester at a peeling rate of 50 mm/min.

Description

technical field [0001] The present invention relates to a porous film laminate, which is laminated on at least one surface of a base material, and a method for producing the same, and a composite material using the porous film laminate, and a method for producing the same. porous layer. This porous film laminate can be used as a circuit board, heat dissipation material (radiator, heat sink), electromagnetic wave baffle or electromagnetic wave absorber, etc. by directly utilizing the pore characteristics of the porous layer or filling the pores with functional materials. Electromagnetic wave control materials, separators for batteries, capacitors (paper capacitors, plastic film capacitors, ceramic capacitors, mica capacitors, electrolytic capacitors, etc.), low dielectric constant materials, separators, cushioning materials, ink imaging sheets, test paper, insulation Materials, insulation materials, cell culture substrates, catalyst substrates (catalyst carriers) and a wide ra...

Claims

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Application Information

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IPC IPC(8): B32B5/18H05K3/00H05K1/03
Inventor 清水洁大和洋
Owner DAICEL CHEM IND LTD
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