Preparation method of coated copper-silver metal powder

A bimetallic and coated technology, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve problems affecting silver surface coating, different activity, aging, etc., and achieve excellent high temperature oxidation resistance and electrical conductivity, narrow powder particle size distribution, and improved oxidation resistance

Inactive Publication Date: 2010-03-10
GUIZHOU INST OF METALLURGY & CHEM ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the chemical replacement method, due to the presence of ammonia ions in the reaction system, the cuproammonium ions generated during the reaction undergo competitive adsorption on the surface of the copper powder, which affects the surface coating of silver. Most of the prepared copper-silver bimetallic powders For embellishment coating, the production and application prospects are greatly reduced; and the chemical reduction method introduces a high-strength reducing agent, the thermal stability of the prepared silver-coated copper powder is not enough, and it is easy to age with the aging of the reducing agent; The production process of the chemical method is too complicated and the production conditions are harsh, which is not conducive to industrial production
[0003] Chinese Patent Publication No. CN1704502A discloses "a pr

Method used

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Examples

Experimental program
Comparison scheme
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Example Embodiment

[0014] Example 1

[0015] Weigh 3.0g of micron copper powder to clean the surface oxides with 5% dilute sulfuric acid, and rinse with deionized water, activate with 30g / L stannous chloride aqueous solution for 3min, and then use 5g / L palladium chloride aqueous solution to sensitize After 1 min, wash and add 100ml deionized water, add the dispersant mixed according to PEG:PVP=2:1 and stir at high speed with an emulsifier to fully disperse; add dilute nitric acid at room temperature to adjust the PH value to 3.5, add ethylenediamine: Triaminoethylamine: Maleopimaric acid: Potassium citrate = 1.0g of ion shielding agent mixed with 1:1:1:1:1, stir; pass in a mixed gas such as nitrogen and argon to remove the air in the reactor for protection; 1.03g of silver nitrate was prepared into a solution, and slowly added dropwise to the copper powder sol while stirring. After full reaction, dilute ammonia was added dropwise to adjust the PH value to 11.0. After the reaction was fully stirred ...

Example Embodiment

[0016] Example 2

[0017] Weigh 3.0g of micron copper powder with 5% dilute sulfuric acid to clean the surface oxides, and wash with deionized water, activate with 40g / L stannous chloride aqueous solution for 4min, and then use 8g / L palladium chloride aqueous solution for sensitivity For 1.5min, wash and add 100ml deionized water, add dispersant mixed according to PEG:PVP=2:1 and stir at high speed with an emulsifier to fully disperse; add dilute nitric acid at room temperature to adjust the pH to 4.0, add isopropanol : Ethyl acetate: Glycine: Sodium citrate = 1:1:1:1 mixed ion masking agent, stir; pass nitrogen to remove the air in the reactor for protection; weigh 2.26g silver nitrate to prepare a solution, while stirring While slowly adding dropwise to the copper powder sol, after full reaction, add dilute ammonia water to adjust the PH value to 9.0, stir again after the reaction, pickling, water washing, alcohol washing, drying in a drying box at 70 ℃ to obtain copper and sil...

Example Embodiment

[0018] Example 3

[0019] Weigh 3.0g of micron copper powder to clean the surface oxides with 5% dilute sulfuric acid, and wash with deionized water, activate with 50g / L stannous chloride aqueous solution for 5min, and then use 10g / L palladium chloride aqueous solution to sensitize After 2min, wash and add 100ml deionized water, add the dispersant mixed according to PEG:PVP=2:1 and stir with an emulsifier at high speed to fully disperse; add dilute nitric acid at room temperature to adjust the PH value to 5.0, add dimercaptopropanol : Disodium ethylenediaminetetraacetate: hydrazine hydrate = 1:1:1 mixed ion masking agent 1.0g, stir; pass in a mixed gas such as nitrogen and argon to remove the air in the reactor for protection; weigh 2.96g silver nitrate Prepare it into a solution, slowly add dropwise to the copper powder sol while stirring, add dilute ammonia to adjust the PH value to 10.0 after the full reaction, and then fully stir the reaction and wash with water, acid, water,...

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Abstract

The invention discloses a preparation method of coated copper-silver metal powder which contains the pretreatment of copper powder, the preparation of silver solution and the preparation of copper-silver metal powder, wherein the preparation method of copper-silver metal powder comprises the following steps: dropwise adding dilute nitric acid in the sol of copper powder to adjusting the pH value to 3.0-5.0, adding ionic masking agent with the dosage of 1-30g/L, fully stirring, injecting inert protective gas such as nitrogen, argon or the like to remove the air in a reactor for protection, thenslowly dropping silver nitrate solution in the sol of copper powder while stirring to fully react for 30min, then dropping dilute ammonia water to adjusting the pH value to 7.0-11.0, continuously reacting for 30min, washing the reaction solution with deionized water, 5% of dilute sulphuric acid and ethanol solution for several times after the reaction and drying the obtained copper-silver metal powder at 60-80 DEG C to obtain the finished product. The product obtained by the method of the invention has excellent high temperature oxidation resistance and conductivity and narrow particle size distribution.

Description

technical field [0001] The invention relates to the technical field of materials, in particular to a method for preparing copper-silver bimetallic powder. Background technique [0002] For a long time, metal silver powder has been widely used in various fields due to its excellent properties such as electrical conductivity and oxidation resistance, which are unmatched by many other metal powders in terms of performance and application range. Compared with silver powder, the conductivity of copper powder is also very good, but due to the high activation of the surface of copper powder, the oxidation rate of copper powder is very high at very low temperature. After oxidation, the excellent conductivity is gone, and the direct application of copper powder is deadlocked. How to ensure the oxidation resistance of copper powder under the premise of ensuring the excellent electrical conductivity and production cost of copper powder has always been the research goal of the authors ...

Claims

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Application Information

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IPC IPC(8): B22F1/02C23C18/42
Inventor 薛涛聂登攀赵伟毅彭优
Owner GUIZHOU INST OF METALLURGY & CHEM ENG
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