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Method for recovering silicon carbide and polyglycol cutting solution from silicon slice cutting waste mortar

A technology of silicon wafer cutting and polyethylene glycol, applied in the direction of lubricating compositions, etc., can solve the problems of low recovery rate, aggravated environmental burden, large amount of waste water, etc., achieve less water and volatile matter content, improve cutting efficiency, and reduce particle size distribution concentration effect

Inactive Publication Date: 2011-04-27
钱丽君
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The price of new silicon carbide and polyethylene glycol is very expensive, but the price of silicon carbide and polyethylene glycol products obtained through the recycling technology of this invention is only half of the new product or even lower, and its use effect is the same as that of new silicon carbide , there is no difference in the use effect of polyethylene glycol, so it will bring very considerable economic benefits to a large number of silicon wafer cutting enterprises; at present, there is no mature set of offline recycling, silicon carbide, polyethylene glycol systems in the world
[0009] At present, the known silicon chip cutting waste liquid recovery technology is mainly based on simple chemical treatment methods, especially the recovery of silicon carbide. The application number: 200710117665.0, the invention name is "a single crystal and polycrystalline silicon wire cutting mortar recovery technology" The recovery method disclosed in the patent application of the invention: "Reduce the waste mortar to PEG liquid and SiC powder solid,...waste mortar stock solution → primary membrane filtration → PEG liquid; waste mortar stock solution → primary membrane filtration → cleaning treatment → powder dryingpowder classification → SiC powder”, the drawbacks of the technical solution adopted for this invention patent application: excavate the pool on the ground, add acid and alkali to react, on the one hand, the acid and alkali water will gradually penetrate into the soil and damage the environment; on the other hand, the water in the pool The water cannot be reused, resulting in a large amount of waste water, increasing the burden on the environment; and recycling silicon carbide, the recovery rate is low, and the purity of silicon carbide is also low

Method used

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  • Method for recovering silicon carbide and polyglycol cutting solution from silicon slice cutting waste mortar
  • Method for recovering silicon carbide and polyglycol cutting solution from silicon slice cutting waste mortar
  • Method for recovering silicon carbide and polyglycol cutting solution from silicon slice cutting waste mortar

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Embodiment 1

[0043] The method for reclaiming silicon carbide and polyethylene glycol cutting fluid from silicon chip cutting waste mortar of the present embodiment comprises the following steps:

[0044] Stir the silicon wafer cutting waste mortar evenly with a stirrer at room temperature, add 1% polyethylene glycol solution and water, control its temperature at 25°C, put it into a six-stage hydrocyclone separator, and keep the pressure at 0.5bar; under this pressure, the cyclone separator separates to obtain upper liquid flow and lower liquid flow: the lower liquid flow contains most of the silicon carbide larger than 5um; the upper liquid flow contains most of the silicon, a large amount Moisture, silicon carbide less than 5um;

[0045] The liquid flow obtained by the hydrocyclone separator is poured into a vacuum belt filter for filtration, cleaned with clean water to remove impurities on the surface of silicon carbide, and vacuumed to absorb water to obtain a filter cake with a moistu...

Embodiment 2

[0053] The method for reclaiming silicon carbide and polyethylene glycol cutting fluid from silicon chip cutting waste mortar of the present embodiment comprises the following steps:

[0054] Stir the silicon chip cutting waste mortar evenly with a stirrer at room temperature, add polyethylene glycol solution and water with a content of 35%, control its temperature at 65°C, put it into a six-stage hydrocyclone separator, and keep the pressure at 3bar; under this pressure, the cyclone separator is separated to obtain the upper liquid flow and the lower liquid flow: the lower liquid flow contains most of the silicon carbide larger than 5um; the upper liquid flow contains most of the silicon, a large amount of water , silicon carbide less than 5um;

[0055] The liquid flow obtained by the hydrocyclone separator is poured into a vacuum belt filter for filtration, cleaned with clean water to remove impurities on the surface of silicon carbide, and vacuumed to absorb water to obtain...

Embodiment 3

[0063] The method for reclaiming silicon carbide and polyethylene glycol cutting fluid from silicon chip cutting waste mortar of the present embodiment comprises the following steps:

[0064] Stir the silicon chip cutting waste mortar evenly with a stirrer at room temperature, add polyethylene glycol solution and water with a content of 25%, control its temperature at 50°C, put it into a six-stage hydrocyclone separator, and keep the pressure at 2bar; under this pressure, the cyclone separator is separated to obtain the upper liquid flow and the lower liquid flow: the lower liquid flow contains most of the silicon carbide larger than 5um; the upper liquid flow contains most of the silicon, a large amount of water , silicon carbide less than 5um;

[0065] The liquid flow obtained by the hydrocyclone separator is poured into the vacuum belt filter for filtration, and the impurities on the surface of the silicon carbide are removed by washing with clean water, and the water is su...

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PUM

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Abstract

The invention relates to a method for recovering silicon carbide and polyglycol cutting solution from a silicon slice cutting waste mortar. The method comprises the following steps of: stirring the mortar at normal temperature, and then performing solid-liquid separation to obtain a lower liquid stream and an upper liquid stream; putting the lower liquid stream into a belt filter to obtain cleaned silicon carbide; rinsing the silicon carbide by using alkali liquor, and driving the silicon carbide into a centrifuge; cleaning the silicon carbide through the belt filter, then rinsing the silicon carbide by using oxalic acid, and driving the silicon carbide into a three-level hydrocyclone to obtain a lower liquid stream of the silicon carbide; putting the lower liquid stream of the silicon carbide into a third belt filter; conveying the cleaned silicon carbide into a drying machine through a conveyor belt; grading the dried silicon carbide by wind force, screening large granular impurities by using a vibrating screen to ensure that the silicon carbide can be packaged; performing solid-liquid separation on the liquid part obtained after separating the mortar; adding a decolorant and a filter aid into the liquid; putting the mixture into a press filter; putting the separated liquid into an ion exchange system after the separated liquid passes through a bag filter; and dehydrating the separated liquid through an evaporator to obtain polyglycol. By the method, the pollution to the environment caused by the direct emission of the mortar is avoided, and the production cost during silicon slice cutting is effectively reduced.

Description

technical field [0001] The invention relates to recovery technology, in particular to a recovery method for silicon carbide and polyethylene glycol cutting fluid. Background technique [0002] Silicon wafer is the basic material of semiconductor, solar energy, liquid crystal display and other industries. It is divided into monocrystalline silicon wafer and polycrystalline silicon wafer. The raw material is single crystal silicon or polycrystalline silicon. , use a wire cutting machine to process silicon wafers of various specifications, semiconductors, solar cells, etc. all use silicon wafers as the basic carrier, and silicon carbide and polyethylene glycol are the components of the cutting fluid during the process of cutting silicon rods into silicon wafers , the silicon carbide and polyethylene glycol extracted from the cut mortar can be directly recycled in the silicon wafer cutting process. [0003] Silicon carbide (SiC), also known as moissanite, is the most widely use...

Claims

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Application Information

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IPC IPC(8): C10M175/00C01B31/36
Inventor 薛荣秀
Owner 钱丽君
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