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Electroconductive particles and anisotropic electroconductive material using the same

A technology of conductivity and particles, which is applied in the field of anisotropic conductive materials and conductive particles, can solve the problems of reduced conductivity, inability to say enough, peeling of plating, etc., and achieve simplified conductive metal attachment process, high reliability, and adhesion good adhesion effect

Inactive Publication Date: 2013-07-03
NIPPON SHOKUBAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] These conductive fine particles, because particle diameter is uniform, therefore, it is difficult to produce the problem of conductivity such as the situation that uses metal particle, but, there is following problem: plating layer is peeled off from substrate particle; When the particles are pressure-bonded to the substrate or the electrode terminal, the conductivity is reduced
[0010] The substrate particles obtained by the above-mentioned technique can form a plated film even without performing an etching treatment. However, it cannot be said that the adhesion between the substrate particle and the metal layer is sufficient. Regarding cracks in the plated film, It is impossible to completely eliminate

Method used

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  • Electroconductive particles and anisotropic electroconductive material using the same
  • Electroconductive particles and anisotropic electroconductive material using the same
  • Electroconductive particles and anisotropic electroconductive material using the same

Examples

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preparation example Construction

[0107] [Method for producing vinyl polymer particles]

[0108] The method for producing vinyl polymer particles is a method of polymerizing a monomer composition containing the above-mentioned monomer mixture. Moreover, as a polymerization method, well-known polymerization methods, such as suspension polymerization, seed polymerization, and emulsion polymerization, can be employ|adopted, Among them, suspension polymerization and seed polymerization are preferable.

[0109] When the suspension polymerization method is employed, the solvent used is not particularly limited as long as it does not completely dissolve the monomer composition, but an aqueous solvent is preferably used. These solvents can be suitably used normally in the range of 20 mass parts or more and 10000 mass parts or less with respect to 100 mass parts of monomer compositions. As a method for producing vinyl polymer particles, a method of suspending and polymerizing a monomer composition containing a monomer...

Embodiment 1

[0248] Add 526 parts of ion-exchanged water, 1.6 parts of 25% ammonia water, and 118 parts of methanol into a four-necked flask with a condenser tube, a thermometer, and a dripping port, and add 3-methacryloyloxy 30 parts of propyltrimethoxysilane was used to carry out hydrolysis and condensation reaction of 3-methacryloxypropyltrimethoxysilane to prepare an emulsion of polysiloxane particles. 2 hours after the start of the reaction, the obtained emulsion of polysiloxane particles was sampled, and the result of measuring the particle diameter by Coulter-Mulchsizer-III (manufactured by Beckma'n Coulter Co.), the mass average particle diameter is 1.95 μm.

[0249] Next, polyoxyethylene styrenated phenyl ether sulfate ammonium salt (manufactured by Daiichi Kogyo Pharmaceutical Co., Ltd.: "HITENOIL (registered trademark) NF-08") as an emulsifier was dissolved in 175 parts of ion-exchanged water for 2.5 90 parts of styrene, 10 parts of divinylbenzene, 2,2'-azobis(2,4-dimethylvaler...

Embodiment 2

[0260]150 parts of an ion-exchanged aqueous solution in which 2 parts of the above-mentioned "Hytenol NF-08" as a dispersant was dissolved was added to a four-necked flask having a condenser, a thermometer, and a drip port. Next, a solution in which "V-65" as a polymerization initiator was dissolved was added to 100 parts of divinylbenzene, and emulsified and dispersed at 5000 rpm for 5 minutes by a TK homogenizer (manufactured by Tokuki Kagaku Kogyo Co., Ltd.) to prepare Suspension.

[0261] 250 parts of ion-exchanged water was added to the suspension, the temperature was raised to 65° C. under a nitrogen atmosphere, and it was kept at 65° C. for 2 hours to perform radical polymerization. The solid-liquid separation of the emulsion after radical polymerization is carried out, and the obtained filter cake is washed with ion-exchanged water and methanol, and further classified. The classified particles were dried at 80° C. for 12 hours to obtain vinyl polymer fine particles. ...

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Abstract

Provided are: electroconductive particles in which very few defects, such as cracks in an electroconductive metal layer, are produced, the adhesion between the base particles and the electroconductive metal layer is superior, and an electroconductive layer can uniformly cover the surfaces of the base particles while at the same time it is possible to greatly simplify the conventional process for applying an electroconductive metal layer; and an anisotropic electroconductive material which employs the electroconductive particles. The electroconductive particles comprise: base particles composed of vinyl polymers which have an M / C (atomic ratio, where M indicates the total number of atoms of alkali metal element and number of atoms of nitrogen element) for the base particles of at least 0.5 x 10-2 after a sodium absorption treatment measured by X-ray photoelectron spectroscopy (ESCA), a hydrophobization degree of less than 2%, and a mass average particle diameter of no more than 1000 µm; and electroconductive metal layers covering the surfaces of the base particles. The electroconductive particles are obtained by forming the electroconductive metal layers on the surfaces of the base particles by electroless plating.

Description

technical field [0001] The present invention relates to conductive fine particles and an anisotropic conductive material using the conductive fine particles. Background technique [0002] Electronic equipment is seeking miniaturization, thinning, and high-functioning year by year. For example, for the connection between the ITO electrodes of the liquid crystal display panel and the driving LSI, the connection between the LSI chip and the circuit board, and the connection between the fine pattern electrode terminals, etc. The electrical connection between minute parts of instruments has gradually expanded from the conventional connection by solder or connectors to the application of electrical connection using anisotropic conductive materials containing conductive particles. [0003] Conductive fine particles are widely used as the main constituent material of anisotropic conductive materials. Generally, they are mixed with binder resins and the like, and processed into aniso...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/00H01B1/22H01B5/16H01R11/01C23C18/16
CPCH01R4/04H05K2201/0221H01B1/22H05K3/323C23C18/2086Y02P20/582H01B5/16H01R11/01
Inventor 佐佐木令晋松本和明木太纯子池田勇人
Owner NIPPON SHOKUBAI CO LTD