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Halogen-free lead-free soldering paste and soldering flux used by same

A technology of lead-free solder paste and flux, which is applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., and can solve the problem of not being able to use electronic products, welding process, not conforming to the world environmental protection trend, and reducing the heating rate of preheating And other problems, to achieve the effect of safe and reliable use, improve printing thixotropy, and reduce interfacial tension

Active Publication Date: 2011-08-31
浙江强力控股有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the advent of the SMT lead-free era, in terms of solder, lead-free solder materials with various formulations such as Sn-Ag, Sn-Cu, and Sn-Ag-Cu have been successfully developed. Changes in powerless chemical properties (such as melting point, surface tension and oxidation resistance, etc.) lead to changes in the original welding process, the preheating temperature rise rate is significantly reduced, the average temperature of the active area is increased by about 10 degrees Celsius, and the peak reflow temperature is increased from 201 to 225 to 235-240, thus putting forward new requirements for the activation characteristics, thermal stability, heat resistance and volatility of SMT solder paste, which can no longer be used in the soldering process of existing electronic products, and because it contains Lead and halogen lamps are toxic substances, which do not meet the requirements of the world's environmental protection trends

Method used

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  • Halogen-free lead-free soldering paste and soldering flux used by same
  • Halogen-free lead-free soldering paste and soldering flux used by same
  • Halogen-free lead-free soldering paste and soldering flux used by same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] (Example 1, halogen-free lead-free solder paste)

[0058] This embodiment is a halogen-free lead-free solder paste, including the following components:

[0059] Ag 2.8%;

[0060] Cu 0.48%;

[0061] Flux 11%;

[0062] Sn 85.72%;

[0063] The flux includes the following components:

[0064] Organic acid activator 1%;

[0065] Hydrazine hydroxycarboxylic acid compound 10%;

[0066] Organic solvent 23%;

[0067] Hydrogenated Castor Oil or Ethylene Bis Stearamide 3%;

[0068] Surfactant 0.5%;

[0069] Water-soluble polymer 62.5%;

[0070] The above percentages are mass percentages;

[0071] The organic acid is malic acid; the hydrazine hydroxycarboxylic acid compound is 2,2'-hydrazine-bis(3-ethylbenzothiazoline-6-sulfonic acid) diamine salt; the surfactant is alkane Base phenol polyoxyethylene ether; the water-soluble polymer is polyethylene glycol with a molecular weight of 200 to 600, and a hydroxyl value of 51 to 64.

[0072] The relevant materials and their p...

Embodiment 2 to Embodiment 3

[0073] (Example 2 to Example 3, halogen-free lead-free solder paste)

[0074] Embodiment 2 to embodiment 3 are basically the same as embodiment 1, the difference is: the component distribution ratio of the solder paste in this embodiment is different from that of embodiment 1; in addition, the flux used in embodiment 2 to embodiment 3 Proportioning is different from Example 1; See Table 1 for relevant parameters in Example 2 to Example 3.

[0075] Table 1

[0076]

[0077]

Embodiment 4 to Embodiment 6

[0078] (Example 4 to Example 6, halogen-free lead-free solder paste)

[0079]Embodiment 4 to embodiment 6 are basically the same as embodiment 1, the difference is: the component distribution ratio of the solder paste in this embodiment is different from that of embodiment 1; in addition, the flux used in embodiment 4 to embodiment 6 Proportioning is different from Example 1; See Table 2 for relevant parameters in Example 4 to Example 6.

[0080] Table 2

[0081]

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Abstract

The invention discloses a halogen-free lead-free soldering paste and a soldering flux used by the same. The soldering paste comprises the following components: 2.8-3.2% of Ag, 0.48-0.52% of Cu, 11-12% of soldering flux, and the balance of Sn, wherein the soldering flux comprises the following components: 1-2% of organic acid activating agent, 10-15% of hydrazine hydroxy carboxylic acid compound, 23-42% of organic solvent, 3-8% of thixotropic agent, 0.5-2% of surface active agent, and the balance of water-solubility macromoleclar polymer; and the above percent is mass percent; the organic acidis malic acid, sebacic acid, adipic acid, glutaric acid, or octanedioic acid; the hydrazine hydroxy carboxylic acid compound is 2,2'-azino-bis(3-ethylbenzothiazoline-6-sulfonate) diammonium salt, or 3-hydroxy-2-naphthoic acid, or hydrazine sulfate; the organic solvent is glycerol and glycol; the thixotropic agent is hydrogenated castor oil or ethylene bis stearamide; the surface active agent is alkylphenol ethoxylates or octylphenol ethoxylates; and the water-solubility macromoleclar polymer is polyethylene glycol the molecular weight of which is 200-2000. The soldering paste and the soldering flux used by the same have better welding performance.

Description

technical field [0001] The invention belongs to the technical field of flux, and in particular relates to a halogen-free lead-free solder paste and the flux used therein. Background technique [0002] Solder paste is a slurry or paste formed by uniformly mixing solder alloy powder and paste flux. It is an indispensable raw material in the process of surface assembly technology (SMT) of electronic products. It is widely used in reflow soldering to realize Mechanical and electrical interconnection between electronic components and substrates. With the advent of the SMT lead-free era, in terms of solder, lead-free solder materials with various formulations such as Sn-Ag, Sn-Cu, and Sn-Ag-Cu have been successfully developed. Changes in powerless chemical properties (such as melting point, surface tension and oxidation resistance, etc.) lead to changes in the original welding process, the preheating temperature rise rate is significantly reduced, the average temperature of the a...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/36
Inventor 赵图强
Owner 浙江强力控股有限公司
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