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Method of electroless copper plating on surface of boron carbide powder and electroless plating solution for electroless copper plating

A technology of surface chemistry and chemical plating solution, applied in the field of chemical plating, can solve problems such as toxic heavy metal ions, environmental pollution, etc., and achieve the effects of less environmental pollution, low price, and strong reducing ability

Inactive Publication Date: 2014-05-21
中广核工程有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, EDTA has strong complexing properties, as long as there is a small amount of residue in the waste liquid, it may bring out a large amount of toxic heavy metal ions, and cause pollution to the environment. Many countries have restricted the use of EDTA

Method used

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  • Method of electroless copper plating on surface of boron carbide powder and electroless plating solution for electroless copper plating
  • Method of electroless copper plating on surface of boron carbide powder and electroless plating solution for electroless copper plating
  • Method of electroless copper plating on surface of boron carbide powder and electroless plating solution for electroless copper plating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Pre-plating treatment

[0030] Degreasing: Put 50g of boron carbide powder in acetone liquid, ultrasonic and stir for 30min, then take it out, dry at 80℃, and reach constant weight for later use.

[0031] Alkaline washing: place the boron carbide powder after degreasing in a 1mol / L sodium hydroxide hot alkaline solution at 80°C for ultrasonic cleaning and stirring for 30min, then take it out and dry it at 80°C until it is ready for use.

[0032] Sensitization: Place the boron carbide powder after alkali washing in a mixed solution of 20g / L stannous chloride and 60ml / L hydrochloric acid and stir for 30min for sensitization, then take it out and dry at 80°C until it is ready for use.

[0033] Activation: Place the sensitized boron carbide powder in a mixed solution of 0.05g / L palladium chloride and 8ml / L hydrochloric acid and stir for 10 minutes for sensitization, then take it out and dry it at 80°C to a constant weight for later use.

[0034] Electroless plating treatment

[0035] ...

Embodiment 2

[0039] Example 2 is the same as the pre-plating treatment and post-plating treatment in Example 1, except that the electroless plating solution contains 15g / L copper sulfate, 20g / L disodium ethylenediaminetetraacetic acid, and 10g / L potassium sodium tartrate. And 20ml / L hydrazine hydrate, the pH value of the electroless plating solution is 12-13, and in the electroless plating treatment of Example 2, the pH value is 12 and the holding temperature is 70°C; degreasing treatment, alkaline washing treatment, sensitive In both chemical treatment and activation treatment, the drying temperature is 150°C.

Embodiment 3

[0041] Example 2 is the same as the pre-plating and post-plating treatments in Example 1, except that the electroless plating solution contains 20g / L copper sulfate, 30g / L disodium ethylenediaminetetraacetic acid, and 14g / L potassium sodium tartrate. And 18ml / L hydrazine hydrate, the pH value of the electroless plating solution is 12-13, and the pH value used in the electroless plating treatment in Example 2 is 13, and the holding temperature is 80°C; degreasing treatment, alkaline washing treatment, sensitization In the treatment and activation treatment, the drying temperature is 120°C.

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Abstract

The invention discloses an electroless plating solution for electroless copper plating on the surface of boron carbide powder. The electroless plating solution comprises 15-20g / L of copper sulfate, 20-30g / Lof ethylenediamine tetraacetic acid disodium salt, 10-15 g / L of sodium potassium tartrate tetrahydrate and 15-20 ml / L of hydrazine hydrate by concentration; and the pH value of the electroless plating solution is 12-13. In the electroless plating solution for the electroless copper plating on the surface of the boron carbide powder, a reducing agent is the hydrazine hydrate and low in cost, does not pollute environments and has very strong reducing capacity under an alkaline condition, an oxidative product is clean N2, no impurities and metal ions are introduced, and complexing agents are the sodium potassium tartrate tetrahydrate and the ethylenediamine tetraacetic acid disodium salt, have little environmental pollution and strong complexing power and can keep the plating solution stable for a long term at a high temperature under a strong base condition. In addition, the invention also discloses a method of electroless copper plating on the surface of the boron carbide powder. According to the method, a layer of nanoscale uniform and compact copper coating can be formed on the surface of the boron carbide powder, and wetting angles and the interfacial reaction between the boron carbide powder and a metal base material can be effectively reduced.

Description

Technical field [0001] The invention belongs to the field of electroless plating. More specifically, the invention relates to a method for electroless copper plating on the surface of boron carbide powder and an electroless plating solution. Background technique [0002] Boron carbide has a low density (2.52g / cm 3 ), high hardness (second only to diamond and cubic boron nitride) and good neutron absorption capacity, so it has received extensive attention in recent years. However, when composited with a metal matrix, the boron carbide particles have poor wettability with the metal matrix and severe interface reactions, which hinder the preparation of metal-based boron carbide composites with high boron carbide content. [0003] In order to improve the wettability of the boron carbide particles and the metal matrix and reduce the interface reaction, the surface of the boron carbide particles needs to be metalized. Copper has high thermal conductivity, high thermal oxidation resistan...

Claims

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Application Information

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IPC IPC(8): C23C18/40C04B35/628
Inventor 罗志远李丘林刘彦章刘伟李学军王维
Owner 中广核工程有限公司
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