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Conductive copper paste and preparation method and use thereof

A technology of copper paste and ultra-fine copper powder, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve problems such as hindering the development of electronic business, increasing production costs, etc. To achieve the effect of guaranteed performance, wide source and anti-oxidation

Inactive Publication Date: 2015-04-08
NANJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the advantages of good conductivity, high solderability, strong adhesion, and not easy to oxidize, silver electrode paste is currently used in various electronic components. However, due to the scarcity of silver resources, the price of silver has continued to rise in recent years, resulting in continuous production costs. The increase seriously hinders the development of the electronic industry, so more and more people are committed to the research and development of base metal paste

Method used

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  • Conductive copper paste and preparation method and use thereof
  • Conductive copper paste and preparation method and use thereof
  • Conductive copper paste and preparation method and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1. Metal copper powder: choose ultra-fine copper powder with particle size d50=2μm, and the shape is spherical.

[0026] 2. Glass powder: choose glass powder with a particle size of 2 μm and a melting point of 550°C.

[0027] 3. Organic binder: dissolve 5% ethyl cellulose and 5% phenolic resin in 32.5% butyl carbitol acetate, add 42.5% terpineol, 10% Diethyl phthalate and 5% castor oil are mixed and stirred evenly to obtain an organic binder for use.

[0028] 4. Preparation of copper paste: Add the following substances by mass ratio: 78% ultrafine copper powder, 3% glass frit, 1.3% ascorbic acid and 0.2% SiO2 (50nm), 1% titanate coupling agent, 1% three Ethanolamine, 1% polyethylene glycol 200, and 14.5% organic binder were ground by a ball mill with a rotating speed of 510r / min for 6 hours to obtain a conductive copper paste. The copper paste was paste-like, bright red in color, and uniform and fine in appearance.

[0029] 5. Firing of the electrode: Print the prepar...

Embodiment 2

[0031] 1. Metal copper powder: choose ultra-fine copper powder with particle size d50=2μm, and the shape is spherical.

[0032] 2. Glass powder: choose glass powder with a particle size of 1 μm and a melting point of 600°C.

[0033] 3. Organic binder: dissolve 7% ethyl cellulose and 5% phenolic resin in 30.5% butyl carbitol acetate, add 42.5% terpineol, 10% Diethyl phthalate and 5% castor oil are mixed and stirred evenly to obtain an organic binder for use.

[0034] 4. Preparation of copper paste: add the following materials by mass ratio: ultrafine copper powder 74%, glass frit 3%, 1.8% oxalic acid and 0.2% SiO2 (80nm), 1% lecithin, 1.5% polyethylene glycol 200 , 1% KH-550, 17.5% organic binder, and after 8 hours of grinding by a 450r / min ball mill, a conductive copper paste was prepared. The copper paste was paste-like, bright red in color, and uniform and fine in appearance.

[0035] 5. Firing of the electrode: Print the prepared conductive copper paste on the ceramic sub...

Embodiment 3

[0037] 1. Metal copper powder: choose ultra-fine copper powder with particle size d50=3μm, and the shape is spherical.

[0038] 2. Glass powder: choose glass powder with a particle size of 2 μm and a melting point of 600°C.

[0039] 3. Organic binder: dissolve 5% ethyl cellulose and 5% phenolic resin in 32.5% butyl carbitol acetate, add 52.5% terpineol, 5% castor oil, mixed and stirred evenly to obtain an organic binder for use.

[0040] 4. Preparation of copper paste: Add the following materials by mass ratio: 74% ultrafine copper powder, 5% glass frit, 2.4% oxalic acid and 0.1% SiO2 (100nm), 0.7% KH-550, 0.8% triethanolamine, 0.8 %Polyethylene glycol 200, 16.2% organic binder, after grinding for 4 hours by a 550r / min ball mill, a conductive copper paste was obtained.

[0041]5. Firing of the electrode: Print the prepared conductive copper paste on the ceramic substrate by screen printing, dry it at 150°C and put it into the furnace at a ratio of hydrogen to nitrogen of 1:3...

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Abstract

The invention discloses conductive copper paste and a preparation method and use thereof. The conductive copper paste consists of the following raw material components in percentage by mass: 74-80 percent of ultrafine copper powder, 3-5 percent of glass powder, 14-20 percent of organic bonding agent, 0.8-3 percent of reducing agent, 0.1-0.2 percent of nanosilicon dioxide and 2-4 percent of surfactant. The conductive paste is prepared through a ball milling method. The paste is sintered under a nitrogen-hydrogen mixed atmosphere after screen printing, and the performance of a semiconductor ceramic electrode obtained after raising the sintering temperature according to a required program is consistent with the technical standard of semiconductor ceramic electrodes, so that the conductive copper paste can be used for replacing conductive silver paste for the semiconductor ceramic electrode. Compared with silver paste, the copper paste has the advantage of saving cost.

Description

technical field [0001] The present invention relates to a conductive copper paste and its preparation method and application, especially to an electrode prepared by using a conductive copper paste on a ceramic substrate through screen printing, and then prepared under a specific sintering process. Electrode standard, saving cost. Background technique [0002] The semiconductor ceramic electrode is based on ceramics, and has a layer of metal patches of several microns on both sides of the ceramic sheet. Metal patches are roughly divided into two categories: precious metals and base metals. The precious metals mainly use silver as the conductive silver paste, while the base metals mainly include copper, nickel and alloys. Mainly, the metal powder is made into slurry and coated on both sides of the ceramic substrate by screen printing, and then fired at high temperature to obtain the finished product. [0003] Due to the advantages of good electrical conductivity, high solder...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00
Inventor 陈洪龄温益
Owner NANJING UNIV OF TECH
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