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Photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the directions of optics, optomechanical equipment, lithography/patterning, etc., can solve the problem that the stacking layer performance of multilayer printed circuit board cannot be exerted, the cured product of acrylate cannot obtain physical properties, Insufficient insulation reliability and other problems, to achieve the effect of excellent dielectric properties, excellent insulation reliability, excellent water resistance and heat resistance

Active Publication Date: 2016-02-03
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since acid anhydride groups or carboxyl groups are easily thermally degraded, sufficient physical properties cannot be obtained using the cured product of this acrylate, and there are restrictions on the formation of insulating layers with high insulation reliability when there are acid anhydride groups or carboxyl groups
[0003] Therefore, for example, a photosensitive resin composition for MEMS containing a specific photocationic polymerization initiator and a specific epoxy resin is disclosed in Patent Document 1, but its application is limited to MEMS applications, and the insulation reliability is not sufficient, so it cannot be used in particular. out of the full performance as a stacked layer of a multilayer printed wiring board
In addition, Patent Document 2 discloses a photosensitive resin composition for a protective film of a printed wiring board for semiconductor packaging, but the insulation reliability is not sufficient, its application is limited to a protective film, and it still cannot function as a stacked layer of a multilayer printed wiring board. full performance of

Method used

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  • Photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0154] The present invention is specifically illustrated by examples below, but the present invention is not limited by these examples. In addition, "part" means a mass part.

[0155]

[0156] The copper layer of the glass epoxy board|substrate in which the circuit was formed with the 18 mm thick copper layer was treated and roughened with CZ8100 (surface treatment agent containing an organic acid, Meck Co., Ltd. product). Next, the resin composition layer of the photosensitive film with a support obtained in Examples and Comparative Examples was laminated using a vacuum laminator (manufactured by Nichigo Motorton Co., Ltd., VP160) so that the surface of the copper circuit was in contact with the resin composition layer. , to prepare a laminate in which the above-mentioned glass epoxy substrate, the above-mentioned resin composition layer, and the above-mentioned support are sequentially laminated. The crimping conditions were performed at a crimping temperature of 80° C., ...

Synthetic example 1

[0187]

[0188] Add 2050 g (equivalent: 10.0) of cresol novolac epoxy resin [DIC Co., Ltd., EPICLONN-660, epoxy equivalent weight 205], 360 g (equivalent: 5.0) to 700 g of diethylene glycol monoethyl ether acetate. ), and 1.5 g of hydroquinone, heated and stirred at 90° C., and dissolved uniformly. Next, 5.9 g of triphenylphosphine was added, and the temperature was raised to 120° C. to react for 12 hours. The obtained reaction solution was diluted with a solvent to obtain an acrylate compound (Product A),

[0189] ? Epoxy equivalent: 427

[0190] ?Acid value: 0.49mgKOH / g

[0191] ?Weight average molecular weight: 2000

[0192] • A diethylene glycol monoethyl ether acetate solution having a solid content of 65% by mass.

Synthetic example 2

[0193]

[0194] Add bixylenol type epoxy resin (Mitsubishi Chemical Co., Ltd. YX4000, epoxy equivalent 185) 190g, bisphenol acetophenone (phenolic hydroxyl equivalent 145) 14g, biscresol fluorene (JFE Chemical ( Co., Ltd., 170 g of phenolic hydroxyl equivalent weight 190), and 150 g of cyclohexanone were stirred and dissolved. Next, 0.5 g of a tetramethylammonium ammonium chloride solution was added dropwise, and reacted at 180° C. for 5 hours under a nitrogen atmosphere. Next, the temperature was lowered to 60° C., and 100 parts of ethyl isocyanate methacrylate (manufactured by Showa Denko Co., Ltd., trade name Karenz MOI, methacryloyl equivalent weight: 155) and dibutyltin dimethacrylate were added dropwise through the dropping channel (dropping lot). The mixed solution of 0.04 parts of lauric acid esters, after completion|finish of dripping, kept the reaction system at 70 degreeC for 4 hours, and the isocyanate group disappeared by this, and the methacrylate compound was ...

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Abstract

Provided is a photosensitive resin composition which exhibits excellent insulation reliability and has physical properties suitable for a buildup layer (interlayer insulating layer) of a multilayer printed wiring board, while having photosensitivity. This photosensitive resin composition contains (A) an epoxy resin, (B) one or more curing agents that are selected from the group consisting of active ester curing agents, cyanate ester curing agents and benzoxazine curing agents, and (C) a compound having a (meth)acrylate structure.

Description

technical field [0001] The present invention relates to a photosensitive resin composition. In more detail, it is related with the photosensitive resin composition suitable for the interlayer insulating layer of a multilayer printed wiring board. Background technique [0002] Conventional photosensitive resin compositions are mainly alkali-developing types, and acrylates containing acid anhydride groups and carboxyl groups are used in order to enable development. However, since the acid anhydride group or carboxyl group is easily thermally degraded, sufficient physical properties cannot be obtained from a cured product using this acrylate, and there is a limit to the formation of an insulating layer with high insulation reliability when the acid anhydride group or carboxyl group is present. [0003] Therefore, for example, Patent Document 1 discloses a photosensitive resin composition for MEMS containing a specific photocationic polymerization initiator and a specific epoxy...

Claims

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Application Information

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IPC IPC(8): G03F7/032C08F290/00C08G59/40G03F7/004G03F7/027H05K3/28H05K3/46
CPCC08G59/40C08F290/00H05K3/287H05K3/3452H05K3/4676H05K2203/0514G03F7/0047G03F7/038G03F7/0388C08L63/00C08L2205/05C08L33/06
Inventor 依田正应中村茂雄
Owner AJINOMOTO CO INC
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