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Novel high performance heat sink material

A heat sink material, high-performance technology, used in electrical components, electrical solid devices, circuits, etc., can solve the problems of insufficient bonding between the wrapping layer and the substrate, poor mechanical properties, poor insulation, affecting thermal conductivity, etc., to achieve good mechanical properties. performance, excellent insulation, low thermal conductivity

Inactive Publication Date: 2016-11-16
黄宇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a new type of high-performance heat sink material to solve the problems of existing heat sink materials such as poor mechanical properties, poor insulation, low thermal conductivity, large expansion coefficient, insufficient bonding between the wrapping layer and the substrate, and affecting thermal conductivity.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0070] The preparation method of the novel high-performance heat sink material comprises the following steps:

[0071] S1: the preparation of the matrix, including the following steps:

[0072] S11: Dissolve calcium phosphate and zirconia sol in water that is 6-8 times the total mass fraction, then add cellulose, soak for 6-7 hours, and then dry at 68-72°C until the water content is ≤8%. To obtain mixture I, mix and grind mixture I and dimethyl itaconate for 3-6 hours to obtain mixture II;

[0073] S12: Add graphite, yttrium oxide, aluminum nitride, silicon carbide, carbon nanotubes, silicon dioxide, bentonite, vanadium oxide, light calcium, binder, coupling agent, compatibilizer, antioxidant, stabilizer, Bridging agent, regulator, strengthening agent, coagulant, toughening agent, stabilizer, terminator, 300-500 parts of water, microwave power 100-300W, temperature 650-700°C, speed 100-400r / Stir for 3-6 hours at 1 min, and then dry the resultant until the water content is ≤...

Embodiment 1

[0088] A new type of high-performance heat sink material, made of the following raw materials by weight: 220 parts of the base, 12 parts of the wrapping layer;

[0089] The matrix is ​​made of the following raw materials in units of weight: 65 parts of graphite, 8 parts of yttrium oxide, 10 parts of aluminum nitride, 12 parts of silicon carbide, 6 parts of carbon nanotubes, 8 parts of silicon dioxide, and 3 parts of bentonite , 1.5 parts of vanadium oxide, 2.5 parts of calcium phosphate, 5 parts of zirconia sol, 4 parts of light calcium, 12 parts of cellulose, 4 parts of dimethyl itaconate, 9 parts of binder, 1.5 parts of coupling agent, 1.5 parts of compatibilizer, 1.2 parts of antioxidant, 1.2 parts of stabilizer, 0.9 parts of bridging agent, 0.7 parts of regulator, 0.5 parts of strengthening agent, 0.5 parts of coagulant, 0.3 parts of toughening agent, 0.3 parts of stabilizer, termination 0.2 part of dose;

[0090] The coupling agent is an epoxy silane coupling agent;

[...

Embodiment 2

[0126] A new type of high-performance heat sink material, made of the following raw materials in units of weight: 156 parts of the base, 9 parts of the wrapping layer;

[0127] The matrix is ​​made of the following raw materials in units of weight: 52 parts of graphite, 6 parts of yttrium oxide, 8 parts of aluminum nitride, 10 parts of silicon carbide, 4 parts of carbon nanotubes, 5 parts of silicon dioxide, and 2 parts of bentonite , 1 part of vanadium oxide, 2 parts of calcium phosphate, 4 parts of zirconia sol, 3 parts of light calcium, 9 parts of cellulose, 3 parts of dimethyl itaconate, 5 parts of binder, 1 part of coupling agent, 1 part of compatibilizer, 0.8 part of antioxidant, 0.8 part of stabilizer, 0.6 part of bridging agent, 0.5 part of regulator, 0.4 part of strengthening agent, 0.4 part of coagulant, 0.2 part of toughening agent, 0.2 part of stabilizer, termination 0.1 part of dose;

[0128] The coupling agent is an epoxy silane coupling agent;

[0129] Describ...

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Abstract

The invention discloses a novel high performance heat sink material which is formed by a substrate and a wrapping layer. The substrate is prepared by graphite, yttrium oxide, aluminum nitride, silicon carbide, carbon nanotubes, silica, bentonite, vanadium oxide, calcium phosphate, zirconium dioxide sol, light calcium, cellulose, itaconic acid dimethyl ester, a binder, a coupling agent, a compatibilizer, an antioxidant, a stabilizer, a bridging agent, an adjusting agent, a reinforcing agent, a flocculation agent, a flexibilizer, a stabilizer, and a terminator. The wrapping layer is prepared by silicon carbide fibers, a graphene, silica, sodium metasilicate, hydroxymethyl cellulose sodium, an initiator, a cross-linking agent, a softener, an adhesion agent, a catalyst and a fire retardant. The prepared novel high performance heat sink material has good mechanical performance, excellent insulating performance, thermal conductivity and a low coefficient of expansion and can be widely applied to the LED heat conduction-heat radiation novel high performance heat sink material in the semiconductor technology.

Description

【Technical field】 [0001] The invention belongs to the technical field of electronic components and the technical field of heat sink material preparation, and in particular relates to a novel high-performance heat sink material. 【Background technique】 [0002] With the continuous improvement of semiconductor technology and manufacturing process, the luminous flux and luminous efficiency of LED have been continuously improved, and power LEDs have been widely used in daily life and industrial production. However, for high-power LEDs, the power density of the chip is high, and the large heat generation undoubtedly puts forward higher requirements for its heat dissipation materials. [0003] For the heat dissipation of traditional LED chips, a substrate (ie, heat sink material) is provided under the LED chip, and the bottom of the substrate is connected to the heat sink. The heat of the LED chip is conducted to the heat sink through the substrate, and then dissipated by the heat ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L23/373
CPCH01L23/3735H01L33/641H01L2933/0075
Inventor 黄宇
Owner 黄宇
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