Preparation method for silicon micro/nano structure based on mechanical carving and metal catalysis etching

Abstract

The invention discloses a preparation method for a silicon micro/nano structure based on mechanical carving and metal catalysis etching. The method comprises the following steps of S1, preprocessing a silicon wafer, cleaning the surface of the silicon wafer and then carrying out drying to obtain a sample A; S2, integrating noble metal nano-film, depositing an adhesion layer on the surface of the sample A and integrating the noble metal nano-film on the surface of the adhesion layer to obtain a sample B; S3, mechanically carving the noble metal nano-film, carving the surface of the sample B through mechanical carving and removing the carved part of the noble metal nano-film, thereby obtaining a sample C which is located at any required position and has a set shape pattern; and S4, preparing the silicon micro/nano structure, placing the sample C into mixed solution of hydrofluoric acid and hydrogen peroxide and etching the sample C, thereby obtaining the silicon micro/nano structure with a high aspect ratio. In general, the preparation method has the advantages that the cost is low, the operation is simple and the processing can be positioned. Mass production is hopeful.

Description

Technical field [0001] The invention belongs to the technical field of micro / nano structure manufacturing, and specifically relates to a silicon micro / nano structure preparation method based on mechanical scribing and metal catalytic etching. Background technique [0002] With the rapid development of micro-nano electromechanical systems, micro-sensing devices and micro-energy devices such as micro-lithium-ion batteries have received extensive attention. As the specific capacity of silicon is as high as 4200mAh / g, silicon micro / nano structures are now widely used in devices such as miniature lithium-ion batteries. Silicon micro / nano structures include silicon micro / nanowire structures, silicon micro / nano pillar structures, silicon micro / nanotube structures, and silicon nanospheres. Generally, the preparation methods of silicon micro / nano structures are divided into "top-down" etching methods and "bottom-up" deposition methods. The structures processed by the "bottom-up" method ...

AI Technical Summary

Problems solved by technology

The structures processed by the "bottom-up" method are usually randomly distributed, which makes it difficult for large-scale integrated manufacturing

In the "top-down" processing method, the structure obtained by ultraviolet exposure (or electron beam exposure) is used as a mask, combined with the inductively coupled plasma etching process, silicon micro / nanostructures with high aspect ratio can be obtained, but the ultraviolet Exposure, e-beam exposure, and inductively coupled plasma etching all require specialized equipment and are expensive

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