Pouring sealant for integrated circuit board and preparation method thereof

Abstract

The invention discloses a pouring sealant for an integrated circuit board. The pouring sealant is characterized by comprising a component A and a component B based on the weight ratio of 1: (1-2), wherein the component A comprises the following raw materials in percentage by weight: 10-20 parts of surface modified silicon doped nano diamond, and 60-80 parts of activated polyurethane; the componentB comprises the following raw materials in percentage by weight: 60-80 parts of dimethyl hydroxy silicone oil, and 8-14 parts of catalyst; the catalyst is selected from one or a plurality of trimethylamine, triphenylphosphine and benzyltributylammonium bromide. The pouring sealant is outstanding in electrical performance and flame retardance and is high in adhering force relative to a base plateof the integrated circuit board; the service life of an electronic device can be effectively prolonged; in addition, the problems that a forming heat conducting silicon rubber molecule is added, causing nonpolarity of the pouring sealant, low surface activation energy and low adhering performance relative to a base material; if the pouring sealant is used as an electronic pouring and coating material and is expanded in heat and contracted in cold for a long time, the produced stress leads to separating of the pouring sealant and the base material or the deviation of an internal electronic element, and thus water enters the element through a seam to cause corrosion and short circuit can be solved.

Description

technical field [0001] The invention relates to the technical field of potting glue, and more specifically relates to a silicone-polyurethane composite electronic potting glue for integrated circuits and a preparation method thereof. Background technique [0002] With the rapid development of electronic science and technology, electronic components, devices, instruments and meters continue to grow and develop in the electronics industry, and they have begun to move towards lightweight, integrated, high-performance, dense, high-precision and high-power This will inevitably lead to a substantial increase in the heat generation of electronic devices, especially the small heat dissipation space of the integrated circuit board, crowded heat dissipation channels, and a large amount of heat accumulation. If the heat is not dissipated in time, it will seriously affect the stability and stability of electronic components. reliability, thereby shortening the service life of electronic...

AI Technical Summary

Problems solved by technology

[0003] The silicone-based potting compound used in the prior art has the disadvantages of low thermal conductivity, poor flame retardancy and poor bonding performance, which seriously affects its application range. Another commonly used potting compound material, polyurethane material, has the most Good waterproof, acid resistance, flexibility and impact resistance are good, but when it is used as an electronic packaging glue, there are many air bubbles, and the air bubbles are relatively dense, so vacuum filling is required, and the operation is more complicated

[0004] The Chinese Patent Publication No. CN 106753212A discloses a silicone electronic potting adhesive for PCB circuit boards with good adhesion and high transparency, which is prepared from the following raw materials: vinyl-terminated silicone oil-1, vinyl-terminated silicone oil-2, 12% platinum catalyst, ethynyl cyclohexanol, vinyl silicone resin, 1-allyloxy-2,3-propylene oxide, 1,3,5,7-tetramethylcyclotetrasiloxane, silane Joint agent A171, appropriate amount of hydrogen-containing silicone oil, montmorillonite, microencapsulated red phosphorus, hexamethyldisilazane, appropriate amount of deionized water, and appropriate amount of absolute ethanol. The potting glue prepared by this invention is compensated by adding additives Silicone potting adhesives have the defects of low thermal conductivity, poor flame retardancy and poor bonding performance, but adding too much additives will cause excessive viscosity, which will affect fluidity and mechanical properties;