Flame-retardant heat-conducting double-side adhesive

Abstract

The invention discloses a flame-retardant heat-conducting double-side adhesive. The flame-retardant heat-conducting double-side adhesive is prepared from a mixture of an epoxy resin pressure-sensitiveadhesive, chlorosulfonated polyethylene, organic silicon rubber, terpene resin, a flame retardant, polytetrafluoroethylene micro powder, ceramic micro powder, nano flake graphite, a coupling agent, barium titanate whisker and boron nitride nanosheets, and a substrate of basalt fiber fireproof cloth. The flame-retardant heat-conducting double-side adhesive has high heat conductivity and insulationas well as the properties of softness, compression, fitness and strong adhesion, is large in applicable temperature range, is capable of filling up uneven surfaces, can be tightly and solidly adheredto a heat source device and a heat radiation fin, is capable of rapidly conducting out heat, is good in heat conductivity and stability, long in service life, excellent in adhesion property and simple in preparation process, and has very good application prospects in fields such as electronic packaging and power wires, and a polymer substrate is filled with inorganic granules with excellent heatconductivity.

Description

technical field [0001] The invention relates to a double-sided adhesive, in particular to a flame-retardant and heat-conducting double-sided adhesive. Background technique [0002] With the development of the microelectronics industry, the integration of large-scale and ultra-large-scale integrated circuits is getting higher and higher. There is a famous law in the IT industry-the number of components that can be accommodated on an integrated circuit is about every 18 to 24 Months will double, and performance will double, which is "Moore's Law". As the number of components integrated in the chip increases, the thermal effect of the chip also increases. Some means are needed to export this thermal effect. The thermal conductive agent connects the chip with the heat sink and conducts heat. [0003] Recently, a large number of thermal conductive agents are used in the IT and electronics industries. This kind of silicone grease has no adhesive force and requires additional devi...

AI Technical Summary

Problems solved by technology

[0003] Recently, a thermal conductive silicone grease is widely used in the IT and electronic industries. This silicone grease has no adhesive force and requires additional devices to fix it, such as screws or springs. It is inconvenient to use and reduces production efficiency.

There is also a heat conduction agent, which is a two-component heat conduction adhesive, the main components are epoxy resin and curing agent, which need to be pre-mixed before use, and need to be cured by heating, the curing speed is slow, and it is inconvenient to use. Fire-retardant fiberglass mesh is used in civil buildings. This mesh is made by coating flame-retardant positioning glue on the glass fiber mesh gray cloth and drying.

The usual flame retardant glue is made of PVC resin paste diluted with a large amount of organic solvents to form a glue with good fluidity and good coating or a halogen-free polymer emulsion compounded with a large amount of expensive flame retardants. Either a large amount of organic matter is released into the environment during processing to pollute the environment, or the cost is extremely high and cannot meet the needs of market competition

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