Solderable low-temperature curing type functional silver paste and preparation method thereof

A curing and functional technology, applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, electrical components, etc. Effect

Active Publication Date: 2019-06-14
KUNMING INST OF PRECIOUS METALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although polymethyl methacrylate PMMA resin has the advantages of high light transmittance, high mechanical strength, light weight, good weather resistance, and easy process

Method used

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  • Solderable low-temperature curing type functional silver paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The modified polymethyl methacrylate PMMA resin is obtained by copolymerizing methyl methacrylate MMA, monomer methacrylic acid amide MAAM containing active hydrogen atoms and acrylic acid AA.

[0024] Get 85wt% of the above-mentioned modified polymethyl methacrylate PMMA resin, add 10wt% propylene methacrylate crosslinking agent and 5wt% bis(dioctyloxypyrophosphate) ethylene titanate, use high-speed dispersion agent dispersed to make 10wt% organic vehicle.

[0025] Add 85wt% tap density 3.0~4.0g / cm in the organic vehicle 3 , burning loss rate2 / g, the maximum sheet diameter < 25 micron flake silver powder, pre-mixed into a slurry with a double planetary mixer, ground and dispersed with a three-roll mill, and finally degassed under reduced pressure to obtain the finished product.

Embodiment 2

[0027] Take 75wt% of the modified polymethyl methacrylate PMMA resin of Example 1 and mix it with 10wt% organic solvent, stir it with a high-speed disperser, and the temperature does not exceed 70°C. After the resin is completely dissolved, it is cooled to room temperature, and 10wt% methacrylic acid is added Acrylic ester crosslinking agent and 5wt% bis(dioctyloxypyrophosphate) ethylene titanate are dispersed with a high-speed dispersant to prepare 15wt% organic vehicle. Wherein the organic solvent is composed of 20% dimethyl succinate, 60% dimethyl glutarate and 20% dimethyl adipate in mass percent.

[0028] Add 90wt% flaky silver powder / spherical silver powder (Wt:Wt=9:1) to the organic vehicle, and the tap density of flaky silver powder is 4.0-6.0g / cm 3 , burning loss rate2 / g, the largest sheet diameter 3 , burning loss 0.9%, specific surface area 0.5 ~ 1.0m 2 / g, the maximum particle size is less than 6 microns, pre-mixed into a slurry with a double planetary mixer, gro...

Embodiment 3

[0030] Take 95wt% of the modified polymethyl methacrylate PMMA resin in Example 1, add 5wt% propylene methacrylate crosslinking agent, and disperse with a high-speed dispersant to prepare 5wt% organic vehicle.

[0031] Add 95wt% flaky silver powder / spherical silver powder (Wt:Wt=8:2) to the organic vehicle, and the tap density of flaky silver powder is 4.0-6.0g / cm 3 , burning loss rate2 / g, the largest sheet diameter 3 , burning loss 0.9%, specific surface area 0.1~0.5m 2 / g, the maximum particle size is less than 6 microns, pre-mixed into a slurry with a double planetary mixer, ground and dispersed with a three-roll mill, and finally degassed under reduced pressure to obtain the finished product.

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Abstract

The invention discloses a solderable low-temperature curing type functional silver paste and a preparation method thereof. The composition mass percent of the solderable low-temperature curing type functional silver paste is: 85-95wt% of silver powder and 5-15wt% of organic carrier, wherein the organic carrier comprises 75-90wt% of modified polymethyl methacrylate PMMA resin, 0-15wt% of organic solvent, 5-20wt% of cross-linking agent and 5-15wt% of auxiliary agent. A functional silver paste is prepared from silver powder, modified polymethyl methacrylate PMMA resin, organic solvent, cross-linking agent and auxiliary agent, and the prepared functional silver paste can meet the solderability requirements of wave soldering, reflow soldering, gold soldering and indium soldering after being cured at low temperature. The invention provides a solderable low-temperature curing functional silver paste and a preparation method thereof for assembling high-density and high-reliability electronic products in the field of information electronics, and has wide application prospect and market value.

Description

technical field [0001] The invention designs a weldable low-temperature curing functional silver paste and a preparation method thereof, belonging to the field of new information electronic materials. Background technique [0002] With the rapid development of the times, the demand for electronic products has become more diversified, miniaturized, and reliable, which has prompted the development of electronic devices towards miniaturization and electronic device assembly towards high density. While electronic device assembly ensures high density, it also needs to ensure high reliability of product performance, which requires assembly processing not to affect product performance. In addition, due to the diversified needs of current electronic products, the types of materials used are becoming more and more abundant. However, difficult-to-attach substrate materials such as glass, aluminum, stainless steel, and flexible substrates are inconvenient for high-density assembly and ...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
Inventor 李俊鹏万甦伟陈家林刘继松赵汝云李燕华
Owner KUNMING INST OF PRECIOUS METALS
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