Alloy electroplating material with high bonding force
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 深圳市桑达兴业机械实业有限公司
- Publication Date
- 2020-05-08
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Abstract
Description
technical field
[0001] The invention relates to an alloy electroplating material with anodized aluminum as a base material, belongs to the field of anodized aluminum materials without shielding layers prepared by electrochemical methods, and is especially suitable for improving the bonding force between aluminum materials and electroplated metals.
[0002] technical background
[0003] With the rapid development of science and technology and industry, people have more and more stringent requirements on metal properties. Lightweight and high-hardness metal alloy materials are widely used in related fields. Since the output of aluminum in the world is second only to iron, light metal aluminum alloys The material gets a lot of attention. Aluminum and aluminum alloy materials have low hardness, poor wear resistance, and are prone to intergranular corrosion, and a thin oxide film is easy to form on the surface of aluminum under natural conditions, and the film is easy to be damage...