Alloy electroplating material with high bonding force

A technology of alloy electroplating and bonding force, applied in electrolytic coatings, surface reaction electrolytic coatings, coatings, etc., can solve problems such as unfavorable electroplating process, non-uniform corrosion, no public etching method, etc., and achieve simple and easy positioning of corrosion and solubility. Large, good wash-off effect
CN111118556AActive Publication Date: 2020-05-08深圳市桑达兴业机械实业有限公司

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
深圳市桑达兴业机械实业有限公司
Publication Date
2020-05-08

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Abstract

The invention provides a preparation method of an alloy electroplating material with high bonding force. A shielding layer at the bottom of an anodic oxide film is removed, an aluminum metal base material is exposed, then a zinc transition layer and a zinc-nickel electroplating layer are sequentially electroplated, and finally the bonding force of the base material and the plating layers is effectively improved.
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Description

technical field

[0001] The invention relates to an alloy electroplating material with anodized aluminum as a base material, belongs to the field of anodized aluminum materials without shielding layers prepared by electrochemical methods, and is especially suitable for improving the bonding force between aluminum materials and electroplated metals.

[0002] technical background

[0003] With the rapid development of science and technology and industry, people have more and more stringent requirements on metal properties. Lightweight and high-hardness metal alloy materials are widely used in related fields. Since the output of aluminum in the world is second only to iron, light metal aluminum alloys The material gets a lot of attention. Aluminum and aluminum alloy materials have low hardness, poor wear resistance, and are prone to intergranular corrosion, and a thin oxide film is easy to form on the surface of aluminum under natural conditions, and the film is easy to be damage...

Claims

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