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Surface treatment agent capable of improving corrosion resistance of electrolytic copper foil

A surface treatment agent and corrosion-resistant technology, applied in the field of electrolytic copper foil surface treatment, can solve the problems of insufficient crystallisation of the alloy layer, edge corrosion, high cost, increase the cathodic polarization, improve corrosion resistance, The effect of strong chemical affinity

Inactive Publication Date: 2020-06-19
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The common galvanizing process can only solve the problem of heat resistance, but cannot completely solve the problem of corrosion resistance of copper foil.
In order to solve the corrosion resistance problem of copper foil, some enterprises realize it by forming galvanized alloy on the surface of copper foil. Generally, there are alloy processes such as zinc-nickel, zinc-tin, etc., but because some alloy layers are not crystallized finely and uniformly, corrosion resistance The performance can not achieve the desired effect, resulting in edge corrosion when etching high-precision lines on copper foil circuit boards.
In recent years, in order to improve the corrosion resistance of copper foil, some copper foil manufacturers have developed ternary and quaternary alloy corrosion-resistant processes of zinc, nickel, cobalt, tin, iron, arsenic, tungsten and other metals to make copper foil corrosion-resistant It has been greatly improved, but its process is complicated, the range of process parameters is narrow, and there are problems such as unsuitable operation, high cost, difficult recovery of plating solution and wastewater treatment, and environmental protection.

Method used

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  • Surface treatment agent capable of improving corrosion resistance of electrolytic copper foil
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  • Surface treatment agent capable of improving corrosion resistance of electrolytic copper foil

Examples

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Effect test

Embodiment 1

[0018] A surface treatment agent for improving the corrosion resistance of electrolytic copper foil. Each liter of the surface treatment agent contains: 130g of potassium pyrophosphate, 3g of stannous sulfate, 18g of zinc sulfate, 1g of cerium sulfate and 3mg of additive A;

[0019] Wherein, Additive A is formaldehyde and 1,4-butynediol mixed in a weight ratio of 1:1.

[0020] A surface treatment process for improving the corrosion resistance of electrolytic copper foil. Using the above-mentioned surface treatment agent, the roughened and cured electrolytic copper foil with a thickness of 18 μm is placed in an electrolyte tank containing the surface treatment agent, and the pH is controlled to 9.0, the temperature is 35°C, the current density is 1.5A / dm 2 , The electroplating time is 8s.

Embodiment 2

[0022] A surface treatment agent for improving the corrosion resistance of electrolytic copper foil. Each liter of the surface treatment agent contains: 170g of potassium pyrophosphate, 8g of stannous sulfate, 27g of zinc sulfate, 5g of cerium sulfate and 9mg of additive A;

[0023] Among them, Additive A is SPS and 1,4-butynediol mixed according to the weight ratio of 1:2.

[0024] A surface treatment process for improving the corrosion resistance of electrolytic copper foil. Using the above-mentioned surface treatment agent, the roughened and cured electrolytic copper foil with a thickness of 18 μm is placed in an electrolyte tank containing the surface treatment agent, and the pH is controlled to 10.5, the temperature is 45℃, the current density is 3A / dm 2 , The electroplating time is 6s.

Embodiment 3

[0026] A surface treatment agent for improving the corrosion resistance of electrolytic copper foil. Each liter of the surface treatment agent contains: 135g of potassium pyrophosphate, 4g of stannous sulfate, 20g of zinc sulfate, 2g of cerium sulfate and 4mg of additive A;

[0027] Among them, additive A is SPS, formaldehyde and 1,4-butynediol mixed according to the weight ratio of 1:2:2.

[0028] A surface treatment process for improving the corrosion resistance of electrolytic copper foil. Using the above-mentioned surface treatment agent, the roughened and cured electrolytic copper foil with a thickness of 18 μm is placed in an electrolyte tank containing the surface treatment agent, and the pH is controlled to 9.5, the temperature is 40℃, the current density is 2.3A / dm 2 , The electroplating time is 6.5s.

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Abstract

The invention belongs to the technical field of electrolytic copper foil surface treatment, and particularly relates to a surface treatment agent capable of improving corrosion resistance of electrolytic copper foil. The surface of the copper foil is electroplated to form an even and exquisite tin-zinc-cerium ternary alloy composite coating, thus corrosion resistance of the copper foil is improved, and the anti-hydrochloric acid cracking rate of the copper foil can be 2% or below. Rare earth element cerium has 4f layer unfilled electronic structure characteristics, small electronegativity, andhigh chemical affinity, can effectively improve performance of plating liquid of a traditional electroplating process, is prone to generating characteristic adsorption on active points of crystal growth, and hinders too fast discharge of metal ions, and thus a structure of the coating is changed; characteristic adsorption of cerium ions is conducive to negative shifting of cathodic deposition potential, the cathodic polarization effect is improved, too fast discharge of tin and zinc ions can be effectively hindered, and thus the even and exquisite alloy coating is obtained; and a preparationmethod is simple, environmentally friendly and low in cost.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil surface treatment, in particular to a surface treatment agent for improving the corrosion resistance of electrolytic copper foil. Background technique [0002] When domestic enterprises carry out surface treatment on electrolytic copper foil, the barrier layer is mainly treated with zinc. The common galvanizing process can only solve the problem of heat resistance, but cannot completely solve the problem of corrosion resistance of copper foil. In order to solve the corrosion resistance problem of copper foil, some enterprises realize it by forming galvanized alloy on the surface of copper foil. Generally, there are alloy processes such as zinc-nickel, zinc-tin, etc., but because some alloy layers are not crystallized finely and uniformly, corrosion resistance However, the desired effect cannot be achieved, resulting in edge corrosion when etching high-precision lines on copper fo...

Claims

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Application Information

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IPC IPC(8): C25D3/56C25D7/06
CPCC25D3/56C25D7/0614
Inventor 张艳卫王学江孙云飞王其伶王先利范翠玲薛伟
Owner SHANDONG JINBAO ELECTRONICS
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