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Water-soluble soldering flux compound for hot air levelling

A hot air leveling, water-soluble technology, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of mimeograph ion residue, uneven tin surface, poor tin coating, etc., to achieve smooth tin surface, Low odor and excellent tinning effect

Inactive Publication Date: 2020-10-02
东莞市硕美电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the hot air leveling flux commonly used in the market has many disadvantages, such as strong smell, poor tinning after hot air leveling, uneven tin surface, mimeograph ion residue and white oil yellowing, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A water-soluble flux composition for hot air leveling, comprising film forming agent, organic salt, surfactant, organic acid, corrosion inhibitor, inorganic salt, solubilizer, alkaline substance and deionized water. The film-forming agent is a mixture of rosin, organic solvent and polyethylene glycol; the organic salt is organic hydrochloride; the surfactant is polyoxyethylene octylphenol ether, octylphenyl polyoxyethylene ether One or more of nonylphenol polyoxyethylene ether and isomeric alcohol polyoxyethylene ether; the organic acid is tartaric acid , oxalic acid , citric acid , malonic acid, adipic acid, suberic acid and azelaic acid; the corrosion inhibitor is one or more of benzotriazole, methylbenzotriazole and imidazole species; the inorganic salt is one or more of sodium chloride, ammonium chloride and ammonium fluoroborate. Alkaline substances are one or more of organic amines, water-soluble hydroxide salts and carbonate compounds; solubilizers are sod...

Embodiment 2

[0041] The mass fraction of the film-forming agent is 50-70%; the mass fraction of the organic salt is 1-2%; the mass fraction of the surfactant is 0.2-0.4%; the mass fraction of the organic acid is 5-8% %; the mass fraction of the corrosion inhibitor is 0.05-0.1%; the mass fraction of the inorganic salt is 1-2.5%; the mass fraction of the solubilizer is 2-4%; the mass fraction of the alkaline substance 0.5-2%; the pH value of the hot air leveling water-soluble flux composition is 1-2.

[0042] A water-soluble flux composition for hot air leveling is the same as that of Embodiment 1.

[0043] The water-soluble flux composition for hot air leveling has the advantages of simple process, low production cost, low odor, good tinning after hot air leveling, smooth tin surface, no oily ion residue and white oil is not easy to yellow.

Embodiment 3

[0045] The mass ratio of rosin, organic solvent and polyethylene glycol is 1:1:10-1:1:20;

[0046] A water-soluble flux composition for hot air leveling is the same as that of Embodiment 1.

[0047] The water-soluble flux composition for hot air leveling has the advantages of simple process, low production cost, low odor, good tinning after hot air leveling, smooth tin surface, no oily ion residue and white oil is not easy to yellow.

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PUM

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Abstract

The invention discloses a water-soluble soldering flux compound for hot air levelling. The water-soluble soldering flux compound for hot air levelling comprises a film-forming agent, organic salt, a surface-active agent, organic acid, corrosion inhibitor, inorganic salt, a solubilizer, alkaline substances and deionized water. The film-forming agent is a mixture of rosin, an organic solvent and polyethylene glycol. The organic salt is organic hydrochloride salt. The inorganic salt is one or several of sodium chloride, ammonium chloride and ammonium fluoboric acid. The water-soluble soldering flux compound for hot air levelling has the advantages that the technology is simple, and the manufacturing cost is low; and besides, the odor is little, tin feeding after hot air levelling is good, thetin surface is flat, no mimeographed ions are left over, and white oil is not easy to yellow.

Description

technical field [0001] The invention relates to the technical field of flux composition for hot air leveling of circuit boards, in particular to a water-soluble flux composition for hot air leveling. Background technique [0002] Flux for hot air leveling is a chemical substance that can help and promote the soldering process during the soldering process on the surface of the circuit board, and at the same time has a protective effect and prevents oxidation reactions. It mainly assists heat conduction, removes oxides, reduces the surface tension of the material to be welded, and removes the surface of the material to be welded Oil pollution , Increase the welding area, prevent re-oxidation and other aspects. At present, the hot air leveling flux commonly used in the market has many shortcomings, such as strong odor, poor tinning after hot air leveling, uneven tin surface, mimeograph ion residues, and yellowing of white oil, etc. Contents of the invention [0003] The pur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/362
Inventor 裴玉龙辛干超
Owner 东莞市硕美电子材料科技有限公司
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