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Epoxy-modified acrylic resin, preparation method and solvent-type pressure-sensitive adhesive prepared by using the resin

An acrylic resin, pressure-sensitive adhesive technology, applied in the direction of adhesive types, adhesive additives, polymer adhesive additives, etc., can solve the problems of increasing product scrap rate, increasing production costs, etc., and achieve excellent anti-seepage effect, effect of improving weather resistance

Active Publication Date: 2022-03-08
SUZHOU SHIHUA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] At present, the anti-seepage treatment methods of conductive cloth, whether it is a thin coating of water-based polyurethane anti-seepage layer or a thin layer of hard rubber layer on the surface of conductive cloth, have increased the production process of conductive cloth single-sided adhesive or conductive cloth double-sided adhesive. Complexity, which increases the production cost and increases the scrap rate of the product

Method used

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  • Epoxy-modified acrylic resin, preparation method and solvent-type pressure-sensitive adhesive prepared by using the resin
  • Epoxy-modified acrylic resin, preparation method and solvent-type pressure-sensitive adhesive prepared by using the resin
  • Epoxy-modified acrylic resin, preparation method and solvent-type pressure-sensitive adhesive prepared by using the resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] (1) Synthesis of epoxy-modified acrylic resin.

[0036] S1: First use 450g of dipropylene glycol dimethyl ether and 675g of ethyl acetate to dissolve 750g of polyethylene glycol diglycidyl ether epoxy resin to a solid content of 40%, add it to a three-necked flask, and under nitrogen protection, reflux at a constant temperature of 80°C Stir and slowly add 270 g of acrylamide dropwise to prepare epoxy amide resin.

[0037]S2: Add 350g of the above-mentioned epoxy amide resin solution to the three-necked flask, stir at 95°C and reflux the condenser tube, slowly add 30g of isooctyl acrylate, 20g of 2-hydroxypropyl acrylate, 5g of acrylonitrile, 0.8 g BPO initiator mixed solution; after reacting for 1~2H, add 0.2g BPO initiator and keep the temperature for about 2H to obtain epoxy modified acrylic resin solution.

[0038] Weigh the epoxy-modified acrylic resin solution, add ethyl acetate to a solid content of 30%, and add 1% isocyanate curing agent and 0.2% alicyclic amine...

Embodiment 2

[0045] (1) Synthesis of epoxy-modified acrylic resin.

[0046] S1: Dissolve 660g of polyethylene glycol diglycidyl ether epoxy resin in a mixed solvent of 600g of dipropylene glycol dimethyl ether and 940g of ethyl acetate to a solid content of 30%, add it to a three-necked flask, and reflux at a constant temperature of 70°C under nitrogen protection Stir and slowly add 300g of acrylamide dropwise to prepare epoxy amide resin.

[0047] S2: Add the above-mentioned 350g epoxy amide resin solution into the three-necked flask, stir at 85°C and reflux the condenser tube, slowly add 15g of isooctyl acrylate, 20g of 2-hydroxypropyl acrylate, 5g of acrylonitrile, 0.5 g BPO initiator mixed solution; after reacting for 1-2H, add 0.3g of BPO initiator and keep the temperature for about 2H to obtain epoxy-modified acrylic resin.

[0048] (2) Preparation of solvent-based conductive adhesive.

[0049] S1: Weigh 10 kg of ethyl acetate in parts by weight in a clean and normally operating in...

Embodiment 3

[0054] (1) Synthesis of epoxy-modified acrylic resin.

[0055] S1: First use 450g dipropylene glycol dimethyl ether, 675g ethyl acetate mixed solvent to dissolve 625g polyethylene glycol diglycidyl ether epoxy resin to a solid content of 40%, add it to a three-necked flask, under nitrogen protection, reflux at a constant temperature of 75°C Stir and slowly add 320 g of acrylamide dropwise to prepare epoxy amide resin.

[0056] S2: Add the above-mentioned 350g epoxy amide resin solution into the three-necked flask, stir at 90°C and reflux the condenser tube, slowly add 20g of isooctyl acrylate, 20g of 2-hydroxypropyl acrylate, 5g of acrylonitrile, 0.6 g BPO initiator mixed solution; after reacting for 1-2H, add 0.3g of BPO initiator and keep the temperature for about 2H to obtain epoxy-modified acrylic resin.

[0057] (2) Preparation of solvent-based acrylic flame-retardant adhesive.

[0058] S1: Weigh 10 kg of ethyl acetate in parts by weight in a clean and normally operatin...

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Abstract

The invention discloses an epoxy-modified acrylic resin and a preparation method thereof. According to the IR spectrogram analysis of the epoxy-modified acrylic resin, it has stretching vibration peaks of methyl and methylene groups, characteristic peaks of acrylate polymers, and amide The stretching vibration peak of N—H in the middle. The solvent-based pressure-sensitive adhesive prepared by using this resin can improve the weather resistance of the adhesive, and at the same time have the flexibility of acrylic resin and the hardness of epoxy resin. It can be applied to copper foil, conductive cloth, non-woven fabric, In the field of pressure-sensitive adhesives where substrates such as PET have functions such as thermal conductivity, electrical conductivity, or flame retardancy.

Description

technical field [0001] The invention relates to the field of acrylic adhesives, and more specifically relates to an epoxy-modified acrylic resin, a preparation method and a solvent-type pressure-sensitive adhesive prepared by using the resin. Background technique [0002] Conductive cloth material, because of its superior high conductivity, shielding electromagnetic radiation interference, fiber softness and other properties, is widely used in the electronics industry. In terms of human health in the development and application prospects, conductive cloth has become more and more important. Conductive cloth The market continues to grow. [0003] With the development of science and technology, the ultra-thin development trend of electronic products such as mobile phones requires that the materials used tend to be ultra-thin. Especially in the electronics industry, the thickness requirements for conductive fabrics are becoming more and more stringent. Both adhesive and conduc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J151/08C09J9/02C09J11/08C08F283/10C08F220/20C08F220/44C08F220/18
CPCC09J151/08C09J9/02C09J11/08C08F283/105C08F220/20C08F220/44C08F220/1808C08L93/04
Inventor 顾正青曹星星陈启峰周奎任
Owner SUZHOU SHIHUA NEW MATERIAL TECH
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