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Modified polyphenyl ether resin, polyphenyl ether composite material, preparation method thereof and printed circuit board

A polyphenylene ether resin, composite material technology, applied in the direction of printed circuits, printed circuits, circuit substrate materials, etc., can solve the problem of poor results, reduce the heat resistance and dielectric properties of the resin system, and the flame retardancy and resistance of PPO resins. Problems such as poor thermal properties, to achieve the effect of ensuring mechanical properties and dielectric properties

Pending Publication Date: 2021-04-27
LUOYANG INST OF CUTTING EDGE TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, PPO resin has poor flame retardancy and heat resistance
[0004] In order to overcome the problems of poor flame retardancy and heat resistance, the traditional method is to prepare composite materials by adding flame retardants to polyphenylene ether, but with the addition of flame retardants, the heat resistance and dielectric properties of the entire resin system will be reduced. electrical properties
Another method is to try to introduce phosphorus-containing groups into the molecular structure of polyphenylene ether in order to improve the flame retardancy of polyphenylene ether resins. The characteristics of phenylene ether have a negative impact, so more rigid benzene rings are usually introduced at the same time as phosphorus-containing groups, in order to reduce or avoid the introduction of phosphorus-containing groups on the mechanical properties and dielectric properties of polyphenylene ether resin itself. Undesirable Effects of Trait, but Not Good

Method used

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  • Modified polyphenyl ether resin, polyphenyl ether composite material, preparation method thereof and printed circuit board
  • Modified polyphenyl ether resin, polyphenyl ether composite material, preparation method thereof and printed circuit board
  • Modified polyphenyl ether resin, polyphenyl ether composite material, preparation method thereof and printed circuit board

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preparation example Construction

[0063] In one of the specific embodiments, the preparation method of the modified polyphenylene ether resin comprises the following steps:

[0064] Preparation of the monomer 1: dissolving the phosphorus-containing compound in an organic solvent, adding the vinyl-containing alcohol compound under alkaline conditions, and performing a substitution reaction to obtain the monomer 1;

[0065] Preparation of the modified polyphenylene ether resin: mixing the monomer 1 and the polyphenylene ether resin, and performing a substitution reaction under the action of a catalyst.

[0066] In one of the specific embodiments, in the preparation of the monomer 1, the molar ratio of the chlorine group in the phosphorus-containing compound to the hydroxyl group in the vinyl-containing alcohol compound is greater than 1; thus making the The chlorine group in the phosphorus-containing compound will not completely react with the hydroxyl group in the vinyl-containing alcohol compound, so that the ...

Embodiment 1

[0088] This embodiment is a modified polyphenylene ether resin, and its raw materials and preparation methods are as follows:

[0089]

[0090] 1) Dissolve phosphorus oxychloride (15.33g, 0.1mol) in 100mL tetrahydrofuran, stir well under nitrogen atmosphere and ice bath, add triethylamine (32g) and tetrahydrofuran 20mL mixed solution to react for 10 minutes, add dropwise A mixed solution of allyl alcohol (11.62 g, 0.2 mol) and 50 mL of tetrahydrofuran was added dropwise and continued to react for 4 h.

[0091] 2) Then add CuCl (0.03g) into the reaction solution, heat up to 68°C and reflux, add a solution of dihydroxy-terminated polyphenylene ether oligomer SA90 (average molecular weight 1600g / mol, 72g, 0.045mol) and 30mL of tetrahydrofuran to continue React for 4 hours.

[0092] 3) After the reaction is completed, cool to room temperature, and filter the precipitated triethylamine hydrochloride. Rotary evaporation removes residual solvent and unreacted substances, followe...

Embodiment 2

[0094] This embodiment is a modified polyphenylene ether resin, and its raw materials and preparation methods are as follows:

[0095]

[0096] 1) Dissolve pyrophosphoryl chloride (25.17g, 0.1mol) in 100mL tetrahydrofuran, stir well under nitrogen atmosphere and ice bath, add triethylamine (32g) and tetrahydrofuran 20mL mixed solution to react for 10 minutes, add propylene dropwise A mixed solution of alcohol (17.42 g, 0.3 mol) and THF 50 mL was added dropwise and continued to react for 4 h.

[0097] 2) Then add CuCl (0.05g) into the reaction solution, heat up to 68°C and reflux, add a solution of dihydroxy-terminated polyphenylene ether oligomer SA90 (average molecular weight 1600g / mol, 72g, 0.045mol) and 30mL of tetrahydrofuran to continue React for 4 hours.

[0098] 3) After the reaction is completed, cool to room temperature, and filter the precipitated triethylamine hydrochloride. Rotary evaporation removed residual solvent and unreacted substances, followed by deion...

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Abstract

The invention relates to modified polyphenyl ether resin, a polyphenyl ether composite material, a preparation method of the polyphenyl ether composite material and a printed circuit board. The modified polyphenyl ether resin has the structural characteristics shown in the specification. The modified polyphenyl ether resin adopts a phosphorus-containing group only containing one benzene ring or not containing one benzene ring as an end-capping group, and can be crosslinked to form a polyphenyl ether composite material with good flame retardancy and heat resistance, good mechanical properties, low dielectric constant and low dielectric loss.

Description

technical field [0001] The invention relates to polymer materials, in particular to modified polyphenylene ether resin, polyphenylene ether composite material and its preparation method, and printed circuit board. Background technique [0002] With the development of the printed circuit board (PCB) industry, the application field of PCB involves almost all electronic products, mainly including communication, aerospace, consumer electronics, automotive electronics and other industries. In the coming era of 5G communication, high-frequency information transmission prompts electronic circuit design to enter the stage of high-speed information processing and high-frequency signal transmission. Ordinary circuit substrates (copper-clad laminates such as epoxy resin base and cyanate resin) have high-frequency shortcomings such as large high-frequency signal loss, severe heat generation, and unstable transmission, making it difficult to meet the requirements of high-speed informatio...

Claims

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Application Information

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IPC IPC(8): C08G65/335C08G65/337C08L71/12C08L25/10C08L51/00C08K7/18C08K5/5313C08K7/14H05K1/03
CPCC08G65/337C08G65/3353C08L71/126H05K1/0326H05K2201/0145C08L2205/03C08L2201/02C08L2203/20C08L25/10C08L51/003C08K7/18C08K5/5313C08K7/14
Inventor 刘若鹏赵治亚徐志财
Owner LUOYANG INST OF CUTTING EDGE TECH
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