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Preparation method of copper/nickel reactive nano multilayer film

A nano-multi-layer, reactive technology, applied in the direction of plating, coating, and metal material coating technology of superimposed layers, can solve problems such as insufficient strength of welding joints, achieve low cost, simple and convenient preparation method, and excellent welding The effect of stability

Inactive Publication Date: 2021-06-11
NANCHANG HANGKONG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But up to 1725 0 The melting point of C makes it more demanding on production conditions, and there is a disadvantage of insufficient welding strength. Brazing is often used in production, so it is imminent to find a suitable solder

Method used

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  • Preparation method of copper/nickel reactive nano multilayer film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A 2 mm × 50 mm × 2 mm titanium alloy sheet was immersed in acetone, ultrasonically cleaned for 10 min, then rinsed with absolute ethanol, and dried with hot air; then it was put into 20 g / L sodium hydroxide solution for 15 s, then rinse with absolute ethanol and dry with hot air; then put it in an acidic solution for pickling for a few seconds, then rinse with absolute ethanol and dry with hot air. Then put it into the acidic solution for pickling for 10 s, take it out, rinse it with absolute ethanol, and dry it with hot air to obtain a surface-treated titanium alloy sheet; the mass percentage of the acidic solution is composed of: 1.3mol / L 50% nitric acid, 48% hydrofluoric acid with a concentration of 0.4mol / L and 2% deionized water.

[0025] The surface-treated titanium alloy sheet was suspended and immersed in an electroless plating solution with a pH value of 6, and the electroless plating was continued for 60 min at a temperature of 60 °C under stirring conditions ...

Embodiment 2

[0030] According to the form of embodiment 1, the difference lies in that the nickel plating adopts the method of electrodeposition. Its current density is 3.5A / dm 2 Electrochemical deposition of nickel was carried out at room temperature for 40 min; the composition of the electrolyte was: nickel sulfate 70 g / L, sodium citrate 10 g / L, and sodium chloride 120 mg / L.

[0031] In the comparison test, TC4 titanium alloy was used as the upper and lower substrates, TA18 titanium alloy was used as the honeycomb core material, and Ti-Zr-Cu-Ni amorphous foil strip solder was used for vacuum brazing, and the melting point of the solder was 1000 °C. When the welding temperature is 1060℃, the phase transformation of the TA18 titanium alloy honeycomb core occurs, and the grains grow and coarsen. The tensile strength of the brazed joint is 80% of the titanium alloy base metal, and its elongation is 5%.

[0032] However, the melting point of the copper / nickel reactive nano-multilayer film o...

Embodiment 3

[0034] According to the form of embodiment 2, the difference lies in that the nickel plating adopts the method of electrodeposition. Its current density is 4.0 A / dm 2 Electrochemical deposition of nickel at room temperature for 60 min; the composition of the electrolyte is: nickel sulfate 70 g / L, sodium citrate 10 g / L, sodium chloride 120 mg / L, and copper / nickel reactive nano-multilayers can be obtained Membrane solder. The melting point of the nano-multilayer film prepared in this example is 800°C, and vacuum brazing is carried out at 960°C, the brittle intermetallic compounds at the interface of the brazed joint are significantly reduced, and its tensile strength is 93% of that of the titanium alloy base material. Its elongation is 10%. By using the copper / nickel reactive nano-multilayer film as the solder, the performance of the solder joint obtained is obviously better than that of the solder joint obtained by using the Ti-Zr-Cu-Ni amorphous foil strip solder as the sold...

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Abstract

The invention provides a preparation method of a copper / nickel reactive nano multilayer film. Grease and an oxidation film are removed through pretreatment, then a Cu / Ni multilayer film structure arranged in an A-B-A-B manner is prepared through chemical plating and electrochemical deposition methods, then the Cu / Ni multilayer film structure and titanium alloy are stacked together through a press machine to be repeatedly rolled till the multilayer film reaches the nanoscale thickness, and a nickel layer on the outermost layer can well prevent a copper layer from being oxidized and has excellent welding stability. The copper / nickel reactive nano multilayer film is easy and convenient to prepare, the performance of the copper / nickel reactive nano multilayer film can be changed by controlling preparation parameters, the controllability of the coating thickness and the reaction temperature is high, the brazing temperature can be effectively reduced, the strength of a brazed joint is greatly improved, the cost is lower, the influence on the environment is smaller, and the copper / nickel reactive nano multilayer film is suitable for industrial production, serves as titanium alloy brazing filler metal, and has wide application prospects in aerospace, military industry and 3D integrated circuits.

Description

technical field [0001] The invention relates to a method for preparing a copper / nickel reactive nanometer multilayer film, and specifically belongs to the technical field of material micro-nano connection. Background technique [0002] Titanium alloys have high specific strength, good heat resistance and corrosion resistance, and are widely used as structural materials in the aerospace field. But up to 1725 0 The melting point of C makes it more demanding on production conditions, and there is a disadvantage of insufficient welding strength. Brazing is often used in production, so it is imminent to find a suitable solder. [0003] Reactive nano-multilayer film is a new type of energetic material, which can induce self-propagating reaction at low temperature, and can obtain more than 1000 0 The high temperature of C, the reaction wave propagation speed is as high as 100m / s, and the brazing and diffusion welding connection of microelectronic chips, metal and non-metal (ceram...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/02C23C18/16C23C18/18C23C18/32C25D3/38C25D5/48
CPCC23C28/023C23C18/32C23C18/1844C23C18/1653C25D3/38C25D5/48
Inventor 殷祚炷周东鹏薛名山袁锋李坚罗一丹谢宇洪珍谢婵
Owner NANCHANG HANGKONG UNIVERSITY