Method and device for light etching micrometer structure of smooth surface

Abstract

This invention discloses a method for photo-etching smooth surfaces, which takes a large power laser as the light source, collimates the laser beams to parallel lights to pass through diaphragms and a lens to generate split light beams by a splitting element to be gathered on a material surface to form a uniform interference fringe optical field then carries out photo-etching exceeding the material harmful threshold value on the surface of the smooth material characterizing that three or four multiplications of a large power solid laser pumped by diode output by ultraviolet rays are applied as the light source, said diaphragm is an adjustable rectangle and single time pulse process is done at a same position to control the power of the laser so that the material of the interference fringe light-intensity additive position is gasified to form a fringe structure on the surface of the material and mum-stage fringe high speed laser system is realized by this method.

Description

technical field [0001] The invention relates to the processing of a hard smooth surface, in particular to a method for forming a micron-scale grating image on a smooth surface by laser etching, and a high-speed laser photoetching device for realizing the method. Background technique [0002] In order to adapt to the industrialization of high-tech in the 21st century and meet the needs of micro-manufacturing, it is imperative to research and develop high-performance advanced laser processing technology. As a branch of laser processing, laser micromachining has been widely concerned in the past ten years. As one of the unit micromachining technologies in the microelectronics integration process, it has now formed a fixed model and has been put into large-scale production. Laser wavelengths range from far infrared to X-rays, and are currently mainly used in the three major fields of microelectronics, micromechanics and micro-optical processing. Due to...

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Problems solved by technology

[0007] (1) In order to obtain a high-energy-density light spot, high energy density is mainly formed by focusing a single beam. When the pulsed laser with a wavelength of 1060nm and 532nm processes the surface of a material (such as a metal), the material has a low absorption rate of light and the thermal effect is very obvious. During processing, the material is ablated by locally generating high temperature, and a large amount of light energy is converted into heat energy, forming a crater effect; thus, the minimum light spot is generally around 30-50 μm, which cannot be focused into a thinner beam, and the processing accuracy limited

[0008] (2) In order to obtain a high average power laser output, the laser beam used is a multi-transverse mode spot, and the spot quality is poor (M 2 <10), the coherence length of the beam is extremely short, and beam interference cannot be formed. Therefore, the multi-mode laser beam cannot produce high-quality micron-scale lines (stripes)

[0015] 3. Due to the thermal effect during laser processing, the multi-pulse continuous laser processing method commonly used at present will produce a "crater" effect, which cannot meet the requirements of micron-scale grating photoetching

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