Spatially-arranged chemical processing station

a chemical processing station and spatial arrangement technology, applied in the direction of movable spraying apparatus, basic electric elements, coatings, etc., can solve the problems of void formation in metal lines, the size of features must be scaled downward, and the delay of interconnection related time becomes the major limitation, so as to achieve the smallest possible equipment size, the effect of reducing the cost and increasing the system reliability
US20070051306A1Inactive Publication Date: 2007-03-08LAM RES CORP
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
LAM RES CORP
Publication Date
2007-03-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention discloses a station, e.g., for IC fabrication with a flexible configuration. It consists of an array of processing chambers, which are grouped into processing modules and arranged in a two-dimensional fashion, in vertical levels and horizontal rows, and is capable of operating independent of each other. Each processing chamber can perform electroless deposition and other related processing steps sequentially on a wafer with more than one processing fluid without having to remove it from the chamber. The system is served by a single common industrial robot, which may have a random to access to all the working chambers and cells of the storage unit for transporting wafers between the wafer cassettes and inlet / outlets ports of any of the chemical processing chambers. The station occupies a service-room floor space and a clean-room floor space. The processing modules and the main chemical management unit connected to the local chemical supply unit occupy a service-room floor space, while the robot and the wafer storage cassettes are located in a clean room. Thus, in distinction to the known cluster-tool machines, the station of the invention makes it possible to transfer part of the units from the expensive clean-room area to less-expensive service area.
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Description

FIELD OF THE INVENTION

[0001] The present invention relates to semiconductor manufacturing equipment. More particularly, the invention relates to a spatially-arranged station for deposition from liquid media, e.g, to an electroless deposition station that contains a plurality of individual and independently operating chemical processing chambers served by a common workpiece handling unit. The station of the present invention may find use in the mass production of high density interconnect for integrated circuits. BACKGROUND OF THE INVENTION

[0002] In present ULSI (ultra-large-scaled-integration) structures, high circuit speed, high packing density and low power dissipation are essential. As a result, feature sizes must be scaled downward, and the interconnect related time delays become the major limitation. Elemental aluminum and its alloys have been the traditional metals used to form lines and plugs in IC's; however, aluminum has a relatively high resistivity and its electromigrat...

Claims

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