Electronic Assemblies without Solder and Methods for their Manufacture

Abstract

The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of PCT Application No. PCT / US08 / 63123 filed on May 8, 2008 which claimed priority to: “ELECTRONIC ASSEMBLY WITHOUT SOLDER,” U.S. application Ser. No. 60 / 928,467, filed on May 8, 2007; “ELECTRONIC ASSEMBLY WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE,” U.S. application Ser. No. 60 / 932,200, filed on May 29, 2007; “SOLDERLESS FLEXIBLE ELECTRONIC ASSEMBLIES AND METHODS FOR THEIR MANUFACTURE,” U.S. application Ser. No. 60 / 958,385, filed on Jul. 5, 2007; “ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE,” U.S. application Ser. No. 60 / 959,148, filed on Jul. 10, 2007; “MASS ASSEMBLY OF ENCAPULSATED ELECTRONIC COMPONENTS TO A PRINTED CIRCUIT BOARD BY MEANS OF AN ADHESIVE LAYER HAVING EMBEDDED CONDUCTIVE JOINING MATERIALS,” U.S. application Ser. No. 60 / 962,626, filed on Jul. 31, 2007; “SYSTEM FOR THE MANUFACTURE OF ELECTRONIC ASSEMBLIES WITHOUT SOLDER,” U.S. application Ser. No. 60 / 963,8...

AI Technical Summary

Benefits of technology

[0019]The assembly, built with a novel reverse-interconnection process (RIP), uses no solder, thus bypassing the use of lead, tin, and heat associated problems. The term “reverse” refers to the reverse order of assembly; components are placed first and then circuit layers manufactured rather than creating a PCB first and then mounting components. No conventional PCB is required (although one may be optionally integrated), shortening manufacturing cycle time, reducing costs and complexity, and lessening PCB reliability problems.

[0020]RIP products are robust with respect to mechanical shock and thermal cycle fatigue failure. I

Problems solved by technology

Lead is a highly toxic substance, exposure to which can produce a wide range of well known adverse health effects.

Of importance in this context, fumes produced from soldering operations are dangerous to workers.

Each of these constituents has been shown to be potentially hazardous.

Mining lead can contaminate local ground water supplies.

Smelting can lead to factory, worker, and environmental contamination.

Because of the difficulty and cost of recycling used electronics, as well as lax enforcement of legislation regarding waste exports, large amounts of used electronics are sent to countries such as China, India, and Kenya, which have lower environmental standards and poorer working conditions.

Thus, there are marketing and legislative pressures to reduce tin/lead solders.

RoHS does not eliminate the use of lead in all electronic devices.

SAC solders also have significant environmental consequences.

For example, mining tin is disastrous both locally and globally.

Perhaps the most serious environmental impact of mining tin in Brazil is the silting up of rivers and creeks.

This degradation modifies forever the profile of animal and plant life, destroys gene banks, alters the soil structure, introduce

Images