Insulated thermal interface material

Abstract

The present invention discloses an insulated thermal interface material for applying between an electronic element and a thermal dissipating element. The insulated thermal interface material at least comprises a base, a first filler and a second filler. The base is a polymer and the first filler is graphene. The first filler and the second filler are dispersed in the base.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). [101116708] filed in Taiwan, Republic of China [May 10, 2012], the entire contents of which are hereby incorporated by reference.FIELD OF THE INVENTION[0002]This invention relates to an insulated thermal interface material, especially relates to an insulated thermal interface material manufactured by dispersing graphene into a polymer to enhance its conductivity and insulation.BACKGROUND OF THE INVENTION[0003]The electronic technique has been developed rapidly in recent years. The high-frequency and high-speed of electronic component, as well as the dense and microminiaturization of the integrated circuit, results in an enormously increasing of the heating value from unit volume of electronic component. It is an urgent issue of cooling the electronic component to maintain the performance of electronic parts. According to the abovementione...

AI Technical Summary

Benefits of technology

[0014]According to the abovementioned disadvantages of the prior art, such as the thermal conductive filler rises the cost of the thermal interface material (eg. lots of thermal conductive filler is needed), heat deterioration (eg. poor heat resistance), surface seepage (eg. poor moisture tolerance) or some limitation between the conductors (eg. epoxy resin) of the thermal interface material, the present invention provides a thermal interface material filled with graphene which could effectively conduct the heat generated by an electronic element to the outside of the thermal dissipating element, moreover, it possesses great electrical insulating property which could be widely used in electric and electronic area, for example, to be used as CPU and thermal dissipating element of high-power transistor chip.

Problems solved by technology

It is an urgent issue of cooling the electronic component to maintain the performance of electronic parts.

However, it will cause problems because of decreasing too much thickness, such as decreasing of the strength, durability and / or electric insulating property of thermal dissipating element.

However, the adhesion between outer and inner layers of those multilayer insulating components are unstable, meaning the duration of component is bad and peeling is inevitable as time goes by.

However, the thermal conductivity of the inner layer formed by aromatic polyimides is obviously less than that of the outer layer formed by silicon rubber, which decreases the overall thermal conductivity of the complex.

(1) High filling content is needed for silicon dioxide due to low thermal conductivity. However, the hardness of conductive subject of the thermal interface material is hard to be decreased with high filling content, and molding could not be performed due to excessive viscosity.

(2) Aluminum oxide and aluminum is amphoteric compound which is easily affected by the inner impurities. When the conductive subject of the thermal interface material is epoxy resin, it would have bad influence on heat resistance and permanent deformation by compression.

(3) Zinc oxide is usually precipitated and sedimented when dispersing in the conductive subject of the thermal interface material because it possesses high specific gravity of 5.7, and the high hygroscopicity of zinc oxide powder is undesired.

(4) Silicon carbide also has high specific gravity. The refining silicon carbide powder sold on the current market tends to aggregate and sediment when dispersing in the conductive subject, such as silicon rubber, of the thermal interface material. Silicon carbide is hard to be re-dispersed and processed because it tends to agglomerate.

(5) Silicon nitride and aluminum nitride is easily reacting with water resulting in worst wet fastness.

(6) Magnesium oxide is optional high thermal conductive filler, but it is similar to aluminum nitride which is easily reacting with water resulting in worst wet fastness.

(7) Magnesium carbonate is not stable and tends to decompose into magnesium oxide under high temperature.

Images